K4B4G1646E-BYMA vs AS4C256M16D3L-12BCNTR Comparison
Detailed side-by-side comparison of K4B4G1646E-BYMA by Samsung Electronics and AS4C256M16D3L-12BCNTR by Alliance Memory. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Alliance Memory
AS4C256M16D3L-12BCNTR - 4Gbit DDR3L SDRAM 96-FBGA | Alliance Memory
AS4C256M16D3L-12BCNTR ✓ ActiveSpecification Comparison
| Parameter | K4B4G1646E-BYMA | AS4C256M16D3L-12BCNTR |
|---|---|---|
| Brand | Samsung Electronics | Alliance Memory |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.32 | $6.00 |
| Memory Type | DDR3L SDRAM | SDRAM - DDR3L |
| Density | 4 Gb | — |
| Organization | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V (1.28 V to 1.575 V) | 1.283V ~ 1.45V |
| Clock Frequency | 933 MHz | 800 MHz |
| Data Rate | 1866 Mbps/pin | — |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C |
| Operating Current | 14 mA | — |
| Standby Current | 2 mA, 3 mA | — |
| Package | FBGA-96 | 96-FBGA (9x13mm) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS | Compliant | — |
| CAS Latency | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS Latency] |
| Burst Length | [DATA_NEEDED: Burst Length] | — |
| Number of Pins | 96 | — |
| Memory Size | — | 4Gbit (256M x 16) |
| Interface | — | Parallel |
| Access Time | — | 20 ns |
| Data Bus Width | — | 16 bit |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |
| Supply Current | — | [DATA_NEEDED: Supply Current] |