AS4C256M16D3L-12BCNTR - 4Gbit DDR3L SDRAM 96-FBGA | Alliance Memory
MPN: AS4C256M16D3L-12BCNTR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $6 | $6,000.00 |
Drop-in alternatives for AS4C256M16D3L-12BCNTR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AS4C256M16D3L-12BINTR
✅ Drop-In📋 Reference alternative (not in catalog)
AS4C256M16D3L-12BCN
✅ Drop-In✓ 99,999 In Stock
$6 / Unit
View Datasheet →MT41K256M16HA-125
✅ Drop-In✓ 99,999 In Stock
$5.6 / Unit
View Datasheet →IS43TR16512BL-125K
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →AS4C256M16D3L-12BCNTR Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM - DDR3L |
| Memory Size | 4Gbit (256M x 16) |
| Interface | Parallel |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
| Supply Voltage | 1.283V ~ 1.45V |
| Operating Temperature | 0°C to +95°C |
| Package | 96-FBGA (9x13mm) |
| Mounting Type | Surface Mount |
| Data Bus Width | 16 bit |
| Organization | 256M x 16 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Supply Current | [DATA_NEEDED: Supply Current] |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
AS4C256M16D3L-12BCNTR Pin Configuration
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply (1.35V) |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AS4C256M16D3L-12BCNTR is suitable for 6 applications: Networking Equipment, Embedded Systems, Servers and Workstations, Test and Measurement, Industrial Automation, Consumer Electronics.
Networking Equipment
The AS4C256M16D3L-12BCNTR provides high-density, low-power memory for routers, switches, and network appliances. Its 4Gbit capacity and 800 MHz clock speed support high-throughput packet processing and buffering. The 1.35V operation reduces power consumption in always-on network devices, while the 96-FBGA package fits compact line cards. The parallel interface simplifies integration with network processors and FPGAs, enabling efficient data transfer for routing tables and packet queues.
Recommended
Embedded Systems
This DDR3L SDRAM is ideal for embedded systems requiring large memory footprints, such as industrial PCs, medical devices, and point-of-sale terminals. The 4Gbit density supports complex operating systems and applications, while the 1.35V supply minimizes power dissipation in battery-backed or thermally constrained designs. The 16-bit data bus balances bandwidth and pin count, and the 96-FBGA package allows for compact PCB layouts. The commercial temperature range covers typical indoor environments, and the RoHS compliance meets environmental regulations.
Recommended
Servers and Workstations
The AS4C256M16D3L-12BCNTR is suitable for entry-level servers and workstations where high-capacity, low-power memory is needed. Its 4Gbit density and 800 MHz clock speed provide adequate bandwidth for virtualization, database caching, and compute-intensive tasks. The 1.35V operation reduces total system power, contributing to energy-efficient data centers. The parallel interface and 16-bit organization allow flexible memory channel configurations. The 96-FBGA package is standard for DDR3L modules, ensuring compatibility with existing PCB designs.
Recommended
Test and Measurement
In test and measurement equipment, the AS4C256M16D3L-12BCNTR provides high-speed data storage for waveform capture, signal analysis, and data logging. The 800 MHz clock and 20 ns access time enable fast data acquisition, while the 4Gbit capacity allows long recording durations. The low 1.35V supply reduces heat generation in benchtop instruments, and the 96-FBGA package fits compact module designs. The commercial temperature range is adequate for laboratory environments, and the RoHS compliance supports green initiatives.
Recommended
Industrial Automation
The AS4C256M16D3L-12BCNTR is used in industrial automation for PLCs, robotics, and HMI systems that require reliable, high-capacity memory. The 4Gbit density supports complex control algorithms and data logging, while the 1.35V operation reduces power consumption in 24V-powered systems. The 800 MHz clock speed ensures fast data access for real-time control loops. The 96-FBGA package is robust for industrial environments, and the commercial temperature range covers typical factory floor conditions. The RoHS compliance meets industrial environmental standards.
Recommended
Consumer Electronics
This DDR3L SDRAM is suitable for consumer electronics such as smart TVs, set-top boxes, and gaming consoles, where high bandwidth and low power are essential. The 4Gbit capacity supports multimedia streaming and gaming applications, while the 1.35V supply extends battery life in portable devices. The 800 MHz clock speed provides smooth video playback and responsive user interfaces. The 96-FBGA package enables slim device designs, and the commercial temperature range covers typical home use. The RoHS compliance meets consumer safety regulations.
Recommended
Recommended Products Summary
Engineering reference data for AS4C256M16D3L-12BCNTR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AS4C256M16D3L-12BINTR | AS4C256M16D3L-12BCN | AS4C256M16D3LC-12BCNTR | MT41K256M16HA-125 | IS43TR16512BL-125K | K4B4G1646E-BYMA |
|---|---|---|---|---|---|---|---|
| Package | 96-FBGA (9x13mm) | 96-FBGA (9x13mm) - same | 96-FBGA (9x13mm) - same | 96-FBGA (7.5x13.5mm) - different | 96-FBGA (9x13mm) - same | 96-FBGA (9x13mm) - same | 96-FBGA (9x13mm) - same |
| Brand | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Micron Technology | ISSI | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Clock Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Supply Voltage | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V |
| Operating Temperature | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Data Bus Width | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low-voltage operation at 1.35V (vs Standard DDR3 at 1.5V)
- High-density 4Gbit in 96-FBGA (vs AS4C256M16D3LC-12BCNTR (7.5x13.5mm))
- Drop-in replacement for standard DDR3L (vs Cross-brand equivalents)
Design Notes
Place 0.1uF decoupling capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the power entry. Follow the layout guidelines in the Alliance Memory datasheet to minimize trace lengths for DQ and address lines, ensuring signal integrity at 800 MHz.
The AS4C256M16D3L-12BCNTR operates up to +95°C. Ensure adequate airflow or heatsinking in high-temperature environments. The 1.35V supply reduces power dissipation, but verify the thermal profile in your system.
Do not exceed the supply voltage range of 1.283V to 1.45V. Ensure the VREF voltage is properly generated and decoupled. Incorrect termination of address/control lines can cause data corruption. Refer to the datasheet for ODT settings.
Compliance Information
RoHS compliant per distributor listings. Lead-free confirmed. Other compliance details not specified in provided data.
