MPC885CZP66 vs MPC880CZP66 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC885CZP66 disebabkan oleh NXP Semiconductors dan MPC880CZP66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP
MPC880CZP66 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC885CZP66 | MPC880CZP66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | MPC8xx (PowerQUICC) |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32 bit | 32 bit |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| Tegangan Pemberi Arus | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | 357-PBGA (25x25 mm) |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| Suhu Operasi | -40C to +100C | — |
| Terminal Form | Ball | Ball |
| Package Code | BGA | BGA (Plastic Ball Grid Array) |
| Package Shape | Square | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Non-compliant (Sn/Pb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Category | — | Microprocessors - MPU |
| Core | — | MPC8xx (PowerPC) |
| Frekuensi Klock Maksimum | — | 66.67 MHz |
| Nominal Supply Voltage | — | 1.8 V |
| Number of Terminals | — | 357 |
| Terminal Finish | — | Tin/Lead (Sn/Pb) - non-RoHS |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: extended industrial or commercial range] |