MPC885CZP66 vs MPC880CZP66 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC885CZP66 sa pamamagitan ng NXP Semiconductors at MPC880CZP66 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP
MPC880CZP66 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC885CZP66 | MPC880CZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | MPC8xx (PowerQUICC) |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| Width ng Data Bus | 32 bit | 32 bit |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| Volte ng Pagbibigay | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | 357-PBGA (25x25 mm) |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| Temperature na Operasyon | -40C to +100C | — |
| Terminal Form | Ball | Ball |
| Package Code | BGA | BGA (Plastic Ball Grid Array) |
| Package Shape | Square | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Non-compliant (Sn/Pb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Category | — | Microprocessors - MPU |
| Core | — | MPC8xx (PowerPC) |
| Maksimum na Taktiko ng Oras | — | 66.67 MHz |
| Nominal Supply Voltage | — | 1.8 V |
| Number of Terminals | — | 357 |
| Terminal Finish | — | Tin/Lead (Sn/Pb) - non-RoHS |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: extended industrial or commercial range] |