MC9S08SH4MPJ vs MC9S08QD4CSC Vergleich
Detaillierter Direktvergleich von MC9S08SH4MPJ von NXP Semiconductors und MC9S08QD4CSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20
MC9S08SH4MPJ ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MC9S08SH4MPJ | MC9S08QD4CSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,50 | $0,00 |
| Core | HCS08 (enhanced 8-bit) | — |
| CPU Architecture | CISC, HC08 instruction set with BGND | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Flash Memory | 4 KB | — |
| RAM | 256 B | 256 B |
| Versorgungsspannung | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Betriebstemperatur | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| ADC | 12-channel, 10-bit, 2.5 us conversion time | — |
| Interner Temperatursensor | Yes | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Interrupt Sources | Up to 32 | — |
| Gehäuse | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) | 8-SOIC |
| Montageart | Through-Hole (THT) | Surface Mount |
| Temperature Grade | Automotive | — |
| Compatibility Family | S08SH, software/tool compatible with S08SG | — |
| Debug | Background Debug Mode (BGND) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximale Taktfrequenz | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |