MC9S08SH4MPJ vs MC9S08QD4CSC 比較
詳細並排比較 MC9S08SH4MPJ 由 NXP Semiconductors 與 MC9S08QD4CSC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08SH4MPJ | MC9S08QD4CSC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Core | HCS08 (enhanced 8-bit) | — |
| CPU Architecture | CISC, HC08 instruction set with BGND | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Flash Memory | 4 KB | — |
| RAM | 256 B | 256 B |
| 供應電壓 | 2.7 V to 5.5 V | 3.3 V / 5 V |
| 工作溫度 | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| ADC | 12-channel, 10-bit, 2.5 us conversion time | — |
| 內建溫度感測器 | Yes | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Interrupt Sources | Up to 32 | — |
| 封裝 | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) | 8-SOIC |
| 安裝類型 | Through-Hole (THT) | Surface Mount |
| Temperature Grade | Automotive | — |
| Compatibility Family | S08SH, software/tool compatible with S08SG | — |
| Debug | Background Debug Mode (BGND) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| 最大時脈頻率 | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |