MC9S08SH4MPJ vs MC9S08QD4CSC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08SH4MPJ disebabkan oleh NXP Semiconductors dan MC9S08QD4CSC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20
MC9S08SH4MPJ ✗ Akhir Hayat
Pengandingan Spesifikasi
| Parametr | MC9S08SH4MPJ | MC9S08QD4CSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Core | HCS08 (enhanced 8-bit) | — |
| CPU Architecture | CISC, HC08 instruction set with BGND | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Flash Memory | 4 KB | — |
| RAM | 256 B | 256 B |
| Tegangan Pemberi Arus | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Suhu Operasi | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| ADC | 12-channel, 10-bit, 2.5 us conversion time | — |
| Pemantau Suhu Dalam | Yes | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Interrupt Sources | Up to 32 | — |
| Kemasan | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) | 8-SOIC |
| Jenis Pemasangan | Through-Hole (THT) | Surface Mount |
| Temperature Grade | Automotive | — |
| Compatibility Family | S08SH, software/tool compatible with S08SG | — |
| Debug | Background Debug Mode (BGND) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frekuensi Klock Maksimum | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |