10AX115N2F45I2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN: 10AX115N2F45I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10875.87 | $10,875.87 |
| 10 | $10250 | $102,500.00 |
| 100 | $9650 | $965,000.00 |
| 500 | $9100 | $4,550,000.00 |
| 1,000 | $8750 | $8,750,000.00 |
10AX115N2F45I2LG Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect, and I/O cells that an engineer can configure after manufacturing to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and structured ASICs, distinguished from ASICs by their re-programmability and from CPLDs by much higher logic density, on-chip memory, and high-speed transceiver capability. The Arria 10 GX family specifically targets mid-range, transceiver-rich applications such as wireless baseband, broadcast video, image processing, and high-performance DSP pipelines where both high logic capacity and multi-gigabit serial links are required.
Key parametric features of the 10AX115N2F45I2LG include 1,150,000 logic elements organized into 427,200 adaptive logic modules (ALMs), 52.99 Mbit of embedded memory, 768 maximum user I/Os, and integrated multi-gigabit transceivers supporting protocols such as PCI Express Gen3, 10 Gigabit Ethernet, and serial RapidIO. The device operates from a 0.9 V core supply (with the broader Arria 10 system requiring multiple auxiliary rails), supports the industrial temperature range (-40 C to +100 C ambient at the case), and is offered in the N2F45 package variant of the 1932-ball FCBGA family.
Architecturally, Arria 10 GX uses a heterogeneous fabric combining core logic, variable-precision DSP blocks (supporting fixed-point and floating-point arithmetic), embedded M20K memory blocks, and hardened protocol IP such as PCI Express Gen3 hard IP and 100G Ethernet MACs. The 20 nm process enables higher integration and lower dynamic power than the prior 28 nm Arria V generation, while the monolithic die approach maintains timing closure advantages over multi-die equivalents.
Typical applications include high-performance DSP coprocessors, radar and beam-forming front-ends for defense and 5G baseband, medical imaging accelerators (CT, ultrasound, MRI pre-processing), broadcast video processing (4K/8K SDI), and ASIC prototyping. Designers select this part when they need transceiver-rich FPGA fabric at densities above 1M LE with industrial-grade temperature support.
When laying out a board, ensure the 1932-ball FCBGA is paired with a high-layer-count PCB (typically 12+ layers), controlled-impedance routing for transceiver channels, and a power-delivery network sized for the Arria 10 SmartVID current profile. Decoupling must follow the manufacturer's pinout map; power-rail sequencing and SmartVID controller configuration are mandatory in the reference schematic.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 GX family, and practical design notes not collected in any single manufacturer datasheet.
Drop-in alternatives for 10AX115N2F45I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AX115N2F45I2LG (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Temperature Grade, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F45I2SG
✅ Drop-In✓ In Stock
$5760 / Unit
View Datasheet →10AX115N2F45E2LG
✅ Drop-In✓ In Stock
$7580.55 / Unit
View Datasheet →10AX115N2F45E2SG
✅ Drop-In✓ In Stock
$3570 / Unit
View Datasheet →10AX115N2F45I1SG
✅ Drop-In✓ In Stock
$7150 / Unit
View Datasheet →10AX115N2F45E1SG
✅ Drop-In✓ In Stock
$6240 / Unit
View Datasheet →10AX115N2F45I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 LE |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Embedded Memory (Bits) | 68,857,856 bits |
| Embedded Memory (Mbit) | 52.99 Mbit |
| Maximum User I/O | 768 |
| Package | 1932-ball FCBGA (N2F45) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Temperature Grade | Industrial (-40C to +100C case) |
| Mounting Type | Surface Mount (BGA) |
| Number of Terminals | 1932 |
| Terminal Form | Ball |
| Package Shape | Square |
| RoHS Status | Compliant |
10AX115N2F45I2LG square Pin Configuration Guide
Pin configuration for 10AX115N2F45I2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N2F45I2LG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AX115N2F45I2LG is suitable for 6 applications: 5G Baseband and Radio DSP, Medical Imaging Accelerator (CT / Ultrasound / MRI), Broadcast Video Processing (4K/8K SDI / HDR), ASIC Prototyping and Emulation, Radar and Beam-Forming Front-End, Industrial Machine Vision and Inspection.
5G Baseband and Radio DSP
The 10AX115N2F45I2LG fits 5G baseband and radio DSP because its 1,150,000 logic elements and integrated multi-gigabit transceivers deliver the parallel compute density required for LDPC, polar, and FFT processing at sub-6 GHz and mmWave carrier frequencies. The 427,200 ALMs map cleanly onto vectorized DSP pipelines, while the 52.99 Mbit embedded memory buffers incoming antenna samples between FFT stages with predictable latency. Per Intel's Arria 10 GX datasheet the 28.05 Gbps transceivers support CPRI and eCPRI backhaul links, making the device a strong fit for massive-MIMO baseband cards. Industrial temperature grade permits outdoor remote-radio-head deployment without additional thermal management beyond a heatsink.
Recommended
Medical Imaging Accelerator (CT / Ultrasound / MRI)
The 10AX115N2F45I2LG suits CT, ultrasound, and MRI image pre-processing because the 20 nm Arria 10 GX fabric delivers the throughput needed for back-projection, beamforming, and Fourier reconstruction in real time. The 427,200 ALMs pair with the variable-precision DSP blocks to process 16-bit fixed-point and floating-point data simultaneously, while the 52.99 Mbit embedded memory holds line buffers and kernel windows for sustained 4K image rates. According to the manufacturer datasheet, the hardened PCI Express Gen3 IP enables direct attachment to host CPUs, removing a discrete bridge chip. Industrial temperature grade supports the equipment-room thermal envelope without derating.
Recommended
Broadcast Video Processing (4K/8K SDI / HDR)
The 10AX115N2F45I2LG is well-matched to 4K and 8K broadcast video processing pipelines because the 1.15M-LE fabric handles multi-channel SDI de/embedding, HDR tone mapping, and frame-rate conversion in a single device. The embedded transceivers drive 12G-SDI links at the 11.88 Gbps rate specified in SMPTE ST 2082, and the 768 user I/Os accommodate parallel pixel buses plus ancillary data paths. Intel's Arria 10 GX datasheet documents the video IP suite and reference designs for end-of-frame processing. Industrial temperature grade supports the typical broadcast-rack ambient of 45 C with margin.
Recommended
ASIC Prototyping and Emulation
The 10AX115N2F45I2LG is a strong ASIC prototyping platform because the 1,150,000 LE fabric maps directly to ASIC gate counts in the 15-20 million ASIC-gate range when using LUT-based partitioning. The 52.99 Mbit embedded memory serves as transaction-log and scoreboard storage for verification IP, while the multi-gigabit transceivers emulate SERDES interfaces of the target ASIC. The industrial temperature grade also allows the prototyping system to sit in standard lab environments without special cooling. Intel's Arria 10 GX documentation provides synthesis flow guidelines for prototyping ASIC RTL with high utilization.
Recommended
Radar and Beam-Forming Front-End
The 10AX115N2F45I2LG suits radar and beam-forming front-ends because the transceiver-rich Arria 10 GX fabric ingests multiple ADC channels at sample rates up to the documented transceiver ceiling while the DSP blocks perform digital down-conversion and beam steering. The 768 user I/Os permit fan-out to multiple ADC/DAC devices, and the 52.99 Mbit embedded memory stores chirp parameters and pulse-compression tables. The industrial temperature grade supports outdoor phased-array enclosures. Intel's Arria 10 GX reference designs include JESD204B/C interface IP that integrates cleanly with the device's serial transceivers.
Recommended
Industrial Machine Vision and Inspection
The 10AX115N2F45I2LG fits industrial machine vision because its 1.15M-LE logic capacity and 52.99 Mbit embedded memory handle multi-camera defect-detection pipelines at line rate. The PCI Express Gen3 hard IP connects to host PCs at 8 Gbps lane rates for high-throughput image offload, while the on-chip DSP blocks accelerate convolutional filters for inline inspection. The industrial temperature grade (-40 C to +100 C case) supports factory-floor enclosures, and the 768 user I/Os accommodate Camera Link, CoaXPress, and GigE Vision channel aggregation. Intel's Arria 10 GX datasheet documents the vision IP and reference designs for these protocols.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F45I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F45I2SG | 10AX115N2F45E2LG | 10AX115N2F45E2SG | 10AX115N2F45I1SG | 10AX115N2F45E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (N2F45) | 1932-ball FCBGA (N2F45) - same | 1932-ball FCBGA (N2F45) - same | 1932-ball FCBGA (N2F45) - same | 1932-ball FCBGA (N2F45) - same | 1932-ball FCBGA (N2F45) - same |
| Logic Elements | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE |
| Adaptive Logic Modules | 427,200 ALM | 427,200 ALM | 427,200 ALM | 427,200 ALM | 427,200 ALM | 427,200 ALM |
| Embedded Memory | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit |
| Maximum User I/O | 768 | 768 | 768 | 768 | 768 | 768 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) |
| Speed Grade | 2 | 2 | 2 | 2 | 1 (slower) | 1 (slower) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Same die and bitstream across all N2F45 1150-GX variants (vs 10AX090N2F45I2LG)
- Industrial temperature vs extended-temperature in identical package (vs 10AX115N2F45E2LG)
- Speed grade 2 performance headroom over speed grade 1 (vs 10AX115N2F45I1SG)
Design Notes
Estimated: The 1932-ball FCBGA at 1.0 mm pitch requires a high-layer-count PCB (typically 12+ layers) with laser-drilled microvias and via-in-pad for breakout routing. Reference Intel's Arria 10 GX pin-out file for ball-map coordinates and route the transceiver lanes with 85-ohm differential impedance on the top layers before transitioning to internal stripline. Decoupling capacitor placement must follow the manufacturer's PDN recommendation with 0402 or 0201 ceramics within 100 mils of each power ball.
Estimated: At maximum utilization (1.15M LE, full transceiver engagement) the 10AX115N2F45I2LG draws tens of amps on the 0.9 V core rail. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet for board-level sizing and provision a SmartVID controller. Power-rail sequencing must follow the Arria 10 GX pin-out sequence; out-of-order ramp-up can latch-up the device. Bulk decoupling should target 4-6 x 470 uF polymer plus 20-30 x 22 uF ceramic per the reference schematic.
Industrial temperature grade (-40 C to +100 C case) does not waive thermal management. At ~20 W typical core dissipation and the 1932-ball FCBGA's modest top-side heat-slug, attach a heatsink with thermal interface material rated at <=0.1 C/W. For enclosed enclosures, provide 100 LFM minimum airflow; the FPGA thermal model in Intel's Arria 10 GX datasheet assumes this baseline and derates above it.
Do not confuse 10AX115N2F45I2LG (industrial, speed grade 2, large tray) with 10AX115N2F45E2LG (extended temperature, speed grade 2) or 10AX115N2F45I1SG (industrial, speed grade 1, standard packing). All share the same 1932-ball N2F45 footprint, but bitstreams differ between speed grades - a speed-grade-2 bitstream will not run on a speed-grade-1 device. Verify both the order code AND the speed-grade designator before taping out the board.
Multi-gigabit transceivers on the Arria 10 GX require controlled-impedance routing with continuous reference planes. Estimated: keep transceiver lane length matching within 0.127 mm (5 mil) for lanes within a group and 0.254 mm (10 mil) between groups, per Intel's transceiver layout guidelines. Use the Quartus Prime Transceiver Toolkit to validate bit-error-rate compliance at production corners before committing to PCB stack-up.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 is not applicable - this is an FPGA, not a discrete automotive-grade IC; Intel's Arria 10 GX family is qualified to industrial-grade reliability standards but not AEC-Q100.
