5CSEBA2U23C8SN - Cyclone V SE SoC FPGA 25K LE | Intel | Altera
Teilenummer: 5CSEBA2U23C8SN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95.5 | $95,50 |
| 10 | $88.2 | $882,00 |
| 100 | $78.4 | $7.840,00 |
| 250 | $73.1 | $18.275,00 |
| 500 | $69.8 | $34.900,00 |
5CSEBA2U23C8SN Übersicht
A SoC FPGA is a hybrid device that merges a general-purpose microprocessor subsystem (here, ARM Cortex-A9) with programmable logic on one silicon die, giving engineers the ability to run an operating system such as Linux for control-plane and human-interface tasks while accelerating latency-critical datapaths in dedicated hardware fabric. This architecture sits above standalone MCUs and standalone FPGAs in the embedded hierarchy and is widely used in industrial vision, motor control, and software-defined radio where software flexibility and hardware determinism are both required.
Key features include up to 600 MHz ARM Cortex-A9 dual-core operation with NEON media extension, integrated CoreSight debug and trace, 25K logic elements, embedded M10K memory blocks, variable-precision DSP blocks, and a flexible HPS peripheral set including EMAC, USB, SPI, I2C, UART, and SD/MMC controllers. The SoC integrates high-speed transceivers suitable for common serial protocols and supports external memory interfaces such as DDR3, LPDDR2, and QSPI flash. Hard IP for PCI Express Gen2 is available in selected Cyclone V SE variants for connectivity expansion.
Typical applications span industrial motor and motion controllers, machine-vision smart cameras, software-defined radio baseband preprocessing, broadcast video processing, factory automation HMIs, and portable medical diagnostic equipment. Compared to a discrete MCU + discrete FPGA two-board solution, the integrated SoC reduces board area, lowers bill-of-materials cost, simplifies PCB routing, and shortens signal paths between the HPS and FPGA fabric via the high-bandwidth AXI/AVALON bridge interconnect, which improves determinism for closed-loop control loops.
When designing with this device, ensure the PCB footprint matches the 672-ball UBGFA 23x23 mm land pattern and that the Quartus Prime toolchain version supports the device family. Verify thermal management, since worst-case HPS + FPGA workload can drive junction temperature up under sustained operation, especially in enclosed industrial enclosures without forced airflow.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes beyond what the manufacturer datasheet alone provides, intended for hardware engineers, embedded firmware architects, and supply-chain specialists evaluating Cyclone V SE SoC FPGAs for new designs or migration paths.
Drop-in-Alternativen für 5CSEBA2U23C8SN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA2U23C8SN (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, HPS Peripherals, Logic Elements, HPS Maximum Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA2U23C8N
✅ Drop-In✓ Auf Lager
$55.5 / Stück
Datenblatt ansehen →5CSEBA2U23C7SN
✅ Drop-In✓ Auf Lager
$13.73 / Stück
Datenblatt ansehen →5CSEBA2U23C7N
✅ Drop-In✓ Auf Lager
$76.9 / Stück
Datenblatt ansehen →5CSEBA2U23C6N
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →5CSEBA2U23A7N
✅ Drop-In✓ Auf Lager
$99.5 / Stück
Datenblatt ansehen →5CSEBA2U19C8SN
✅ Drop-In✓ Auf Lager
$198.4 / Stück
Datenblatt ansehen →5CSEBA2U23C8SN Grenzwerte & elektrische Eigenschaften
| Device Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | TSMC 28 nm low-power |
| Gehäuse | 672-ball UBGFA (UFBGA), 23 x 23 mm |
| Core Voltage | 1.1 V (typical) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| User I/O Pins | 145 (per Avaq comparison reference) |
| Memory Interfaces | DDR3, LPDDR2, QSPI flash |
| HPS Peripherals | EMAC, USB 2.0 OTG, SPI, I2C, UART, SD/MMC, NAND |
| Debug Support | ARM CoreSight JTAG and trace |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
5CSEBA2U23C8SN 672-ball ubgfa (ufbga), 23 x 23 mm Pinbelegungsleitfaden
Pinbelegung für 5CSEBA2U23C8SN (672-ball ubgfa (ufbga), 23 x 23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA2U23C8SN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA2U23C8SN ist geeignet für 6 Anwendungs: Industrial Motor Control, Machine Vision Smart Camera, Software-Defined Radio Baseband, Broadcast Video Processing, Factory Automation HMI, Portable Medical Diagnostic Equipment.
Industrial Motor Control
The 5CSEBA2U23C8SN fits industrial motor and motion-control designs because the FPGA fabric implements high-resolution PWM, quadrature encoder decoding, and sigma-delta current-sensor interfaces at deterministic sub-microsecond latency, while the dual-core ARM Cortex-A9 HPS runs field-oriented control (FOC) algorithms, EtherCAT/PROFINET slave stacks, and safety firmware. The 25K LE budget is sufficient for one to three-axis FOC loops with resolver decoding. Cyclone V SE is widely adopted in servo drives because the integrated HPS eliminates an external MCU, reducing BOM cost by 15-25% and shortening control-loop latency by removing external bus crossings. Compared with a discrete MCU+FPGA two-board design, the integrated AXI bridge between HPS and FPGA fabric delivers deterministic 600 MHz interconnect for closed-loop torque response under 10 microseconds.
Empfohlen
Machine Vision Smart Camera
The 5CSEBA2U23C8SN is well suited for machine-vision smart cameras because the FPGA fabric can host parallel image-processing pipelines (Sobel filtering, color conversion, blob detection) at line-rate, while the ARM Cortex-A9 HPS runs OpenCV-based analytics, GigE Vision protocol stacks, and TCP/IP networking. The Cyclone V SE family supports external DDR3 to 1 GB, providing frame-buffer headroom for 1080p at 60 fps processing. Embedded vision designers choose this part because the integrated SoC eliminates the need for a separate camera-link frame grabber, reducing system cost and power. Quoted power consumption for SE variants runs near 5-8 W typical, suitable for PoE-powered camera enclosures without active cooling.
Empfohlen
Software-Defined Radio Baseband
The 5CSEBA2U23C8SN serves software-defined radio (SDR) baseband preprocessing because the FPGA fabric executes high-sample-rate digital down-conversion, channelization, and pulse-shaping at hundreds of MSPS, while the dual-core ARM Cortex-A9 HPS runs modulation/demodulation stacks, GNU Radio flowgraphs, and network management. The 25K LE budget supports one to two-channel narrowband SDR up to 50 MSPS aggregate. Cyclone V SE is selected for cost-sensitive SDR designs because of its low static power and integrated HPS, enabling portable tactical-radio prototypes. Compared with high-end Xilinx Kintex or Virtex parts, the 5CSEBA2U23C8SN trades raw DSP throughput for a 5-10x lower unit cost, making it ideal for high-volume commercial SDR deployments such as private LTE small cells.
Empfohlen
Broadcast Video Processing
The 5CSEBA2U23C8SN is deployed in broadcast video encoders and contribution feeds because the FPGA fabric performs low-latency video preprocessing, color-space conversion, and transport-stream packetization, while the ARM Cortex-A9 HPS manages network interfaces, SNMP monitoring, and web configuration UIs. Broadcast OEMs select Cyclone V SE because the integrated SoC eliminates external CPU cards in 1U rack chassis, halving board count. The device supports SDI, HDMI, and IP-based SMPTE 2022-6 video-over-IP workflows through FPGA fabric IP cores. Power consumption is typically below 8 W at full load, enabling fan-less broadcast rack designs in studio environments.
Empfohlen
Factory Automation HMI
The 5CSEBA2U23C8SN fits factory-automation HMI panels because the ARM Cortex-A9 HPS runs Linux with Qt or web-based HMIs at smooth 60 fps, while the FPGA fabric handles real-time touch-panel scanning, multi-protocol industrial communication (Modbus, EtherCAT, IO-Link), and safety I/O monitoring. The integrated SoC replaces legacy ARM9 + CPLD two-chip solutions, reducing PCB area by approximately 40%. Cyclone V SE is chosen for industrial HMI because of its commercial 0C to +85C operating range, RoHS compliance, and long-term availability program. Designers can leverage the HPS EMAC and USB 2.0 OTG to provide dual industrial-Ethernet ports and USB host for peripherals without external PHY.
Empfohlen
Portable Medical Diagnostic Equipment
The 5CSEBA2U23C8SN is appropriate for portable medical diagnostic devices such as ultrasound carts, patient monitors, and point-of-care analyzers because the FPGA fabric executes digital down-conversion, FIR filtering, and beamforming on ultrasound receive channels at low power, while the ARM Cortex-A9 HPS runs the user interface, DICOM networking, and battery management. Cyclone V SE is selected for medical designs because of its 28 nm low-power process, typically drawing 3-5 W at moderate FPGA utilization. Compared with discrete DSP + MCU solutions, the integrated SoC shortens FDA 510(k) validation by reducing component-level risk and consolidating the bill of materials. The 600 MHz HPS is sufficient to drive 7-inch 1024x600 LCD touch panels with smooth Qt-based UI rendering.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA2U23C8SN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA2U23C8N | 5CSEBA2U23C7SN | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N | 5CSEBA2U19C8SN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball UBGFA 23x23 mm | 672-ball UBGFA 23x23 mm | 672-ball UBGFA 23x23 mm | 672-ball UBGFA 23x23 mm | 672-ball UBGFA 23x23 mm | 672-ball UBGFA 23x23 mm | 484-ball UBGFA 19x19 mm |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Speed Grade | -8 (fastest) | -8 | -7 | -7 | -6 | -7 (automotive) | -8 |
| HPS Max Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Automotive / Industrial | Commercial |
| Delivery Form | Tape & Reel (SN) | Tray (N) | Tape & Reel (SN) | Tray (N) | Tray (N) | Tray (N) | Tape & Reel (SN) |
| Pin-to-Pin Compatible | Reference | Yes | Yes | Yes | Yes | Yes | PCB footprint differs (19x19 vs 23x23 mm) |
Wichtigste Unterscheidungsmerkmale
- Fastest HPS speed grade at -8 within the Cyclone V SE 25K LE family (vs. 5CSEBA2U23C7SN)
- Tape-and-reel packaging for SMT assembly (vs. 5CSEBA2U23C8N)
- Commercial temperature grade for cost-optimized designs (vs. 5CSEBA2U23A7N)
Designhinweise
Estimated: at typical Cyclone V SE utilization with HPS active plus 40% FPGA fabric utilization, total device power approximates 5-8 W at 600 MHz. With theta_JA around 15-20 C/W for the 672-ball UBGFA package, junction temperature rise above ambient is approximately 100-160 C in still air, so designers should use 4-layer or 6-layer PCB stackups with a solid ground plane beneath the BGA and at least 50 thermal vias under the central die pad. Industrial enclosures without airflow must provide heat-spreading copper pours or attach a low-profile heat spreader.
The 672-ball UBGFA package at 1.0 mm ball pitch requires PCB fabrication capability of 4 mil trace/space with microvia or via-in-pad stackups. Use ENIG surface finish for solderability and avoid HASL on BGA pads. Match the impedance of HPS DDR3 traces to 50 ohm single-ended with length matching within 25 mil across byte lanes; reference the Cyclone V device datasheet pinout table for byte-lane groupings. Decoupling: place 0.1 uF X7R capacitors every 5 mm along the periphery plus bulk 47 uF tantalum near each supply pin group.
Separate analog and digital ground planes; connect at a single point beneath the HPS analog supply pin. Route HPS reference clock (typically 25 MHz crystal to HPS_CLK1) with 50 ohm controlled impedance and length less than 50 mm, surrounded by ground via fence. For high-speed transceivers (if the SE variant includes them), route differential pairs with 100 ohm differential impedance and maintain length matching under 5 mil. FPGA fabric user I/O banks must be assigned to specific supply voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) according to the datasheet VCCIO pinout to avoid contention.
Do not confuse speed grades: -6, -7, -8 differ in FPGA timing closure margins, not in HPS frequency, and lower grades may fail timing in dense designs. Verify the SE variant supports the peripherals you need; some Cyclone V SE SKUs omit USB or PCIe hard IP. For boot source, ensure the QSPI flash is on the FPGA fabric side (not HPS) if using FPGA-first configuration mode, which is the typical default for early bootloader. Always generate Quartus Prime pin assignments from the official device pinout file (.qsf) rather than hand-mapping, since SE pin assignments are not interchangeable with Cyclone V GX or SX family pinouts.
Compliance-Informationen
RoHS and lead-free compliant per distributor listings. Halogen-free status not explicitly stated in the verified web data; set to unknown. Conflict-minerals declaration per Intel supply-chain policy. AEC-Q100 not applicable for the commercial -8 variant; choose -A suffix for automotive AEC-Q100 qualification.
