5CSXFC6C6U23C7N - Cyclone V SX SoC FPGA, 110K LE, 672-UBGA | Intel
Teilenummer: 5CSXFC6C6U23C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $280.96 | $280,96 |
| 10 | $263.4 | $2.634,00 |
| 100 | $244.5 | $24.450,00 |
| 500 | $228.1 | $114.050,00 |
| 1.000 | $215.8 | $215.800,00 |
5CSXFC6C6U23C7N Übersicht
A System-on-Chip (SoC) FPGA is a hybrid device that pairs a programmable logic fabric with one or more hard processor cores on the same silicon die. The hard processors execute an operating system and control-plane code, while the FPGA fabric accelerates parallel datapaths, custom peripherals, and time-critical DSP. This architecture reduces board area, BOM cost, and inter-chip latency compared with a discrete CPU-plus-FPGA solution, and is widely adopted in industrial control, video processing, motor drive, and machine-vision designs.
The 5CSXFC6C6U23C7N integrates approximately 110K logic elements, 5,140 Kbits of embedded memory, 224 18x18 multipliers, and six 3.125 Gbps transceivers. The hard processor system runs up to 800 MHz per core with 32 KB I-cache, 32 KB D-cache per core, and a 512 KB shared L2 cache. Peripherals include USB 2.0, Gigabit Ethernet, CAN, UART, SPI, I2C, and DDR2/DDR3 controller with ECC support.
Architecturally, the device uses a column-based ALM fabric with adaptive logic modules supporting 8-input fracturable look-up tables, providing an efficient mix of register-rich and arithmetic-intensive paths. The transceiver block delivers up to 3.125 Gbps per channel for PCIe Gen2 x1/x2, gigabit Ethernet, and serial RapidIO links, while the variable-precision DSP blocks enable single-cycle 18x18 or dual-cycle 27x27 multiply-accumulate operations.
Typical applications include industrial machine vision, motor control and drives, software-defined radio baseband, broadcast video processing, and ruggedized military/aerospace platforms. The combination of hard ARM cores, deterministic low-latency fabric, and integrated transceivers lets one device replace a multi-chip CPU+FPGA design in space-constrained embedded systems.
Designers should note that this member of the Cyclone V SX family uses the U672 package and operates over the commercial 0C to 85C junction temperature range with a core speed grade of -7. Pin-compatible migration paths include the lower-logic-density 5CSXFC5C6U23C7N and 5CSXFC4C6U23C7N, and the lower-speed -6 grade 5CSXFC6C6U23C6N for cost reduction.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the correct Cyclone V SX variant and avoid costly board respins.
Drop-in-Alternativen für 5CSXFC6C6U23C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC6C6U23C7N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Elements, Process Technology, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC6C6U23C6N
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →5CSXFC5C6U23C7N
✅ Drop-In✓ Auf Lager
$348 / Stück
Datenblatt ansehen →5CSXFC4C6U23C7N
✅ Drop-In✓ Auf Lager
$64.95 / Stück
Datenblatt ansehen →5CSXFC6C6U23A7N
✅ Drop-In✓ Auf Lager
$328.75 / Stück
Datenblatt ansehen →5CSXFC5D6F31I7N
✅ Drop-In✓ Auf Lager
$138.2 / Stück
Datenblatt ansehen →5CSXFC6C6U23C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 |
| Hard Processor Cores | Dual ARM Cortex-A9 MPCore |
| Processor Max Frequency | 800 MHz |
| Embedded Memory | 5,140 Kbits |
| 18x18 Multipliers | 224 |
| Transceivers | 6 (up to 3.125 Gbps) |
| User I/O Pins | 145 |
| Gehäuse | 672-UBGA (23x23 mm) |
| Speed Grade | -7 (fastest) |
| Betriebstemperatur | 0C to 85C (commercial) |
| Process Technology | 28 nm low-power |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Hard Cache (L2 shared) | 512 KB |
5CSXFC6C6U23C7N 672-ubga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSXFC6C6U23C7N (672-ubga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC6C6U23C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC6C6U23C7N ist geeignet für 6 Anwendungs: Industrial Machine Vision Systems, Motor Control and Industrial Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Ruggedized Military and Aerospace Platforms, Embedded IoT Edge Gateways.
Industrial Machine Vision Systems
The 5CSXFC6C6U23C7N is purpose-built for industrial machine vision, where the dual ARM Cortex-A9 cores run the vision pipeline (OpenCV, halcon, custom CNN inference) while the 110K-logic-element fabric accelerates image preprocessing such as Bayer demosaicing, color space conversion, and Sobel/LoG filters in real time. The 5,140 Kbits of embedded memory buffers full-HD frames at 60 fps, while 224 18x18 multipliers compute convolutions in a single cycle. Six integrated 3.125 Gbps transceivers stream raw sensor data from CoaXPress or 10 GigE Vision cameras into the FPGA fabric without an external PHY, reducing BOM cost and PCB area.
Empfohlen
Motor Control and Industrial Drives
In motor control and AC drive applications, the 5CSXFC6C6U23C7N leverages its dual ARM Cortex-A9 cores to execute the FOC (field-oriented control) loop and communication stacks (EtherCAT, PROFINET, CANopen) while the FPGA fabric implements deterministic PWM generation, dead-time compensation, and encoder interface logic with sub-microsecond jitter. The 800 MHz HPS clock provides sufficient headroom for 50 microsecond control loops at 20 kHz switching frequency. Hardware multipliers accelerate Park/Clarke transforms and SVPWM modulation, freeing the CPU for safety diagnostics, while integrated peripherals (CAN, UART, SPI) interface to power-stage gate drivers and isolated current sensors.
Empfohlen
Software-Defined Radio Baseband
The 5CSXFC6C6U23C7N is well suited to SDR baseband processing, where the dual ARM Cortex-A9 cores execute protocol stacks and modem control while the FPGA fabric implements digital up/down conversion, pulse shaping, and channelization filters in hardware. The six 3.125 Gbps transceivers interface directly to RF ADCs/DACs (such as the AD9680 or AD9144 family) and support CPRI/OBSAI fronthaul links to remote radio heads. The 224 DSP blocks provide the multiply-accumulate throughput needed for LTE, WiMAX, or custom waveforms up to 20 MHz instantaneous bandwidth, and the 5,140 Kbits of block RAM holds hundreds of FIR filter taps.
Empfohlen
Broadcast Video Processing
In broadcast video infrastructure, the 5CSXFC6C6U23C7N combines the FPGA fabric for real-time video processing (scaling, deinterlacing, color correction, HDR tone mapping) with the ARM cores for control plane and stream management (SMPTE 2022, NMOS IS-04/05, RIST). The 145 user I/O pins accept 3G-SDI, HDMI, or DisplayPort streams via external serializers, while the integrated transceivers support SMPTE 424M coaxial SDI at 3 Gbps per channel. Embedded memory stores multiple frame buffers for pipelined 4K processing, and the 28 nm low-power process keeps junction temperature manageable in fanless broadcast equipment.
Empfohlen
Ruggedized Military and Aerospace Platforms
The 5CSXFC6C6U23C7N is deployed in military and aerospace platforms where SWaP-C (size, weight, power, cost) constraints rule out multi-chip solutions. The dual ARM Cortex-A9 cores run secure operating systems (VxWorks, INTEGRITY, LynxOS-178) for mission computing, while the FPGA fabric implements custom sensor interfaces, MIL-STD-1553 bus controllers, and signal-processing pipelines for radar, electronic warfare, or SIGINT applications. The integrated transceivers support Serial RapidIO and PCIe Gen2 for high-speed sensor data ingest, and the 145 user I/O pins accept LVDS and RS-422 directly. The 28 nm low-power process minimizes thermal load in sealed enclosures.
Empfohlen
Embedded IoT Edge Gateways
For IoT edge gateways, the 5CSXFC6C6U23C7N combines Linux-class application processing on the ARM Cortex-A9 cores (running Docker containers, MQTT brokers, time-series databases) with FPGA-accelerated protocol bridging (Modbus, BACnet, LoRaWAN baseband, custom industrial protocols). The integrated Gigabit Ethernet MAC enables direct WAN connectivity, while USB 2.0 and CAN peripherals support fieldbus attachment. The FPGA fabric offloads packet filtering, encryption (AES/SHA), and timestamp correlation at line rate, and the 28 nm process keeps power consumption below 10 W typical - suitable for fanless DIN-rail enclosures in industrial IoT deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC6C6U23C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC6C6U23C6N | 5CSXFC5C6U23C7N | 5CSXFC4C6U23C7N | 5CSXFC6C6U23A7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBGA (U672) 23x23 mm | 672-UBGA (U672) 23x23 mm - same | 672-UBGA (U672) 23x23 mm - same | 672-UBGA (U672) 23x23 mm - same | 672-UBGA (U672) 23x23 mm - same |
| Logic Elements | 110,000 | 110,000 (same) | 85,000 (-23%) | 49,000 (-55%) | 110,000 (same) |
| Speed Grade | -7 | -6 (slower) | -7 (same) | -7 (same) | -7 (same) |
| Temperature Grade | Commercial (0C to 85C) | Commercial (same) | Commercial (same) | Commercial (same) | Automotive (-40C to 125C) |
| Transceivers | 6 x 3.125 Gbps | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) |
| Embedded Memory (Kbits) | 5,140 | 5,140 (same) | 3,970 (-23%) | 3,160 (-39%) | 5,140 (same) |
| 18x18 Multipliers | 224 | 224 (same) | 174 (-22%) | 112 (-50%) | 224 (same) |
| Approx. Unit Price (qty 1) | $280.96 | $245 (lower, slower grade) | $215 (lower density) | $165 (lowest density) | $310 (auto grade premium) |
Wichtigste Unterscheidungsmerkmale
- Highest-density SX variant with full -7 speed grade (vs. 5CSXFC5C6U23C7N)
- Fastest speed grade in the U672 family (vs. 5CSXFC6C6U23C6N)
- Commercial temperature range at lower cost than automotive (vs. 5CSXFC6C6U23A7N)
Designhinweise
The 5CSXFC6C6U23C7N requires a multi-rail power supply: typically 0.85V core (VCC), 1.1V PLL auxiliary (VCCA_PLL), 1.8V/2.5V/3.3V I/O banks (VCCIO), and 1.5V DDR3 termination (VTT). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet to estimate dynamic and static power before final schematic design. For typical 110K LE designs at 25% toggle rate and 100 MHz, total power is approximately 3-5 W; provision 2x headroom for the regulator. Decouple every VCC pin with 0.1 uF and 10 uF capacitors placed within 5 mm of the BGA ball, as recommended in Intel application note AN521.
Estimated: at 5 W total power dissipation in the 672-UBGA package, theta_JA on a JEDEC 4-layer test board is approximately 15 C/W, giving a 75 C junction rise above ambient. For commercial temperature grade (0C to 85C junction), the maximum ambient is approximately 10 C without airflow or heatsink. Mount the device on a 4+ layer PCB with continuous inner ground plane and consider a 1 m/s airflow for industrial environments. The exposed thermal pad (if present on package) must be soldered to the PCB ground pour for optimal heat spreading.
Route all six transceiver channels with controlled 100 ohm differential impedance (Microstrip or Stripline) and length-match each P/N pair to within 150 um. Maintain at least 3x trace spacing between transceiver pairs to minimize crosstalk. Power pins for transceivers (VCCH_GXB) require dedicated filtering with ferrite beads - never share decoupling with digital VCC. The HPS DDR3 interface requires impedance-matched fly-by routing with VTT termination resistors; consult Intel External Memory Interface Handbook Volume 3 for full routing guidance.
Common pitfalls: (1) Do not confuse the U672 UBGA (commercial) with the F672 FBGA (industrial) - they have different ballmaps and are NOT pin-compatible despite similar package code prefix. (2) The C7N speed grade requires Quartus Prime 13.0 or later for full timing closure support. (3) Configuration via passive serial (PS) mode requires a valid AS configuration scheme reset sequence; missing the nCONFIG pulse can lock the device. (4) Leave at least 20% LE and 30% memory headroom for design iterations and post-route optimization.
Compliance-Informationen
RoHS compliant per Intel product page. The -A7N suffix variant (5CSXFC6C6U23A7N) is AEC-Q100 qualified for automotive applications; standard C7N is commercial grade and not AEC-Q100. MSL level and halogen-free status not explicitly listed in verified data.