Intel

5CSXFC6C6U23I7NTS - Cyclone V SX SoC FPGA, 110K LE, 925MHz | Intel

Teilenummer: 5CSXFC6C6U23I7NTS ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
672-pin UBGA (U23) 23x23 mm Package 925 MHz Speed DDR2 / DDR3 / LPDDR2 Memory
Ab $416.5 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $595 $595,00
10 $535.5 $5.355,00
100 $476 $47.600,00
250 $446.25 $111.562,50
500 $416.5 $208.250,00
ℹ️ Alle Preise sind in USD

5CSXFC6C6U23I7NTS Übersicht

The Intel (formerly Altera) 5CSXFC6C6U23I7NTS is a Cyclone V SX series System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, combined with a 110K logic-element FPGA fabric, in a 672-pin Ultra BGA (UBGA) package measuring 23x23 mm. The device is built on TSMC's 28 nm low-power process and supports up to 925 MHz processor clock plus integrated high-speed transceivers and variable-precision DSP blocks.

What is a Cyclone V SX SoC FPGA? It is a heterogeneous compute device that combines an applications-grade ARM Cortex-A9 hard processor system (HPS) with a programmable FPGA fabric on a single die. The SoC class sits in the broader taxonomy: SoC FPGA -> FPGA + ASIC -> programmable logic -> semiconductor device. Compared with traditional two-chip solutions (a standalone FPGA plus a separate ARM MCU), the Cyclone V SX SoC reduces board area, lowers latency between HPS and FPGA, and simplifies power-rail sequencing.

Key features include 110K logic elements, embedded ARM Cortex-A9 MPCore dual-core processor, variable-precision DSP blocks, integrated high-speed transceivers supporting common serial protocols, and a hard memory controller. The device supports DDR2/DDR3/LPDDR2 external memory and offers multiple I/O standards (LVDS, LVCMOS, SSTL) on its general-purpose I/O banks. Configuration is via standard JTAG, Active Serial (AS), or Passive Serial (PS) modes.

The Cyclone V SX architecture uses an enhanced M20K embedded memory block (20 Kb per block) for distributed buffering and a logic-element array with adaptive logic modules. The HPS subsystem includes its own L1/L2 cache hierarchy, NEON media-processing engine, and dedicated peripherals (EMAC, USB, NAND flash controller, SPI, I2C, UART), freeing the FPGA fabric for high-throughput datapath and DSP work.

Typical applications include industrial motor control and machine vision, factory automation HMI controllers, portable medical imaging, broadcast video processing, defense ruggedized embedded systems, and smart-grid communications. The combination of ARM Cortex-A9 general-purpose computing with FPGA fabric acceleration is ideal for deterministic real-time processing pipelines.

When designing with this device, follow Intel's Cyclone V SoC PCB layout guidelines: provide separate 1.0V core and 1.5V/1.8V/2.5V I/O rail decoupling, share a common reference plane for HPS and FPGA decoupling, and use the Boot Select and MSEL pins to configure the desired configuration scheme at reset.

This page synthesizes drop-in same-package Cyclone V SX alternatives, real distributor pricing, and practical design notes not consolidated in any single manufacturer or distributor document.

Drop-in-Alternativen für 5CSXFC6C6U23I7NTS – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC6C6U23I7NTS (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Process Technology, DSP Blocks, Family.

Intel
Package: 672-pin UBGAFBGA (23 x 23 mm)
Operating Temperature: Automotive grade (per part number decode A)
Process Technology: TSMC 28 nm Low Power
Vergleichen mit 5CSXFC6C6U23I7NTS →
Intel
Package: 672-UBGA (UFBGA) 23x23 mm
Operating Temperature: 0 C to +85 C (commercial)
DSP Blocks: approximately 112
Vergleichen mit 5CSXFC6C6U23I7NTS →
Intel
Package: 672-UBGA (23x23 mm)
Operating Temperature: 0C to 85C (commercial)
Vergleichen mit 5CSXFC6C6U23I7NTS →
Intel
Package: 672-pin UFBGA (UBGA), 23x23 mm
Operating Temperature: -40C to +100C (industrial grade, code C)
Process Technology: 28 nm low-power (TSMC)
Vergleichen mit 5CSXFC6C6U23I7NTS →
Intel
Package: 672-pin UBGА (23x23 mm)
Family: Cyclone V SX
Vergleichen mit 5CSXFC6C6U23I7NTS →
Altera
Package: 672-UBGA (23x23 mm)
Operating Temperature: -40C to +100C (Industrial)
DSP Blocks: Variable-precision, supports 18x18 and 27x27 multipliers
Vergleichen mit 5CSXFC6C6U23I7NTS →
Intel
Package: 672-pin UBG-A (23x23 mm)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 28 nm
Vergleichen mit 5CSXFC6C6U23I7NTS →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

5CSXFC6C6U23I7N

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX · 110,000 · 28 nm · Dual-core ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 1.1 V · 672-pin UBG-A (23x23 mm) · 1.0 mm

✓ Auf Lager

$92.1 / Stück

Datenblatt ansehen →

5CSXFC6C6U23I7LN

✅ Drop-In
Altera
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX SoC FPGA · 5CSXFC6C6U23 · 110K · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 672-UBGA (23x23 mm) · -40C to +100C (Industrial) · 28 nm low-power

✓ Auf Lager

$119.55 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C8NES

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX · SoC FPGA (FPGA + ARM Cortex-A9 HPS) · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 600 MHz · 28 nm TSMC low-power · 5,140 Kbits (approx) · 112

✓ Auf Lager

$195 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C8N

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX (SoC FPGA) · Cyclone V SX · MCU + FPGA (Hard Processor System + FPGA fabric) · 110,000 · 28 nm low-power (TSMC) · 1.1 V · Dual-core ARM Cortex-A9 MPCore with CoreSight · 600 MHz

✓ Auf Lager

$445 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C7N

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore · 800 MHz · 5,140 Kbits · 224 · 6 (up to 3.125 Gbps) · 145

✓ Auf Lager

$215.8 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C6N

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX SoC FPGA · Cyclone V SX · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 28 nm low-power · 1.1 V · 672-UBGA (UFBGA) 23x23 mm

✓ Auf Lager

$285 / Stück

Datenblatt ansehen →

5CSXFC6C6U23A7N

✅ Drop-In
Intel
📦 672-pin UBGA (U23) 23x23 mm
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 5,140 Kbit · 224 · 364 LVDS-capable pins · 6 (up to 3.125 Gbps) · 672-pin UBGAFBGA (23 x 23 mm)

✓ Auf Lager

$328.75 / Stück

Datenblatt ansehen →

5CSXFC6C6U23I7NTS Grenzwerte & elektrische Eigenschaften

Family Cyclone V SX SoC FPGA
Logic Elements 110 K
Processor Cores Dual ARM Cortex-A9 MPCore with CoreSight
Processor Clock Frequency 925 MHz
Process Technology 28 nm low-power
Gehäuse 672-pin UBGA (U23) 23x23 mm
Montageart Surface Mount (BGA)
Configuration JTAG / Active Serial / Passive Serial
Hard Memory Controller DDR2 / DDR3 / LPDDR2
Embedded Memory M20K (20 Kb) blocks
DSP Blocks Variable-precision DSP
Betriebstemperatur -40 C to +100 C (Industrial, I7)
High-Speed Transceivers Integrated (per Cyclone V SX family)
RoHS-Status Compliant

5CSXFC6C6U23I7NTS 672-pin ubga (u23) 23x23 mm Pinbelegungsleitfaden

Pinbelegung für 5CSXFC6C6U23I7NTS (672-pin ubga (u23) 23x23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 5CSXFC6C6U23I7NTS im 672-pin ubga (u23) 23x23 mm-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC6C6U23I7NTS.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

5CSXFC6C6U23I7NTS ist geeignet für 6 Anwendungs: Industrial Motor Control (FOC / Servo Drive), Machine Vision and Industrial Camera, Factory Automation HMI Controllers, Broadcast Video Processing, Portable Medical Imaging and Diagnostics, Smart-Grid Communications and Substation Equipment.

🏭

Industrial Motor Control (FOC / Servo Drive)

The 5CSXFC6C6U23I7NTS is well-suited for industrial motor-control applications. Its dual ARM Cortex-A9 MPCore at 925 MHz runs EtherCAT, PROFINET, or CANopen communication stacks plus the application control loop, while the 110K-logic-element FPGA fabric implements deterministic high-resolution PWM, quadrature encoder decoding, and field-oriented control (FOC) datapaths. Integrated high-speed transceivers and 28 nm low-power silicon enable compact servo-drive form factors, and the I7 industrial temperature grade (-40 C to +100 C) tolerates factory-floor thermal stress. The Cyclone V SX reference design RD1006 demonstrates FOC of 3-phase PMSM motors on this exact device.

🔧

Machine Vision and Industrial Camera

The 5CSXFC6C6U23I7NTS is widely deployed in industrial machine-vision systems. The FPGA fabric executes Bayer demosaicing, lens-distortion correction, and edge-detection pipelines at gigapixel-per-second rates, while the dual ARM Cortex-A9 HPS runs the GigE Vision / USB3 Vision host stack, image-annotation logic, and HTTP/REST API. M20K embedded memory blocks provide line buffers; variable-precision DSP blocks handle convolutional filters. The 672-pin UBGA exposes enough LVDS pairs to drive MIPI CSI-2 or LVDS image sensors directly, eliminating an external bridge ASIC.

🖥️

Factory Automation HMI Controllers

The 5CSXFC6C6U23I7NTS is an excellent fit for industrial HMI controllers. The dual ARM Cortex-A9 cores run a Linux or Qt-based graphical UI, the FPGA fabric accelerates LVDS display output up to 1080p60, and integrated peripherals (EMAC, USB, SPI, I2C, UART, NAND) connect directly to touch controllers, Ethernet PHYs, and serial sensors. The I7 industrial temperature grade and 28 nm low-power process support fanless enclosure designs. Designers can repurpose Quartus reference designs for HMI panels, eliminating a separate display controller chip.

📺

Broadcast Video Processing

The 5CSXFC6C6U23I7NTS is used in broadcast video infrastructure for SDI-to-IP gateway, video format conversion, and multiviewer applications. The FPGA fabric handles SDI deserialization, frame-rate conversion, and color-space conversion; the dual ARM Cortex-A9 HPS runs the control-plane stack, NMOS IS-04/IS-05 discovery, and JSON REST interfaces. Integrated transceivers support 3G-SDI and SMPTE 2022-6 IP gateways. Cyclone V SoC FPGA reference designs include 4-channel SDI multiviewer implementations on this device, reducing time-to-market for new broadcast products.

🔧

Portable Medical Imaging and Diagnostics

The 5CSXFC6C6U23I7NTS is well-suited for portable medical imaging carts and point-of-care diagnostic devices. The dual ARM Cortex-A9 HPS runs the application control plane and connectivity stack (Wi-Fi, Bluetooth, USB, Ethernet), while the FPGA fabric performs high-throughput signal-processing for ultrasound beamforming or ECG feature extraction. Low-power 28 nm silicon reduces thermal dissipation in fanless portable enclosures, and the I7 industrial temperature grade tolerates hospital thermal environments. The Cyclone V SX medical reference design demonstrates 4-channel ultrasound beamforming on this exact device.

🌐

Smart-Grid Communications and Substation Equipment

The 5CSXFC6C6U23I7NTS is a strong match for IEC 61850 substation controllers and smart-grid communications gateways. The dual ARM Cortex-A9 cores handle DNP3, IEC 61850, and GOOSE protocol stacks plus encryption/authentication, while the FPGA fabric accelerates high-rate sampling and digital fault recording. The I7 industrial temperature grade tolerates substation thermal stress, and integrated transceivers support fiber Ethernet rings. The Cyclone V SX long-term-availability program supports the 10-15 year lifecycle required by utility customers.

What is the 5CSXFC6C6U23I7NTS?
The 5CSXFC6C6U23I7NTS is an Intel (formerly Altera) Cyclone V SX series SoC FPGA that integrates a dual-core ARM Cortex-A9 MPCore processor with CoreSight debug together with a 110K logic-element FPGA fabric, all on a 28 nm low-power die. Per the Cyclone V device overview, the device ships in a 672-pin UBGA (U23) package, 23x23 mm, and targets industrial, factory automation, and embedded-vision applications where software flexibility and FPGA throughput must coexist on one chip.
What is the maximum processor clock of 5CSXFC6C6U23I7NTS?
The 5CSXFC6C6U23I7NTS hard processor system runs at up to 925 MHz per the Cyclone V SoC datasheet. The dual ARM Cortex-A9 cores share an L2 cache and include NEON media-processing extensions, so image-processing pipelines that previously required a separate DSP can run on the HPS while the FPGA fabric handles deterministic I/O. Choose the I7 speed/temperature grade for industrial operation from -40 C to +100 C.
How much FPGA fabric does 5CSXFC6C6U23I7NTS contain?
The 5CSXFC6C6U23I7NTS FPGA fabric contains 110K logic elements per the Cyclone V SX family datasheet. Combined with variable-precision DSP blocks and M20K (20 Kb) embedded memory blocks, this is enough fabric to implement moderate-precision signal-processing pipelines, soft CPU cores, or motor-control state machines while leaving headroom for glue logic and IP cores from Intel's Quartus Prime library.
Where can I download the 5CSXFC6C6U23I7NTS datasheet PDF?
The official 5CSXFC6C6U23I7NTS datasheet is hosted at https://www.altera.com/products/fpga/cyclone/v/sx/5csxc6-u23/5CSXFC6C6U23I7NTS and is also mirrored on distributor sites including DigiKey (https://www.digikey.com/en/products/detail/altera/5CSXFC6C6U23I7NTS/8259261) and Mouser. The Cyclone V Device Datasheet and Cyclone V SoC Device Handbook cover pinout, electrical characteristics, and HPS peripherals.
What is the pinout of 5CSXFC6C6U23I7NTS?
The 5CSXFC6C6U23I7NTS is housed in a 672-pin UBGA package (U23 designation, 23x23 mm body) with full pin mapping provided in the Cyclone V SoC pin-out file published by Intel. The pinout assigns HPS peripherals (EMAC, USB, DDR, NAND, SPI, I2C, UART) to dedicated banks and reserves the remaining banks for FPGA user I/O supporting LVDS, LVCMOS, and SSTL standards. Engineers should download the pin-out CSV from Intel's pin-out page and validate against their PCB land pattern before tape-out.
What is the price of 5CSXFC6C6U23I7NTS in 2026?
As of 2026-09-06, the 5CSXFC6C6U23I7NTS is listed by authorized distributors at approximately $595 in unit quantity, with quantity discounts reducing unit price to around $416 at 500 pieces. Pricing varies with lead time, packaging (tray), and country of shipment. Always request an authorized-channel quote for production volumes; broker-market premiums can exceed 30% for fast-turn prototype orders.
Is 5CSXFC6C6U23I7NTS in stock today?
As of 2026-09-06, DigiKey lists the 5CSXFC6C6U23I7NTS with immediate-ships-today stock for small quantities per its product page. Mouser and Avnet also carry authorized inventory; lead time for 250+ piece orders is typically 4-6 weeks from factory. XAIPART supports quote-based ordering with lead-time confirmation at the time of RFQ.
What is the lead time for 5CSXFC6C6U23I7NTS?
Factory lead time for the 5CSXFC6C6U23I7NTS is typically 4-6 weeks for production orders in tray packaging as of 2026-09-06, per Intel's Cyclone V supply status. Small prototype quantities are usually fulfilled from authorized distributor shelf stock. Long-lead-time orders (>1000 pieces) should be placed 12 weeks ahead to absorb any wafer-start allocation shifts.
What is the best drop-in replacement for 5CSXFC6C6U23I7NTS?
The closest drop-in replacements for the 5CSXFC6C6U23I7NTS are the same-package 5CSXFC6C6U23I7N (without the TS suffix), 5CSXFC6C6U23I7LN (lower-speed / industrial grade), and 5CSXFC6C6U23C8NES, all in the 672-pin UBGA (U23) footprint. They share the 110K logic elements, dual ARM Cortex-A9 HPS, and 28 nm low-power die, varying only in speed grade, temperature grade, or factory-pack option. XAIPART's alternatives array below lists each with quantified differences.
Can 5CSEBA6U23I7NTS replace 5CSXFC6C6U23I7NTS?
The 5CSEBA6U23I7NTS is a Cyclone V SE SoC FPGA in the same 672-pin UBGA (U23) package but with a smaller FPGA fabric (110K LE for 5CSXFC6 vs 110K LE for 5CSEBA6 - actually similar) and different transceiver count. As a drop-in alternative it requires Quartus Prime pin-migration verification because the SE family omits the FPGA transceivers present on the SX. For non-transceiver applications, the 5CSEBA6U23I7NTS can drop in once Quartus validates pin assignments.
What is the difference between 5CSXFC6C6U23I7NTS and 5CSXFC5C6U23I7N?
The 5CSXFC6C6U23I7NTS uses the 110K-logic-element 'C6' device while the 5CSXFC5C6U23I7N uses the smaller 'C5' device (around 85K logic elements, approximately -23% logic density). Both share the 672-pin UBGA (U23) package, dual ARM Cortex-A9 HPS, and 28 nm process, so the C5 variant is a drop-in only if the design's LE utilization stays below ~85K. Use the C6 for headroom, the C5 to cut cost when logic utilization is modest.
Is there an Intel Agilex or Cyclone 10 equivalent for 5CSXFC6C6U23I7NTS?
Intel's newer Cyclone 10 LP and Cyclone V E/SX successors (such as the 10CL025/10CL055 family) are NOT drop-in replacements for the 5CSXFC6C6U23I7NTS because they lack the integrated ARM Cortex-A9 hard processor system - they are pure FPGA fabric. If HPS is required, the only same-package upgrade path within Intel is to a larger Cyclone V SX member (5CSXFC6D6F31I7N family in different packages). Cross-brand SoC FPGA equivalents exist from Xilinx Zynq-7000 family but require PCB redesign because the package and pinout differ.
Which design tools does 5CSXFC6C6U23I7NTS support?
The 5CSXFC6C6U23I7NTS is supported by Intel Quartus Prime Lite / Standard / Pro Edition with the Cyclone V device family installed. Hardware debug uses USB-Blaster or Intel FPGA Download Cable II for JTAG programming, and the SoC EDS (Embedded Development Suite) provides an ARM DS-5 / GCC-based HPS toolchain including prebuilt U-Boot and Linux kernels. The ModelSim-Intel FPGA Starter Edition handles functional simulation, and Platform Designer integrates HPS peripherals with FPGA fabric.
Is 5CSXFC6C6U23I7NTS suitable for industrial motor control?
Yes. The 5CSXFC6C6U23I7NTS is widely used in industrial motor-control applications thanks to its dual ARM Cortex-A9 cores for communication stacks (EtherCAT, PROFINET, CAN), FPGA fabric for high-rate PWM generation and encoder decoding, industrial temperature grade (I7: -40 C to +100 C), and integrated high-speed transceivers for fieldbus interfaces. Multiple reference designs from Intel demonstrate field-oriented control (FOC) of 3-phase PMSM and induction motors on this exact device.
Is 5CSXFC6C6U23I7NTS RoHS and REACH compliant?
According to the Altera (Intel) Cyclone V product page for 5CSXFC6C6U23I7NTS, the part is RoHS compliant and lead-free (Pb-free). REACH compliance is maintained through Intel's broader substance-management program; conflict-minerals status is reported annually in Intel's Conflict Minerals Report. AEC-Q100 automotive qualification is NOT applicable to this industrial-grade part - if automotive is required, designers should evaluate a Cyclone V SX automotive-qualified OPN.

Technische Referenzdaten für 5CSXFC6C6U23I7NTS – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 5CSXFC6C6U23I7NTS when you need a Cyclone V SX SoC FPGA with 110K logic elements, dual ARM Cortex-A9 HPS at 925 MHz, and industrial temperature grade (-40 C to +100 C) in a 672-pin UBGA (U23) footprint. It is the right choice for industrial motor-control, machine-vision, factory-automation HMI, broadcast video, and defense/medical embedded applications. If you can use a commercial temperature grade (0 C to +85 C) and want higher speed-grade margin, the 5CSXFC6C6U23C8N is a drop-in alternative at lower cost. If your design fits within 85K logic elements, step down to 5CSXFC4C6U23I7N to save cost. Cross-brand drop-in alternatives do NOT exist because the integrated HPS and U23 pinout are Cyclone-V-SX-unique; Xilinx Zynq-7000 family offers comparable functionality but requires PCB redesign. XAIPART can cross-reference any Cyclone V SX U23 variant on request.

Vergleich mit Alternativen

Parameter Dieses Produkt 5CSXFC6C6U23I7N 5CSXFC6C6U23I7LN 5CSXFC6C6U23C8NES 5CSXFC6C6U23C8N 5CSXFC6C6U23C7N
Brand Intel Intel Intel Intel Intel Intel
Package 672-pin UBGA (U23) 23x23 mm 672-pin UBGA (U23) 23x23 mm - same 672-pin UBGA (U23) 23x23 mm - same 672-pin UBGA (U23) 23x23 mm - same 672-pin UBGA (U23) 23x23 mm - same 672-pin UBGA (U23) 23x23 mm - same
Logic Elements 110 K 110 K 110 K 110 K 110 K 110 K
Speed Grade C6 (I7) C6 (I7) C7 (LN) C8 (commercial) C8 (commercial) C7 (commercial)
Temperature Grade Industrial -40 C to +100 C Industrial -40 C to +100 C Industrial -40 C to +100 C Commercial 0 C to +85 C Commercial 0 C to +85 C Commercial 0 C to +85 C
Processor Dual ARM Cortex-A9 925 MHz Dual ARM Cortex-A9 925 MHz Dual ARM Cortex-A9 925 MHz Dual ARM Cortex-A9 925 MHz Dual ARM Cortex-A9 925 MHz Dual ARM Cortex-A9 925 MHz
Process Technology 28 nm low-power 28 nm low-power 28 nm low-power 28 nm low-power 28 nm low-power 28 nm low-power
Transceivers Integrated (per Cyclone V SX family) Integrated Integrated Integrated Integrated Integrated

Wichtigste Unterscheidungsmerkmale

  • Integrated dual ARM Cortex-A9 HPS eliminates external processor (vs. 5CSXFC6C6U23C8N (commercial temp variant))
  • 110K logic elements in 672-pin UBGA (U23) (vs. 5CSXFC4C6U23I7N (C4 family, lower LE count))
  • I7 industrial speed grade for factory-floor reliability (vs. 5CSXFC6C6U23C8N (C8 speed grade, commercial))

Designhinweise

The 5CSXFC6C6U23I7NTS requires multiple power rails: 1.0V core (VCC), 1.5V/1.8V/2.5V I/O banks (VCCIO), 2.5V PLL analog (VCCA_PLL), and 1.8V HPS analog rails (VCC_HPS, VCCAUX_HPS). Each rail needs its own 10uF + 0.1uF + 0.01uF capacitor network placed as close as possible to the relevant BGA balls. Intel recommends a 6-layer PCB with dedicated ground and 1.0V power planes under the device. Use a TI TPS650250 or equivalent PMIC for power-rail sequencing - the Cyclone V SX datasheet specifies that HPS rails must reach stable voltage before FPGA fabric rails. Estimated: total quiescent current at 25 C, all I/O static, is approximately 1.5 A on VCC and 0.4 A on each VCCIO bank; full-power operation under heavy HPS + FPGA load will draw significantly more.

The 672-pin UBGA (U23) package requires microvia (laser-drilled) PCB technology for BGA breakout. Stackup recommendation: 6-layer, 1 oz copper, with high-speed signal routing on the top three layers above the 1.0V core plane. Each BGA signal should escape via a dog-bone fanout with via-in-pad for the inner rows to keep breakout density manageable. Route HPS DDR3 byte lanes with matched-pair length-matching (target +/- 25 mil), 100 ohm differential impedance for transceivers, and length-matched source-synchronous interfaces per Intel's Cyclone V SoC PCB layout guidelines. Failure to follow these rules typically results in HPS boot failures or reduced transceiver eye margin.

Five pitfalls to avoid with the 5CSXFC6C6U23I7NTS: (1) Do not enable unused transceivers in Quartus Pin Planner - each active transceiver channel adds ~100 mW. (2) The MSEL pins must be tied to a stable configuration mode (AS/PS/JTAG) before POR - floating MSEL causes configuration failure. (3) The HPS warm-reset line must be debounced; otherwise transient noise can cause spurious HPS reboots. (4) Do not exceed 1.8V on any HPS GPIO or you will permanently damage the HPS bank. (5) When migrating between Cyclone V SX family members in the same UBGA U23 footprint, run a Quartus Fitter pin-migration report - not all pins are pin-compatible across speed grades.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
[Data Needed: Halogen-Free Status Not Explicitly Listed]
Konfliktmineralien
Compliant

RoHS and lead-free per Altera (Intel) product page. REACH compliance maintained through Intel substance-management program. AEC-Q100 is not applicable - this is industrial-grade; for automotive, consider Cyclone V SX automotive OPNs (5CSXFC6C6A7N family).

Daten verifiziert am: 2026-09-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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