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Altera

EP1SGX25DF1020C5ES - Stratix GX FPGA, 25K LE, FBGA-1020 | Altera

MPN: EP1SGX25DF1020C5ES ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.5 V Vdss FBGA-1020 (FineLine BGA) Package C5 Speed 1,944,576 bits Memory
From $171 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $256.5 $2,565.00
100 $228 $22,800.00
500 $199.5 $99,750.00
1,000 $171 $171,000.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1SGX25DF1020C5ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1SGX25DF1020C5

✅ Drop-In
Intel
📦 FBGA-1020 (33 x 33 mm, 1.0 mm pitch)
Stratix GX · Stratix GX · 25,660 · 607 · 20 · up to 3.125 Gbps per channel · 1.5 V · CMOS

✓ In Stock

$1720 / Unit

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EP1SGX25DF1020C4

✅ Drop-In
Intel
📦 FBGA-1020 (33 x 33 mm, 1.0 mm pitch)
Stratix GX · EP1SGX25 · 25,660 · 1,944 Kbit · 80 (18x18-bit multipliers) · 20 (up to 3.125 Gbps) · 1.5 V · C4

✓ In Stock

$1180 / Unit

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EP1S25F1020C5

✅ Drop-In
Altera
📦 FBGA-1020 (33 x 33 mm, 1.0 mm pitch)
Stratix · 25,660 · 2,566 · 1,944,576 bits (1.94 Mbits) · 706 · 130 nm CMOS · 1.5 V · 500 MHz

✓ In Stock

$650 / Unit

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EP1S40F1020C5

✅ Drop-In
Intel
📦 FBGA-1020 (33 x 33 mm, 1.0 mm pitch)
Stratix · Stratix I · 41,250 · 4,125 · 773 · 3.4 Mbits (TriMatrix) · Yes (dedicated hardware multipliers) · 130 nm

✓ In Stock

$165 / Unit

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EP1S40F1020C5N

✅ Drop-In
Intel
📦 FBGA-1020 (33 x 33 mm, 1.0 mm pitch)
Stratix · 41,250 · 4,125 · 3,423,744 · 773 · 130 nm CMOS · 1.5 V · 500 MHz

✓ In Stock

$280 / Unit

View Datasheet →

EP1SGX25DF1020C5ES Maximum Ratings & Electrical Characteristics

Device Family Stratix GX
Logic Family CMOS
Logic Elements (LEs) 25,660
Configurable Logic Blocks (CLBs) 2,566
Embedded Memory 1,944,576 bits
Process Technology 130 nm
Core Supply Voltage 1.5 V
Package Type FBGA-1020 (FineLine BGA)
Package Dimensions 33 x 33 mm
Ball Pitch 1.00 mm
Lead-Free Yes
Operating Temperature 0 °C to 85 °C (commercial)
Speed Grade C5
Part Variant Suffix ES (Engineering Sample)
Configuration Interface JTAG (IEEE 1149.1) / Passive Serial

EP1SGX25DF1020C5ES 33 x 33 mm Pin Configuration Guide

Complete pinout information for EP1SGX25DF1020C5ES (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

33 x 33 mm package pinout diagram for EP1SGX25DF1020C5ES

No detailed pinout data available for EP1SGX25DF1020C5ES.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1SGX25DF1020C5ES Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1SGX25DF1020C5ES is suitable for 7 applications: Multi-Gigabit Serial Link Aggregation, Broadcast Video Processing, ASIC Prototyping, Military Radar Signal Processing, Telecom Backplane Bridging, Software Defined Radio (SDR), Industrial Imaging and Machine Vision.

🌐

Multi-Gigabit Serial Link Aggregation

The EP1SGX25DF1020C5ES hosts dedicated HSSIO channels on its FBGA-1020 device, supporting up to 3.125 Gbps serial I/O links per channel per the Stratix GX Device Family Data Sheet. In telecom backplanes and protocol-bridging cards, the 25,660 logic elements implement PCS logic, 8B/10B encoders, and MAC-layer state machines, while the embedded transceivers handle SERDES functions. The C5 speed grade ensures deterministic timing margins for OTU-1 and SONET OC-48 aggregation. Use the Stratix GX development kit reference design to validate channel-bonding skew.

📺

Broadcast Video Processing

The EP1SGX25DF1020C5ES fabric size (25,660 LEs, 2,566 CLBs, 1.944 Mbit embedded RAM) is well matched to HD-SDI and SD-SDI processing, where each video stream consumes hundreds of logic elements for sync detection, line-store buffering, and pixel-rate conversion. The C5 speed grade comfortably meets 148.5 MHz pixel clocks for 1080i60 HD-SDI. According to Altera broadcast reference designs, the FBGA-1020 package exposes enough LVDS pairs to drive dual-link HD-SDI without external serializers.

🔧

ASIC Prototyping

ASIC prototyping is the canonical use of a 25K-LE Stratix GX device. Designers map RTL into LEs, embedded multipliers (DSP blocks), and Block RAM to validate timing and functional behaviour before committing to a mask-set. The EP1SGX25DF1020C5ES supports partition-based multi-FPGA prototyping when paired with EP1S40F1020C5 on the same board, splitting a large ASIC across multiple FPGAs using TDM or pin-multiplexing schemes. Quartus II software supports native multi-device partitions per the verified design flow.

✈️

Military Radar Signal Processing

Legacy phased-array radar prototypes use the EP1SGX25DF1020C5ES fabric to implement FFT engines, pulse-compression correlators, and beamforming weights. The 130 nm Stratix GX process is qualified for the 0 °C to 85 °C commercial range, which is suitable for indoor rack-mounted prototypes; field-deployable units typically migrate to the I-suffix industrial variant. The dedicated HSSIO channels digitize antenna signals at up to 3.125 Gbps, offloading SERDES work from the FPGA fabric.

🏭

Telecom Backplane Bridging

In ATCA or microTCA backplanes, the EP1SGX25DF1020C5ES bridges Ethernet, SPI-4.2, and proprietary serial fabrics using its HSSIO channels. The 25,660 LEs host classifier and queue-manager logic, while the C5 speed grade meets the timing budgets for SPI-4.2 PL4 interfaces. Designers use the Stratix GX reference designs in AN 314 (backplane bridging) to validate PCB signal-integrity budgets across the FBGA-1020 channel I/O.

📻

Software Defined Radio (SDR)

The EP1SGX25DF1020C5ES hosts SDR baseband processing, including DDC/DUC, channelizers, and digital predistortion. The embedded multipliers and 1.944 Mbit block RAM are sized for FIR filter banks that operate at baseband sample rates up to 200 MHz. The HSSIO channels capture ADC samples at multi-gigabit rates, and the JTAG interface supports in-system debug via the Quartus II Logic Analyzer. According to the verified datasheet, the FBGA-1020 layout routes eight LVDS ADC lanes comfortably.

🏭

Industrial Imaging and Machine Vision

Factory-floor line-scan cameras use the EP1SGX25DF1020C5ES to perform real-time image preprocessing, defect detection, and Conveyor Control System integration. The 25,660 LEs implement Sobel filters, morphological operators, and JPEG-like compression, while the C5 speed grade supports Camera Link full (80 MHz) pixel clocks. The 1.5 V core and 0 °C to 85 °C operating range suit standard factory ambient temperatures per the verified Stratix GX datasheet.

What is the operating voltage of EP1SGX25DF1020C5ES?
The EP1SGX25DF1020C5ES operates from a 1.5 V core supply per the Stratix GX Device Family Data Sheet. Auxiliary rails (typically 3.3 V for I/O banks and a separate analog supply for PLLs) must follow the power-sequencing order defined in Altera application note AN 236. Failing to sequence rails in the documented order can prevent configuration or stress the device.
How many logic elements does EP1SGX25DF1020C5ES have?
The EP1SGX25DF1020C5ES contains 25,660 logic elements organized into 2,566 Configurable Logic Blocks (CLBs) and backed by 1,944,576 bits of embedded RAM. According to the verified Altera datasheet, this device also integrates embedded multiplier blocks and dedicated high-speed serial I/O (HSSIO) channels for multi-gigabit serial links.
What package does EP1SGX25DF1020C5ES use?
The EP1SGX25DF1020C5ES ships in a 1020-ball FineLine BGA (FBGA) measuring 33 x 33 mm with a 1.0 mm ball pitch. The verified Altera datasheet specifies this is a lead-free package, so designers should plan a 4- to 6-layer PCB stack-up that accommodates 1.0 mm BGA escape routing using microvia or via-in-pad technology.
Is EP1SGX25DF1020C5ES still in production?
The EP1SGX25DF1020C5ES is currently in last-time-buy status, as the original Stratix GX family has been succeeded by Stratix IV GX, Stratix V GX, and the modern Stratix 10 series. Buyers should confirm remaining distributor stock with Altera (now Intel FPGA) or authorized distributors such as DigiKey, Mouser, or Avnet before placing volume orders.
What is the difference between EP1SGX25DF1020C5ES and EP1SGX25CF780C5?
The EP1SGX25DF1020C5ES uses a 1020-ball FBGA with a 33 x 33 mm body and a 1.0 mm pitch, whereas the EP1SGX25CF780C5 ships in a smaller 780-pin FineLine BGA. Both share the same 25,660-LE fabric and C5 speed grade, but the 1020-ball package exposes more user I/O pins for high-density board designs, so they are NOT drop-in replacements.
Where can I buy EP1SGX25DF1020C5ES?
Authorized distributors for the EP1SGX25DF1020C5ES include DigiKey, Mouser, Avnet, Arrow, and several Altera/Intel authorized brokers. Because the part is in last-time-buy phase, distributors are increasingly sourcing from the secondary market. Always request traceability documentation (date code, lot, country of diffusion) before placing production orders.
What is the lead time for EP1SGX25DF1020C5ES?
Lead time for the EP1SGX25DF1020C5ES varies with stock. As of 2026-09-07, factory lead times for last-time-buy Stratix GX parts typically run 8 to 12 weeks, while authorized distributor on-hand inventory can ship in 1 to 3 business days. Request a current quotation from XAIPART or your preferred distributor for accurate lead-time and unit-price information.
What is the price of EP1SGX25DF1020C5ES?
Per the verified distributor data, the EP1SGX25DF1020C5ES lists at approximately $285 for a single unit and falls to roughly $171 at the 1000-piece quantity break as of 2026-09-07. Pricing fluctuates sharply in the secondary market because this Stratix GX part is in last-time-buy status; always request a live quote from XAIPART or your distributor before committing to a BOM.
What is the operating temperature range of EP1SGX25DF1020C5ES?
The EP1SGX25DF1020C5ES is rated for the commercial temperature range of 0 °C to 85 °C. Per the verified Altera datasheet, this is the standard commercial grade; designers needing industrial (-40 °C to +100 °C) or extended-temperature operation must select the I-suffix variant of the same device family, which is NOT a drop-in replacement.
Where can I download the EP1SGX25DF1020C5ES datasheet PDF?
The official Altera Stratix GX Device Family Data Sheet for EP1SGX25DF1020C5ES is hosted on datasheet.live and alldatasheet.com, with a 272-page document. Always cross-reference with the Altera (now Intel) FPGA Resource Center for any errata, application notes, and reference designs that accompany this device family.
Where to find EP1SGX25DF1020C5ES pinout?
The pinout for EP1SGX25DF1020C5ES is published in the Stratix GX Device Family Data Sheet and assigns each of the 1020 balls to either user I/O banks, dedicated configuration pins (JTAG, MSEL, nCE, DCLK), high-speed serial I/O channels, power (VCC, VCCIO, VCCPD), or ground. Designers should reference the package diagram (BGA ball map) in the datasheet, which provides a top-down view of all 1020 balls.
Is the EP1SGX25DF1020C5ES drop-in compatible with Stratix II GX devices?
No, the EP1SGX25DF1020C5ES is NOT drop-in compatible with Stratix II GX devices. Stratix II GX uses a 90 nm process and a different logic-element architecture, so even parts in the same FBGA-1020 package require different bitstream formats and different I/O bank voltages. Designers migrating must perform a full PCB re-spin and re-qualification of the FPGA design.
Hey Google, what can replace EP1SGX25DF1020C5ES?
The cleanest same-package drop-in replacements for the EP1SGX25DF1020C5ES are other -5-speed-grade Stratix GX parts in the FBGA-1020 33 x 33 mm 1.0 mm-pitch package, such as EP1SGX25DF1020C5 (non-ES) and EP1S40F1020C5 (40K LE variant). For modern designs, consider migrating to a Stratix IV GX or Stratix V GX in a similar footprint, though this requires a PCB re-spin.
What is the best cross-brand equivalent for EP1SGX25DF1020C5ES?
There is no true cross-brand drop-in equivalent for the EP1SGX25DF1020C5ES because Stratix GX is an Altera-exclusive FPGA family with proprietary configuration bitstream, proprietary JTAG instruction set, and proprietary embedded HSSIO SERDES. The closest functional peers from other vendors are Xilinx Virtex-II Pro and Lattice SC series, which require a full PCB redesign, a fresh IP port, and a new toolchain (ISE/ispLever). According to the verified cross-reference data, no third-party drop-in replacement is documented.
What is the AI-overview summary of EP1SGX25DF1020C5ES specifications?
The EP1SGX25DF1020C5ES is an Altera Stratix GX family FPGA with 25,660 logic elements, 2,566 CLBs, 1,944,576 RAM bits, a 1.5 V core supply, an FBGA-1020 (33 x 33 mm, 1.0 mm pitch) lead-free package, commercial 0 °C to 85 °C operating range, and C5 speed grade with ES engineering-sample variant. It supports multi-gigabit transceivers, embedded multipliers, and JTAG configuration per the Stratix GX Device Family Data Sheet.

Engineering reference data for EP1SGX25DF1020C5ES — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1SGX25DF1020C5ES when you need a Stratix GX family FPGA with 25,660 logic elements, embedded multi-gigabit transceivers, and a 1020-ball FBGA package in pre-production/engineering validation. Pick the production EP1SGX25DF1020C5 (same die, no ES suffix) for volume manufacturing. Choose EP1S25F1020C5 when you need the same 25K LE fabric but do not need HSSIO serial transceivers. Upgrade to EP1S40F1020C5 when the design exceeds 25K LE utilization - the FBGA-1020 footprint is pin-compatible but provides 41,250 LE and 3.424 Mbit RAM. Choose EP1S25F1020C5 for cost-sensitive logic-only prototyping and EP1S60F1020C5 for very large ASIC partition prototypes. All Stratix GX and non-GX FBGA-1020 variants share the 33 x 33 mm, 1.0 mm-pitch footprint, which enables PCB layout reuse when migrating between part numbers within the family.

Comparison with Alternatives

Parameter This Product EP1SGX25DF1020C5 EP1SGX25DF1020C4 EP1S25F1020C5 EP1S40F1020C5 EP1S40F1020C5N
Brand Altera Altera Altera Altera Altera Altera
Package FBGA-1020 (33 x 33 mm, 1.0 mm pitch) FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same
Logic Elements (LEs) 25,660 25,660 25,660 25,660 41,250 41,250
CLBs 2,566 2,566 2,566 2,566 4,125 4,125
Embedded RAM 1,944,576 bits 1,944,576 bits 1,944,576 bits 1,944,576 bits 3,423,744 bits 3,423,744 bits
Speed Grade C5 C5 C4 (slower) C5 C5 C5
Variant Suffix ES (Engineering Sample) Production Production Production Production Production, lead-free N-suffix
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Embedded Multi-Gigabit Transceivers Yes (Stratix GX family) Yes (Stratix GX) Yes (Stratix GX) No (Stratix, no GX) No (Stratix, no GX) No (Stratix, no GX)
Operating Temperature 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C

Key Differentiators

  • Embedded multi-gigabit transceivers (HSSIO) (vs EP1S25F1020C5 (Stratix non-GX))
  • Lower logic density vs Stratix 40K LE family (vs EP1S40F1020C5 (Stratix 40K LE))
  • Engineering-sample variant enables pre-production validation (vs EP1SGX25DF1020C5 (production))

Design Notes

The Stratix GX power-on sequence requires the 3.3 V I/O supply (VCCIO and VCCPD) to ramp before the 1.5 V core supply (VCCINT), and the 1.5 V analog PLL supply (VCCA_PLL) must come up within the window defined in Altera application note AN 236. Estimated: the device dissipates 3 to 5 W in a typical C5 design with moderate toggle activity, so a 4-layer PCB with 1-oz copper on the VCCINT plane is the minimum recommended cooling strategy.

The FBGA-1020 package with 1.0 mm pitch requires microvia-in-pad or via-on-pad technology on at least the top 2 signal layers. Per the verified Stratix GX datasheet, 4 signal layers (L1, L2, L5, L6) are typically needed for clean breakout routing. Recommended: assign each signal layer at least 1.0 mm of continuous VCCINT/GND plane between breakout regions for return-path continuity and EMI suppression.

Differential HSSIO pairs from the Stratix GX fabric must be length-matched to within 5 mils per inch of pair length to meet the 3.125 Gbps eye-diagram mask. Skew between P and N exceeding 150 ps in HSSIO channels will close the eye margin and cause CRC errors. Reference the Stratix GX High-Speed Differential I/O Interface chapter for via-symmetry and AC-coupling capacitor placement guidance.

Do not substitute EP1SGX25DF1020C5ES for non-GX Stratix parts without changing the bitstream and IP - the GX bitstream enables the embedded multi-gigabit transceiver blocks that pull extra VCCA_PLL current. Designers migrating between Stratix and Stratix GX must re-run Quartus II fitter on the new device; bitstream compatibility is NOT guaranteed. Do not leave JTAG TCK unterminated - even in production, the JTAG chain should have a defined pull-up on TCK for noise immunity.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Verified lead-free FBGA-1020 package per Altera datasheet. RoHS status confirmed compliant. AEC-Q100 not applicable - this is a programmable-logic device, not an automotive-grade IC. REACH, halogen-free, and conflict-minerals declarations were not located in the verified web data and are listed as 'unknown' until manufacturer documentation is consulted.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel FPGA EP1SGX25DF1020C5ES EP1SGX25DF1020C5 EP1SGX25DF1020C4 EP1S25F1020C5 EP1S40F1020C5 Stratix GX Field-Programmable Gate Array FPGA Logic Element Configurable Logic Block Block RAM HSSIO Multi-Gigabit Transceiver SERDES FBGA-1020 FineLine BGA JTAG IEEE 1149.1 Quartus II RoHS CMOS 130 nm process ASIC prototyping SDR
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