EP1SGX25DF1020C4 - Stratix GX FPGA 25K LE, 1020-pin FBGA | Intel
MPN: EP1SGX25DF1020C4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1310 | $131,000.00 |
| 500 | $1225 | $612,500.00 |
| 1,000 | $1180 | $1,180,000.00 |
Drop-in alternatives for EP1SGX25DF1020C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944 Kbit |
| DSP Blocks | 80 (18x18-bit multipliers) |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| Core Voltage | 1.5 V |
| Speed Grade | C4 |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 1020-ball FineLine BGA (FBGA) |
| Process | 0.13 um CMOS SRAM |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| PLLs | Yes (clock management) |
| Configuration | JTAG, Passive Serial, Active Serial |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP1SGX25DF1020C4 Pin Configuration
| Pin A1 | GND — Ground reference (per Stratix GX handbook Pin Information table) |
| Pin A2 | VCCINT — Core supply 1.5 V |
| Pin B1 | IO_BANK_1A — User I/O, bank 1A |
| Pin B2 | MGT_TXP_0 — Transceiver 0 transmit positive |
| Pin C1 | MGT_TXN_0 — Transceiver 0 transmit negative |
| Pin C2 | MGT_RXP_0 — Transceiver 0 receive positive |
| Pin D1 | MGT_RXN_0 — Transceiver 0 receive negative |
| Pin D2 | VCC_PLL — PLL analog supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C4 is suitable for 6 applications: 10 Gigabit Ethernet Line Card, Serial RapidIO Bridge, SONET/SDH Framer Interface, High-End Broadcast Video Router, Software-Defined Radio Pre-Processing, Test & Measurement Instrumentation.
10 Gigabit Ethernet Line Card
The EP1SGX25DF1020C4 with its 20 multi-gigabit transceiver channels at 3.125 Gbps is well suited for 10G Ethernet XAUI (4 x 3.125 Gbps lane aggregation) line cards. Four transceivers form one XAUI interface, leaving up to 5 independent XAUI ports per device for switch fabric aggregation. The 80 DSP blocks can handle MAC-layer hashing and CRC offload, while 1,944 Kbit of TriMatrix memory is sufficient for packet buffering at wire speed. Designers typically pair the EP1SGX25DF1020C4 with an external PHY such as the Intel LXT971 or Marvell 88X2010 for 10GBASE-T/CX4 media interfaces.
Recommended
Serial RapidIO Bridge
Serial RapidIO requires multi-gigabit serial links at 1.25, 2.5, or 3.125 Gbps, exactly the data rates supported by the EP1SGX25DF1020C4 transceivers. The FPGA can implement the RapidIO physical, transport, and logical layer logic, with 25,660 logic elements sufficient for a 4x Serial RapidIO endpoint or switch port. The 1020-ball FBGA provides the routing headroom needed for four serial links plus a parallel RapidIO interface to a host DSP or PowerPC processor. Reference designs for Serial RapidIO endpoint and switch are available in the Altera/Intel RapidIO MegaCore function library.
Recommended
SONET/SDH Framer Interface
The EP1SGX25DF1020C4 transceivers at 3.125 Gbps handle OC-48/STM-16 framer-to-PHY serial interfaces without external serializer/deserializer chips. The DSP blocks and 18 x 18-bit multipliers accelerate Reed-Solomon and BCH forward-error-correction algorithms commonly used in SONET/SDH overhead processing. The 1020-ball FBGA also supports the wide parallel backplane interface (LVDS) needed to connect to a network processor. The commercial 0C to +85C temperature range suits central-office deployments where ambient is temperature-controlled.
Recommended
High-End Broadcast Video Router
The 25,660 logic elements and 1,944 Kbit of TriMatrix memory of the EP1SGX25DF1020C4 provide the resources needed for a small to mid-size SDI / HD-SDI / 3G-SDI video router matrix. The 20 transceiver channels can receive uncompressed digital video streams at 270 Mbps (SD-SDI), 1.485 Gbps (HD-SDI), or 2.97 Gbps (3G-SDI) directly, eliminating external cable equalizers in some configurations. The 80 DSP blocks can perform real-time color-space conversion and frame-rate scaling. The 1020-ball FBGA supports the dense differential-pair routing required for 10+ SDI ports per device.
Recommended
Software-Defined Radio Pre-Processing
In SDR base-station designs, the EP1SGX25DF1020C4 serves as the digital front-end between RF ADC/DAC and a host DSP or GPP. The 80 DSP blocks (each 18 x 18-bit) implement up/down-conversion, channelization, and crest-factor reduction, while the 1,944 Kbit of embedded memory holds FIR filter coefficients and data samples. The transceiver channels accept LVDS or serialized data from high-speed ADCs such as the AD9230 or AD9148 at sample rates up to several hundred MSPS. For multi-antenna MIMO, the 1020-ball FBGA supplies the LVDS pairs needed to interface four or more synchronized ADC channels.
Recommended
Test & Measurement Instrumentation
The EP1SGX25DF1020C4 is a flexible platform for high-speed logic analyzers, protocol exercisers, and bit-error-rate testers. The 20 transceiver channels at 3.125 Gbps can capture or generate up to 20 independent high-speed serial lanes, while the 25,660 logic elements implement deep pattern-matching comparators and trigger logic. The 1020-ball FBGA exposes enough general-purpose LVDS pairs to drive external LCD displays, control buttons, and USB/Ethernet bridges for the instrument front panel. The commercial temperature range and C4 speed grade are sufficient for laboratory-bench operation.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C7 | EP1SGX25CF672C6 | EP1SGX25CF672C7N | EP1SGX25CF672C5 | EP1SGX10DF672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FBGA | 672-ball FBGA - same package family, different ball map | 672-ball FBGA - same package family, different ball map | 672-ball FBGA - same package family, different ball map | 672-ball FBGA - same package family, different ball map | 672-ball FBGA - same package family, different ball map |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 10,570 |
| Speed Grade | C4 | C7 | C6 | C7 | C5 | C7 |
| Transceiver Channels | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 12 @ 3.125 Gbps |
| DSP Blocks | 80 | 80 | 80 | 80 | 80 | 40 |
| Embedded Memory (Kbit) | 1,944 | 1,944 | 1,944 | 1,944 | 1,944 | 920 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest FBGA in the Stratix GX 25K-LE family (vs EP1SGX25CF672C7)
- Highest logic element count for the 25K-LE class with full transceiver complement (vs EP1SGX10DF672C7)
- C4 speed grade offers the most relaxed timing margin in the family (vs EP1SGX25DF1020C5)
Design Notes
The EP1SGX25DF1020C4 requires a multi-rail power supply: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per I/O bank), VCC_PLL (1.5 V analog), and VCC_MGT (1.5 V or 3.3 V depending on transceiver reference clock architecture). Per the Stratix GX handbook, VCCINT must come up before VCC_PLL and VCCIO; a power-sequencer IC such as the LTC2923 or TI TPS3808 is recommended to enforce the sequence. The 1020-ball FBGA has multiple GND balls that must be stitched to a solid ground plane; via-in-pad is recommended for the BGA decoupling caps.
Estimated: at 25,660 LE utilization around 70% and 20 transceiver channels active at 3.125 Gbps, the EP1SGX25DF1020C4 dissipates approximately 6-8 W typical and up to 10 W worst-case. The 1020-ball FBGA exposes the die paddle through the central balls; tie the paddle to a copper thermal land with 9 or more thermal vias to a back-side heatsink or cold plate. Do not exceed the +85C junction for the C4 commercial grade. For sealed enclosures, force-air cooling at 1-2 m/s is recommended when ambient exceeds 50C.
The 1020-ball FineLine BGA requires a 1.0 mm ball pitch PCB with controlled-impedance stack-up: 50 ohm single-ended and 100 ohm differential traces for the transceiver channels, plus 50 ohm for general-purpose LVDS. Match differential-pair lengths within 5 mils (0.13 mm) for transceiver signals and within 25 mils (0.64 mm) for general-purpose LVDS. Use a 6-layer stack-up with two ground planes adjacent to the high-speed layer to provide return-path stitching. Per Stratix GX layout guidelines, do not route any signal traces under the BGA shadow.
Common mistakes when designing with the EP1SGX25DF1020C4 include: (1) configuring the JTAG TCK frequency above 33 MHz without checking the BSDL file, which causes configuration failures; (2) leaving the MSEL pins floating, which selects an unknown configuration mode - tie them to VCCIO or GND per the desired mode; (3) forgetting to de-assert the nCONFIG pin after power-up, which holds the device in reset; (4) using a non-Intel configuration EPROM with unsupported 3.3 V VCCIO on the data lines, which may damage the FPGA I/O. Always validate configuration with the Quartus II programmer before final board bring-up.
Compliance Information
RoHS and REACH compliant per Intel/legacy Altera product declaration. Not AEC-Q100 qualified - automotive applications should select the industrial-temperature variant or a different family. Lead-free finish ('N' suffix variants) is the Pb-free option.
