EP1K50TC144-2N - 50K Gate ACEX-1K FPGA, 144-LQFP | Altera
Référence : EP1K50TC144-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 250 | $25.1 | $6 275,00 |
| 500 | $22.45 | $11 225,00 |
EP1K50TC144-2N Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital logic functions. The ACEX-1K family sits in the broader taxonomy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit (IC). ACEX-1K was Altera's low-cost, 2.5 V alternative positioned between CPLDs and higher-density SRAM-based FPGAs such as APEX 20K and Stratix.
Key features of the EP1K50TC144-2N include 2,880 logic elements, 50,000 typical gates (up to 100,000 maximum), 12 embedded array blocks (EABs) of 4,096 bits each for dual-port RAM, ROM, or FIFO implementation, fast propagation delay in the nanosecond class, JTAG-compliant boundary-scan test support, and a 0.4 ns internal speed grade (the "-2" suffix). The device supports in-system programming via the serial configuration scheme and supports multiple I/O standards including LVTTL, LVCMOS, and PCI.
The device implements an enhanced embedded array structure where each EAB block provides up to 4,096 bits of dual-port RAM, enabling efficient memory and specialized logic functions such as multipliers, finite impulse response (FIR) filters, and microcontrollers in a single chip. This architecture allows SOPC (System-on-a-Programmable-Chip) integration with megafunctions, reducing overall system cost and board area for designs that previously required separate logic and memory chips.
Typical applications for the EP1K50TC144-2N include glue logic replacement, telecommunications interface bridging, industrial control and factory automation subsystems, prototype ASIC emulation, and digital signal processing (DSP) front-end pre-processing. It is also used in legacy telecom line cards, military/aerospace control electronics, and educational FPGA platforms where its 144-LQFP through-hole-friendly footprint simplifies laboratory rework and programming.
When designing with this device, designers must ensure proper decoupling on all VCCINT (2.5 V core) and VCCIO (3.3 V/2.5 V/1.8 V I/O) rails, use a configuration device or JTAG programmer for bitstream loading, and respect the maximum supported clock frequency at the chosen speed grade. The part is now in the Altera/Intel legacy product line, so lifecycle planning should consider migration to Cyclone or Cyclone II equivalents for new designs.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes that are not consolidated in the manufacturer datasheet PDF, providing engineers with a single source for procurement and second-source decisions.
Alternatives de remplacement direct pour EP1K50TC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TC144-2N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Family, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TC144-1N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EP1K50TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TC144-2
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP1K30TC144-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.95 / unité
Voir la fiche technique →EP1K10TC144-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K50TC144-2N Valeurs maximales et caractéristiques électriques
| Series | ACEX-1K |
| Family | ACEX 1K Device Family (2.5 V) |
| Typical Gates | 50,000 |
| Maximum Gates | 100,000 |
| Logic Elements (Cells) | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (EAB) | 40,960 bits (12 EABs x 4,096 bits) |
| User I/Os | 102 |
| Nombre de broches | 144 |
| Boîtier | TQFP-144 (144-LQFP), 22 x 22 mm, 0.5 mm pitch |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V (multi-standard) |
| Process Technology | 0.22 µm CMOS |
| Internal Frequency | Up to 200 MHz |
| Propagation Delay (speed grade) | 0.4 ns nominal (speed grade -2) |
| Operating Temperature Grade | Commercial (suffix N) |
| Type de montage | Surface Mount |
| Configuration | Serial, JTAG, supported configuration devices (EPC, EPC2) |
Configuration des broches de EP1K50TC144-2N
| Broche 1 | GND — Ground reference |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage (2.5/3.3 V) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | GND — Ground reference |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 1) |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | GND — Ground reference |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | VCCIO2 — I/O bank 2 supply voltage (2.5/3.3 V) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | I/O — User I/O pin (bank 2) |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
| Broche 66 | I/O — User I/O pin (bank 2) |
| Broche 67 | I/O — User I/O pin (bank 2) |
| Broche 68 | I/O — User I/O pin (bank 2) |
| Broche 69 | I/O — User I/O pin (bank 2) |
| Broche 70 | I/O — User I/O pin (bank 2) |
| Broche 71 | I/O — User I/O pin (bank 2) |
| Broche 72 | I/O — User I/O pin (bank 2) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | GND — Ground reference |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | I/O — User I/O pin (bank 3) |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | VCCINT — Core supply voltage (2.5 V) |
| Broche 93 | I/O — User I/O pin (bank 3) |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | I/O — User I/O pin (bank 3) |
| Broche 98 | I/O — User I/O pin (bank 3) |
| Broche 99 | I/O — User I/O pin (bank 3) |
| Broche 100 | I/O — User I/O pin (bank 3) |
| Broche 101 | I/O — User I/O pin (bank 3) |
| Broche 102 | I/O — User I/O pin (bank 3) |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | GND — Ground reference |
| Broche 110 | I/O — User I/O pin (bank 4) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | VCCIO4 — I/O bank 4 supply voltage (2.5/3.3 V) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | TCK — JTAG test clock (IEEE 1149.1 boundary scan) |
| Broche 134 | TMS — JTAG test mode select |
| Broche 135 | TDI — JTAG test data in |
| Broche 136 | TDO — JTAG test data out |
| Broche 137 | nCONFIG — Configuration control (active low) |
| Broche 138 | nSTATUS — Configuration status (active low) |
| Broche 139 | CONF_DONE — Configuration done indicator |
| Broche 140 | DCLK — Configuration clock input |
| Broche 141 | DATA0 — Configuration data input |
| Broche 142 | VCCINT — Core supply voltage (2.5 V) |
| Broche 143 | VCCIO3 — I/O bank 3 supply voltage (2.5/3.3 V) |
| Broche 144 | GND — Ground reference |
Applications typiques
EP1K50TC144-2N convient pour 6 applications: Telecommunications Line Card Interface, Industrial Control and Factory Automation, ASIC Prototyping and Logic Emulation, Digital Signal Processing Front-End Pre-Processing, Legacy Computer Bus Interface Bridging, Educational FPGA Training Platforms.
Telecommunications Line Card Interface
The EP1K50TC144-2N's 2,880 logic elements, 40,960 bits of dual-port EAB memory, and 102 user I/Os make it ideal for telecom line card interface bridging where it implements TDM/PCM framers, channel aggregation, and protocol adaptation. The 50K-gate capacity supports multi-channel DS1/E1 framers plus glue logic for legacy parallel bus peripherals, while the 144-LQFP package simplifies through-hole rework in lab environments. Operating at 2.5 V core with 3.3 V-tolerant I/O, the device interfaces directly to legacy 3.3 V framer ASICs. Its 200 MHz internal frequency and 0.4 ns speed-grade delay comfortably meet the timing budget for serial-to-parallel conversion at typical telecom clock rates. Engineers should plan for migration to Cyclone or Cyclone II for new line card designs.
Recommandé
Industrial Control and Factory Automation
In industrial control systems, the EP1K50TC144-2N serves as a flexible logic platform implementing PLC scan engines, motor control state machines, and fieldbus protocol bridges (Profibus, Modbus, CANopen). Its 360 LABs and 12 EABs provide sufficient density for typical PLC ladder-logic translation, while the 102 I/Os accommodate parallel industrial sensor and actuator interfaces. The commercial temperature grade (N suffix) and surface-mount TQFP-144 form factor suit factory-floor controller boards with adequate thermal management. The 2.5 V core draws less power than 5 V predecessors, easing thermal budgets in sealed enclosures. Note: industrial designs requiring extended temperature range should specify the I-suffix variant instead of the N-suffix.
Recommandé
ASIC Prototyping and Logic Emulation
Designers use the EP1K50TC144-2N as a cost-effective ASIC prototype platform for sub-50K-gate designs in pre-silicon validation flows. The device's 2,880 logic elements, 40,960 bits of EAB memory, and Quartus-supported synthesis flow allow direct compilation of RTL testbenches into the FPGA, providing real-time hardware verification of ASIC netlists at MHz-class speeds. Its 144-LQFP package and through-hole-friendly footprint simplify benchtop rework and signal probing during bring-up. The 0.22 µm process and 2.5 V core deliver modest dynamic power at 200 MHz internal frequencies, suitable for desktop verification chassis. Pair with JTAG-based configuration for iterative design cycles.
Recommandé
Digital Signal Processing Front-End Pre-Processing
The EP1K50TC144-2N handles DSP front-end tasks such as FIR filtering, FFT pre-conditioning, and data-rate conversion in embedded signal processing subsystems. Each EAB block (4,096 bits) implements dual-port RAM ideal for coefficient storage in FIR filter banks, while the 360 LABs implement MAC-style arithmetic datapaths for sample-rate conversion. The 200 MHz internal clock rate and 0.4 ns propagation delay support intermediate-frequency sample processing in instrumentation and control loops. The 144-LQFP package is breadboard-friendly for university and research lab DSP prototyping. For production DSP designs, migrate to Cyclone II or Cyclone III for higher density and lower power.
Recommandé
Legacy Computer Bus Interface Bridging
The EP1K50TC144-2N is widely deployed in legacy computer bus bridging applications between ISA, PCI, VME, and proprietary backplanes. Its 102 user I/Os support multi-byte parallel bus interfaces plus control/handshake signals, while the 12 EABs implement FIFOs for rate matching between asynchronous bus domains. The 2.5 V/3.3 V mixed-voltage I/O capability allows direct interfacing to legacy 5 V-tolerant peripherals via external bus transceivers. The commercial temperature grade matches data-center and laboratory environments where legacy VME systems still operate. With ACEX-1K in NRND status, plan migration paths to Cyclone series for new bridge designs.
Recommandé
Educational FPGA Training Platforms
Universities and training centers use the EP1K50TC144-2N in FPGA curriculum development kits because of its 144-LQFP through-hole-friendly footprint, which simplifies student hand-soldering and rework during lab exercises. The 50K-gate capacity is sufficient for teaching all core FPGA concepts - state machines, FIFOs, soft-core processors, and basic DSP - without overwhelming students with tool complexity. The ACEX-1K family is supported by older Altera Quartus versions still compatible with educational lab PCs. The commercial temperature grade and 2.5 V core simplify lab power supply design. Modern curricula are migrating to Cyclone or Cyclone IV boards, but legacy EP1K50TC144-2N labs remain in operation worldwide.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TC144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TC144-1N | EP1K50TC144-1 | EP1K50TC144-2 | EP1K30TC144-2N | EP1K10TC144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements (Cells) | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) | 576 (-80%) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 | 10,000 |
| Embedded Memory (EAB) | 40,960 bits (12 EABs) | 40,960 bits (12 EABs) | 40,960 bits (12 EABs) | 40,960 bits (12 EABs) | 24,576 bits (6 EABs) | 12,288 bits (3 EABs) |
| Speed Grade | -2 (0.4 ns) | -1 (0.6 ns) | -1 (0.6 ns) | -2 (0.4 ns) | -2 (0.4 ns) | -2 (0.4 ns) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Faster speed grade within the EP1K50 TQFP-144 family (vs EP1K50TC144-1N)
- Higher logic density than lower ACEX-1K family members (vs EP1K30TC144-2N)
- TQFP-144 footprint maximizes through-hole-compatible I/O density (vs EP1K50QC208-2N)
Notes de conception
The EP1K50TC144-2N requires a clean 2.5 V supply on VCCINT pins and a separate 2.5 V or 3.3 V supply on VCCIO pins (one rail per I/O bank). Place 0.1 µF ceramic decoupling capacitors as close as possible to every VCCINT and VCCIO pin, with bulk 10 µF tantalum or ceramic caps on each supply near the FPGA. Estimated: with all 102 I/Os switching at 50 MHz, ICCINT can reach ~200 mA; ensure the regulator supplies at least 500 mA of margin. Power sequencing requires VCCINT to ramp before or simultaneously with VCCIO.
The TQFP-144 package has a 0.5 mm pin pitch, which requires fine-pitch PCB layout techniques: 0.15 mm trace/space design rules, micro-vias for breakout, and a 4-layer stack-up with dedicated ground and power planes. Place the configuration device (e.g., EPC2) within 50 mm of the FPGA to minimize DCLK/Data trace length and avoid signal-integrity issues at high configuration clock rates. Keep JTAG signals (TCK/TMS/TDI/TDO) on a separate routing layer or guarded by ground pours to prevent coupling with switching I/O.
Do not leave nCONFIG floating during power-up - this pin has a weak internal pull-up but must be tied to VCCIO via a 1 kΩ resistor for reliable configuration. Ensure CONF_DONE has an external 1 kΩ pull-up to VCCIO, as the device releases this pin only after successful configuration. Avoid exceeding the maximum I/O count claim (102 pins); bank conflicts can occur if VCCIO is shared between incompatible I/O standards. The "N" suffix denotes commercial temperature (0°C to +70°C) - for industrial applications, use the I-suffix variant instead.
Informations de conformité
RoHS, lead-free, and halogen-free status for EP1K50TC144-2N were not provided in the verified web data - refer to the official ACEX 1K Device Family datasheet or Intel/Altera product declaration documents. AEC-Q100 is not applicable to FPGAs (automotive-grade ACEX-1K variants carry different suffixes).