EP1S25F672I7N - 25,660 LE Stratix FPGA, 672-FBGA | Intel / Altera
MPN: EP1S25F672I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $125.4 | $125,400.00 |
Drop-in alternatives for EP1S25F672I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S25F672I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Embedded Memory | 1.9 Mbit TriMatrix |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | 672-ball FineLine BGA, 35 x 35 mm, 1.27 mm pitch |
| User I/O Pins | 473 |
| Maximum Operating Frequency | 420 MHz (internal) |
| Operating Temperature | 0 °C to 85 °C (Industrial) |
| Speed Grade | -7 |
| Mounting Type | Surface Mount (SMT) |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG |
| DSP Blocks | Dedicated 18 x 18 multipliers |
EP1S25F672I7N 672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1S25F672I7N (672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch package) with 473 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672I7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 473 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F672I7N is suitable for 6 applications: Telecom Line-Card Packet Processing, ASIC Prototyping and Emulation, Industrial Machine Vision, Software-Defined Radio Baseband, Military and Aerospace Signal Processing, Medical Imaging Accelerator.
Telecom Line-Card Packet Processing
The EP1S25F672I7N's 25,660 logic elements and 1.9 Mbit TriMatrix memory suit wire-speed packet classification and queuing engines in telecom line cards. At a -7 speed grade it sustains internal clocks near 420 MHz, enabling OC-48/STM-16 (2.488 Gbps) class data plane processing without external TCAM. Place Ethernet framer and SERDES glue logic in fabric, push flow tables into M4K blocks, and use dedicated multipliers for hashing. The 473 user I/O let designers fan out to multiple SFP/uplink SERDES. Industrial temperature supports outdoor cabinet deployments.
Recommended
ASIC Prototyping and Emulation
Designers targeting ASIC tape-out use the EP1S25F672I7N as an emulation vehicle for sub-million-gate RTL. Its 1.5 V Stratix architecture and Quartus II support make pre-silicon validation of ASIC RTL straightforward, with the 672-FBGA exposing enough I/O to model 473 signal pins plus JTAG and clock pins. Industrial temperature allows in-circuit emulation under stress. For multi-FPGA partitioning the larger EP1S40/EP1S60 parts extend capacity while keeping the Quartus flow identical.
Recommended
Industrial Machine Vision
Camera-link and CoaXPress front-end image processing pipelines fit naturally inside the EP1S25F672I7N. Dedicated 18×18 multipliers and 1.9 Mbit TriMatrix memory handle Bayer demosaicing, color-space conversion, and edge detection at gigapixel/sec rates. Industrial temperature grade (0-85C) supports factory-floor enclosures. The 672-FBGA exposes enough user I/O to sink Camera-Link LVDS pairs directly into the FPGA without external transceivers, lowering BOM cost in vision-system designs.
Recommended
Software-Defined Radio Baseband
The 1.5 V Stratix silicon in EP1S25F672I7N hosts wide-band digital down/up-converters and channelizers for software-defined radio. Embedded multipliers accelerate complex FFT/iFFT operations, while TriMatrix memory stages overlap-save buffers. Paired with external ADC/DAC, the FPGA implements full IF-to-baseband processing for narrow-band tactical radios. Industrial temperature and the mature Quartus II toolchain keep legacy SDR platforms supportable, although new designs should consider Cyclone V or Stratix V for active long-term supply.
Recommended
Military and Aerospace Signal Processing
Defense-grade signal-processing subsystems benefit from the EP1S25F672I7N's industrial temperature range and mature Altera silicon, though true MIL-spec flow requires separate screening. Radar pre-processing, electronic-warfare channelizers, and secure-comm DSP fit inside 25,660 LEs and 1.9 Mbit memory. The 672-FBGA's 1.27 mm pitch balances I/O count with PCB manufacturability. Programs already fielded with original Stratix can sustain production through obsolescence-mitigation brokers sourcing this exact MPN.
Recommended
Medical Imaging Accelerator
Ultrasound beamforming and MRI reconstruction engines map cleanly onto the EP1S25F672I7N's parallel fabric. The 1.9 Mbit TriMatrix memory holds beamformed line buffers; 18×18 multipliers implement FIR/IIR filters and complex mixers for quadrature demodulation. The 672-FBGA exposes enough LVDS pairs to receive raw transducer data directly, while the industrial temperature range supports imaging-cart environments. Mature Quartus II IP libraries (FFT, FIR, NCO) shorten development cycles for FDA-cleared medical platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672I7 | EP1S25F672C8N | EP1S25F672C7N | EP1S25F672C7 | EP1S25F672C6N | EP1S25F672C6 |
|---|---|---|---|---|---|---|---|
| Package | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm - same | 672-ball FBGA, 35x35 mm - same | 672-ball FBGA, 35x35 mm - same | 672-ball FBGA, 35x35 mm - same | 672-ball FBGA, 35x35 mm - same | 672-ball FBGA, 35x35 mm - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix | 1.9 Mbit TriMatrix |
| Speed Grade | -7 | -7 | -8 (faster) | -7 | -7 | -6 (slower) | -6 (slower) |
| Operating Temperature | 0 °C to 85 °C (Industrial) | 0 °C to 85 °C (Industrial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) |
| Lead-Free (-N suffix) | Yes | No (tin-lead) | Yes | Yes | No (tin-lead) | Yes | No (tin-lead) |
| Approximate Unit Price (qty 100, USD) | 152.00 | 145.00 | 165.00 | 148.00 | 142.00 | 135.00 | 130.00 |
Key Differentiators
- Industrial temperature grade with lead-free finish (vs EP1S25F672C7N)
- Balanced speed-grade and temperature envelope (vs EP1S25F672C8N)
- Single-die configuration across same package (vs EP1S25F1020C6)
Design Notes
Estimated: at full logic utilization and 420 MHz internal clocks, the EP1S25F672I7N can draw 1.5–2.0 A from the 1.5 V core rail plus per-bank VCCIO. Use a low-impedance power plane with bulk and high-frequency decoupling (220 µF bulk + 10 µF + 0.1 µF + 1 nF) within 5 mm of each BGA quadrant. Sequence VCCINT before VCCIO if your downstream devices require it; Stratix allows simultaneous ramp but a slight delay improves inrush behavior.
Estimated: at 1.5 V × 2 A core plus typical I/O switching, total dissipation is roughly 4 W. The 672-FBGA has no exposed top-side heatsink path, so cooling relies on copper pour under the package plus package-top airflow. Keep junction-to-ambient below 35 °C/W for industrial operation. For sealed enclosures, add a 10 × 10 mm copper slug directly under the BGA footprint to spread heat into inner PCB layers.
The 672-ball FineLine BGA uses 1.27 mm pitch and 35 × 35 mm body, requiring microvia or laser-drilled via technology for inner escape. Stack the PCB at minimum 6 layers with two dedicated GND planes adjacent to the BGA. Per JEDEC J-STD-020, the package supports reflow profiles up to 260 °C peak. Use ENIG or OSP surface finish for fine-pitch BGA reliability.
Do not confuse the EP1S25F672I7N with the EP1S25F1020 variants — the 1020-ball package exposes more I/O but is pin-incompatible with 672-ball designs. Use Altera Quartus II 13.0sp1 (final version with original Stratix support) — newer Quartus Prime releases dropped original Stratix synthesis. Confirm date code and country of origin when sourcing from broker channels to avoid counterfeit risk on legacy FPGAs.
Compliance Information
RoHS compliance inferred from -N lead-free suffix per Altera package specification; REACH, halogen-free, and conflict-mineral statements not explicitly found in the provided Verified Web Data — set to unknown per data authenticity rules. AEC-Q100 is not applicable as this is a digital logic device, not an automotive-grade analog IC.
