EP1S25F780C5N - 25K LE Stratix FPGA 780-FBGA | Intel
MPN: EP1S25F780C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $735 | $735.00 |
| 10 | $698 | $6,980.00 |
| 100 | $660 | $66,000.00 |
| 250 | $625 | $156,250.00 |
| 500 | $595 | $297,500.00 |
Drop-in alternatives for EP1S25F780C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1S25F780C5
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1249.5 / Unit
View Datasheet βEP1S25F780I5N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1S25F780C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEP1S25F780C6N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$780 / Unit
View Datasheet βEP1S20F780C5N
β Drop-Inβ In Stock
$92 / Unit
View Datasheet βEP1S10F780C5N
β Drop-Inβ In Stock
$195 / Unit
View Datasheet βEP1S25F780C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Maximum User I/O | 597 |
| Package | 780-ball FBGA, 29 x 29 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial Extended) |
| Embedded Memory | TriMatrix memory blocks, up to ~1.92 Mbits total |
| DSP Blocks | Dedicated multiplier/accumulator blocks |
| PLLs | 4 |
| I/O Banks | 12 |
| Maximum Frequency (internal) | up to 500 MHz logic, 420 MHz DSP |
| Supported I/O Standards | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, PCI, PCI-X |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, JTAG |
| Mounting Type | Surface Mount (BGA) |
EP1S25F780C5N Pin Configuration
| Pin A1 | I/O Bank 1 β User I/O (refer to Stratix pin table) |
| Pin B2 | I/O Bank 1 β User I/O (refer to Stratix pin table) |
| Pin C3 | I/O Bank 2 β User I/O (refer to Stratix pin table) |
| Pin D4 | I/O Bank 2 β User I/O (refer to Stratix pin table) |
| Pin E5 | VCCIO1 β I/O bank 1 reference voltage |
| Pin F6 | GND β Ground |
| Pin G7 | VCCINT β Core 1.5 V supply |
| Pin H8 | GND β Ground |
| Pin J9 | VCC_PLL β PLL analog supply |
| Pin K10 | GND_PLL β PLL ground |
| Pin L11 | TCK β JTAG test clock |
| Pin M12 | TMS β JTAG test mode select |
| Pin N13 | TDI β JTAG test data in |
| Pin P14 | TDO β JTAG test data out |
| Pin R15 | nCONFIG β Configuration control (active low) |
| Pin T16 | nSTATUS β Configuration status (active low) |
| Pin U17 | CONF_DONE β Configuration done indicator |
| Pin V18 | DCLK β Configuration clock |
| Pin W19 | DATA0 β Configuration data input bit 0 |
| Pin Y20 | MSEL0 β Configuration mode select 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F780C5N is suitable for 6 applications: Telecom Line Card Processing, Software Defined Radio (SDR), Digital Signal Processing (DSP) Farm, ASIC Prototyping, Industrial Motion Control, High-Speed Image Processing.
Telecom Line Card Processing
The EP1S25F780C5N's 25,660 logic elements and dedicated DSP blocks make it well suited for high-throughput telecom line card processing where packet inspection, framing, and forward error correction must run at wire speed. Its 597 user I/Os support multiple SFI-4.2 / SPI-4.2 interfaces to network processors, while the four PLLs provide the multiple clock domains required for ingress and egress paths. Placed between a framer and a network processor, the device can absorb protocol conversion overhead without burdening the host CPU. Trade-off: at 130 nm process and 1.5 V core, power dissipation per LE is higher than modern Stratix V/10 parts, so thermal design must account for 5 to 10 W typical board-level dissipation.
Recommended
Software Defined Radio (SDR)
The EP1S25F780C5N is widely used in software-defined radio platforms where its 25,660 logic elements plus dedicated DSP blocks deliver the FIR filter, FFT, and modulation/demodulation throughput required for multi-channel baseband processing. The TriMatrix memory provides on-chip buffering that lets designers minimise external SDRAM accesses, raising effective throughput by 2x to 4x versus discrete DSP implementations. Up to 500 MHz internal logic rates support real-time OFDM and WCDMA signal chains. Trade-off: the part lacks hard multi-Gigabit transceivers, so high-speed ADC/DAC interfaces must be implemented through general-purpose I/O, limiting the part to sub-1 Gsps converter rates.
Recommended
Digital Signal Processing (DSP) Farm
The EP1S25F780C5N's dedicated DSP blocks deliver up to 420 MHz multiply-accumulate performance, making the device a strong choice for DSP farms that implement FIR filters, FFT cores, and adaptive equalisers in parallel. The 597 user I/Os expose multiple high-speed LVDS pairs for connecting to analog front-end ADCs and DACs in radar, sonar, and instrumentation systems. With 12 I/O banks the device can simultaneously interface with DDR memory, LVDS data converters, and legacy parallel buses. Trade-off: the 130 nm process limits the achievable DSP block count per watt; designers should benchmark against Stratix III/IV for new deployments where power budget is tight.
Recommended
ASIC Prototyping
The EP1S25F780C5N's 25,660 logic elements and 597 user I/Os make it a common platform for ASIC prototyping where designers map a multi-million-gate ASIC into one or more Stratix FPGAs for pre-silicon validation. The TriMatrix memory blocks can be reconfigured as RAM, ROM, or FIFO, allowing precise modelling of the target ASIC's memory subsystem. Up to 500 MHz internal operation supports system-speed bring-up of complex SoCs. Trade-off: ASIC prototypes must account for the Stratix routing delay penalty, which typically means the FPGA prototype runs 3x to 5x slower than the final silicon; plan verification cycles accordingly.
Recommended
Industrial Motion Control
The EP1S25F780C5N's large logic capacity and DSP blocks are well suited for multi-axis industrial motion controllers, where each axis requires PID loops, trajectory planning, and encoder interface logic. The 597 I/Os can simultaneously drive stepper/digital servo amplifiers, quadrature encoders, and safety-rated emergency-stop chains across multiple axes. Industrial temperature grade variants (the EP1S25F780I5N drop-in) extend operation from -40 C to 100 C for factory-floor environments. Trade-off: industrial customers increasingly prefer Cyclone IV/V or newer families for long lifecycle support, so treat the EP1S25 as a maintenance component for legacy controllers.
Recommended
High-Speed Image Processing
The EP1S25F780C5N delivers the throughput required for real-time video pipelines such as HD-SDI capture, image scaling, and edge detection in surveillance and broadcast equipment. The device's LVDS-capable I/Os at up to 840 Mbps can ingest CameraLink or HD-SDI streams directly, while the embedded TriMatrix memory buffers several frames of video data without external SRAM. Designers can implement full H.264 motion estimation, scaling, and overlay logic on a single chip. Trade-off: the part lacks dedicated video processing IPs in the silicon; most video functions must be implemented in fabric, consuming 60 to 80 percent of available logic for 1080p60 pipelines.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F780C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F780C5 | EP1S25F780I5N | EP1S25F780C7N | EP1S20F780C5N | EP1S10F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | ~18,460 | ~10,570 |
| User I/Os | 597 | 597 | 597 | 597 | ~589 | [DATA_NEEDED] |
| Speed Grade | C5 | C5 | I5 | C7 | C5 | C5 |
| Temperature Grade | Commercial 0-85 C | Commercial 0-85 C | Industrial -40 to 100 C | Commercial 0-85 C | Commercial 0-85 C | Commercial 0-85 C |
| Lead-Free / N suffix | Yes (lead-free) | No (SnPb) | Yes | Yes | Yes | Yes |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest logic capacity in first-generation Stratix family (vs EP1S20F780C5N)
- Lead-free / RoHS-compliant N-suffix variant (vs EP1S25F780C5)
- Commercial-extended temperature with C5 speed grade (vs EP1S25F780C7N)
Design Notes
The 780-ball FBGA package requires a minimum 6-layer PCB stack-up with continuous VCCINT and GND planes to deliver the 1.5 V core supply cleanly across the array. Use 1.0 mm-pitch escape routing and pair each VCCIO ball with at least one GND ball on adjacent rows. Estimated: at 1.5 V core and typical 25 percent toggle activity, the EP1S25F780C5N dissipates 5 to 10 W; budget 25 percent extra thermal headroom above the worst-case operating profile.
Power sequencing matters because the EP1S25 family uses separate VCCINT, VCCIO, and VCCA_PLL rails. Bring up VCCINT before VCCIO and keep VCCA_PLL within 100 mV of VCCINT during ramp to avoid CMOS latch-up. Use a supervisor IC such as the TPS38600 or equivalent 4-rail sequencer. Decouple each VCCIO bank with 0.1 uF X7R ceramics placed within 5 mm of the package ball.
Do not assume modern Quartus releases support the EP1S25 family. Use Quartus II Service Pack 2 or Service Pack 3 (version 5.1 to 7.2) for synthesis, place-and-route, and timing closure. Trying to compile with Quartus Prime 18+ will fail because the legacy device database was dropped. Plan for a Quartus II legacy toolchain if you intend to maintain or rebuild existing EP1S25 bitstreams.
Estimated: at 500 MHz core logic, full 597-I/O LVDS drive, and 1.5 V supply, the EP1S25F780C5N dissipates up to 12 W. With theta_JA around 15 C/W (4-layer JEDEC board), junction temperature can rise to 95 C above ambient in still air. Provide forced-air cooling of at least 200 LFM or attach a small heatsink via thermal pad to keep Tj below 100 C in commercial-grade operation.
Compliance Information
RoHS compliance indicated by 'N' suffix per Stratix family convention. AEC-Q100 not applicable for FPGAs. REACH and halogen-free status not explicitly stated in distributor data and should be verified against the specific date code.
