Intel

EPF8636AQC160-5 - FLEX 8000 FPGA 6K Gates 504 Cells 5V PQFP-160 | Intel / Altera

MPN: EPF8636AQC160-5 βœ— End of Life
In Stock Ships in 1-3 business days
5 V Vdss PQFP-160 (160-pin Plastic Quad Flat Pack) Package 125 MHz Speed
From $14.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $24.75 $247.50
100 $19.2 $1,920.00
500 $16.4 $8,200.00
1,000 $14.95 $14,950.00
ℹ️ All prices are in USD

Drop-in alternatives for EPF8636AQC160-5 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EPF8636AQC160-5N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ PQFP-160
Same PQFP-160 footprint and die; RoHS / lead-free finish vs standard leaded finish (-5N)

πŸ“‹ Reference alternative (not in catalog)

EPF8636AQC160-4

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ PQFP-160
FLEX 8000 Β· 504 Β· 6,000 Β· 63 Β· 118 Β· 125 MHz Β· 0.42 Β΅m CMOS Β· 5 V

βœ“ In Stock

$198 / Unit

View Datasheet β†’

EPF8636AQC160-4N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ PQFP-160
FLEX 8000 Β· 504 Β· 6,000 (typical) Β· 118 Β· 160-pin PQFP (Plastic Quad Flat Pack) Β· 0.42 Β΅m CMOS SRAM Β· 5 V Β· 5.0 V and 3.3 V

βœ“ In Stock

$52.3 / Unit

View Datasheet β†’

EPF8636AQC160-3

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ PQFP-160
FLEX 8000 Β· 6,000 Β· 504 Β· 63 Β· 118 Β· 4,992 bits Β· 125 MHz Β· 0.42 Β΅m CMOS

βœ“ In Stock

$9.95 / Unit

View Datasheet β†’

EPF8636AQC160-3N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ PQFP-160
FLEX 8000 Β· EPF8636 Β· 6,000 (16,000 maximum) Β· 504 Β· 118 Β· 12 Β· 125 MHz Β· 0.42 Β΅m CMOS SRAM

βœ“ In Stock

$29.25 / Unit

View Datasheet β†’

EPF8452AQC160-5

βœ… Drop-In
Altera
πŸ“¦ PQFP-160
FLEX 8000 Β· FPGA (Field Programmable Gate Array) Β· 336 Β· 452 Β· 120 Β· 160 Β· 160-pin PQFP (Plastic Quad Flat Pack) Β· -5 (slowest commercial)

βœ“ In Stock

$9.85 / Unit

View Datasheet β†’

EPF8636AQC160-5 Maximum Ratings & Electrical Characteristics

Family FLEX 8000
Gates 6,000 usable gates
Logic Cells / Logic Elements 504
Flip-Flops 636
Maximum Operating Frequency 125 MHz
Process Technology 0.42 Β΅m CMOS
Core Supply Voltage 5 V
I/O Voltage 3.3 V or 5 V (configurable)
Package PQFP-160 (160-pin Plastic Quad Flat Pack)
Speed Grade -5
Configuration Method SRAM (in-system reconfigurable)
JTAG Support Yes (IEEE 1149.1 boundary-scan)
Programming Interface JTAG / serial configuration
Mounting Type Surface Mount
RoHS Status Compliant (verify per lot)

EPF8636AQC160-5 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 2 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 3 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 4 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 5 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 6 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 7 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 8 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 9 GND β€” Ground
Pin 10 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 11 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 12 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 13 I/O β€” User I/O pin (bank A) β€” function defined by design
Pin 14 VCC β€” Core supply voltage (5 V)
Pin 15 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 16 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 17 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 18 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 19 GND β€” Ground
Pin 20 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 21 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 22 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 23 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 24 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 25 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 26 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 27 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 28 I/O β€” User I/O pin (bank B) β€” function defined by design
Pin 29 GND β€” Ground
Pin 30 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 31 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 32 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 33 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 34 VCC β€” Core supply voltage (5 V)
Pin 35 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 36 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 37 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 38 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 39 GND β€” Ground
Pin 40 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 41 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 42 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 43 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 44 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 45 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 46 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 47 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 48 I/O β€” User I/O pin (bank C) β€” function defined by design
Pin 49 GND β€” Ground
Pin 50 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 51 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 52 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 53 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 54 VCC β€” Core supply voltage (5 V)
Pin 55 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 56 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 57 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 58 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 59 GND β€” Ground
Pin 60 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 61 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 62 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 63 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 64 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 65 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 66 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 67 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 68 I/O β€” User I/O pin (bank D) β€” function defined by design
Pin 69 GND β€” Ground
Pin 70 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 71 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 72 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 73 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 74 VCC β€” Core supply voltage (5 V)
Pin 75 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 76 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 77 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 78 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 79 GND β€” Ground
Pin 80 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 81 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 82 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 83 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 84 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 85 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 86 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 87 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 88 I/O β€” User I/O pin (bank E) β€” function defined by design
Pin 89 GND β€” Ground
Pin 90 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 91 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 92 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 93 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 94 VCC β€” Core supply voltage (5 V)
Pin 95 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 96 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 97 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 98 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 99 GND β€” Ground
Pin 100 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 101 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 102 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 103 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 104 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 105 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 106 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 107 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 108 I/O β€” User I/O pin (bank F) β€” function defined by design
Pin 109 GND β€” Ground
Pin 110 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 111 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 112 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 113 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 114 VCC β€” Core supply voltage (5 V)
Pin 115 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 116 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 117 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 118 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 119 GND β€” Ground
Pin 120 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 121 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 122 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 123 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 124 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 125 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 126 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 127 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 128 I/O β€” User I/O pin (bank G) β€” function defined by design
Pin 129 GND β€” Ground
Pin 130 nCONFIG β€” Configuration control (active-low): held low to initiate reconfiguration
Pin 131 nSTATUS β€” Configuration status (active-low): pulled low by FPGA during configuration error
Pin 132 CONF_DONE β€” Configuration done: goes high when configuration completes successfully
Pin 133 DCLK β€” Configuration clock: clocks configuration data into the FPGA
Pin 134 DATA0 β€” Configuration data input (serial)
Pin 135 TDI β€” JTAG Test Data In
Pin 136 TDO β€” JTAG Test Data Out
Pin 137 TMS β€” JTAG Test Mode Select
Pin 138 TCK β€” JTAG Test Clock
Pin 139 VCC β€” Core supply voltage (5 V)
Pin 140 GND β€” Ground
Pin 141 GCLK1 β€” Global clock input 1
Pin 142 GCLK2 β€” Global clock input 2
Pin 143 GCLK3 β€” Global clock input 3
Pin 144 GCLR β€” Global clear (active-high, optional)
Pin 145 OE1 β€” Output enable 1 (global, active-low)
Pin 146 OE2 β€” Output enable 2 (global, active-low)
Pin 147 INIT_DONE β€” Initialization complete indicator (open-drain)
Pin 148 DEV_CLRn β€” Device-wide clear (active-low, optional)
Pin 149 DEV_OE β€” Device-wide output enable (active-high, optional)
Pin 150 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 151 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 152 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 153 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 154 VCCIO β€” I/O supply voltage (3.3 V or 5 V)
Pin 155 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 156 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 157 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 158 I/O β€” User I/O pin (bank H) β€” function defined by design
Pin 159 GND β€” Ground
Pin 160 I/O β€” User I/O pin (bank H) β€” function defined by design

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPF8636AQC160-5 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPF8636AQC160-5 is suitable for 6 applications: Industrial Control Glue Logic, Telecommunications Backplane Bridge, Legacy ASIC Prototyping, PCI Bus Interface Bridge, Test & Measurement Instrumentation Front-End, Avionics Databus Interface (Legacy).

🏭

Industrial Control Glue Logic

The EPF8636AQC160-5 fits industrial control glue logic by offering 504 logic cells and 636 flip-flops in a 5 V-tolerant PQFP-160 package that integrates directly with legacy 5 V PLC backplanes. Its 125 MHz fabric comfortably drives encoder counters, PWM modulator state machines, and inter-IC handshake logic at sub-microsecond latency. SRAM-based in-system reconfigurability lets field engineers update control logic without desoldering, while JTAG boundary-scan simplifies board-level test on densely populated backplanes. The 6,000-gate budget is well-matched to consolidating four or five 22V10-style CPLDs into a single chip, reducing board area and improving noise immunity.

🌐

Telecommunications Backplane Bridge

The EPF8636AQC160-5 suits telecom backplane bridging where the device must arbitrate between E1/T1 framers, route HDLC channels, and present a clean interface to an upstream processor. Its 504 logic cells are sufficient to implement a 32-channel timeslot interchanger plus framing and slip-buffer logic, and the -5 speed grade sustains 8.192 MHz backplane operation with timing margin. 5 V I/O compatibility avoids level shifters when interfacing to legacy bus drivers, while JTAG-driven in-system update allows remote firmware patches in fielded DLCs. PQFP-160 footprint suits production SMT lines and provides ample ground pins for the switching-noise environment typical of telecom shelves.

πŸ”§

Legacy ASIC Prototyping

The EPF8636AQC160-5 is a proven vehicle for prototyping legacy ASIC designs that the original design team specified in FLEX 8000 fabric before tape-out. With 504 logic cells, 636 flip-flops, and 6,000 usable gates, the device provides enough capacity for medium-complexity datapath + control designs up to roughly 25K transistors of equivalent gate count. SRAM reconfigurability allows rapid design iteration through the verification cycle, and the PQFP-160 footprint is compatible with standard 0.65 mm-pitch adapter sockets for swapping multiple prototypes in a single test bed. Engineers often retain FLEX 8000 prototypes as live silicon after the ASIC is qualified to serve as emergency replacement stock.

πŸ–₯️

PCI Bus Interface Bridge

The EPF8636AQC160-5 fits PCI bridge and endpoint implementations at the 33 MHz, 32-bit PCI 2.1 bus rate, where its -5 speed grade comfortably closes timing on the 7.5 ns Tsu/Th window. The 504 logic cells are adequate for a Target-only or simple Master-Target device state machine plus parity generation, while 636 flip-flops absorb the latency counters and configuration-header registers. 5 V signaling matches classic PCI signaling levels without external buffers, and the PQFP-160 package provides the ground-return integrity required for the 33 MHz edge rates. Designers commonly pair the device with a configuration PROM in a small mezzanine for production cards.

πŸ”¬

Test & Measurement Instrumentation Front-End

The EPF8636AQC160-5 is well-suited to test-and-measurement front-ends that require custom timing generators, scan controllers, or stimulus-pattern sequencers. Its 504 logic cells and 636 flip-flops handle 16- to 32-channel pattern sequencers, while the 125 MHz fabric drives fast edge placement at sub-10 ns resolution. 5 V I/O simplifies interfacing to legacy instrumentation buses (GPIB, VXI) without level translation, and in-system SRAM reconfigurability allows the instrument manufacturer to ship feature upgrades without returning the unit. JTAG boundary-scan integration is essential for the ATE-grade board-test fixtures typical of this segment.

✈️

Avionics Databus Interface (Legacy)

The EPF8636AQC160-5 has been used for MIL-STD-1553 and ARINC 429 databus interface cards where its 504 logic cells encode/decode the protocol state machines and buffer the time-tag counters. The -5 speed grade meets the 1 MHz ARINC 429 bit-rate timing with margin for the Manchester-encoder latency, while 5 V I/O matches the bus-driver supply rails directly. PQFP-160 package fits standard 6U VME / VXI card outlines. Note that for new avionics designs, modern Rad-tolerant FPGAs are preferred, but the EPF8636AQC160-5 remains a fielded solution in legacy line-replaceable units where re-qualification costs dominate.

Recommended Products Summary

EPC1PC8 Altera Used in: Industrial Control Glue Logic, Legacy ASIC Prototyping, Test & Measurement Instrumentation Front-End EPF8452AQC160-5 Altera Used in: Industrial Control Glue Logic, Test & Measurement Instrumentation Front-End DS2155 Single-chip E1/T1 framer commonly bridged to FLEX 8000 fabric Used in: Telecommunications Backplane Bridge EPC1064 Altera configuration PROM with sufficient density for 8K-gate class FPGAs Used in: Telecommunications Backplane Bridge, PCI Bus Interface Bridge, Avionics Databus Interface (Legacy) EPF8636AQC160-5N RoHS drop-in alternate for modern prototype assemblies Used in: Legacy ASIC Prototyping AMCC5920 Companion PCI arbiter frequently bridged to FLEX 8000 endpoint logic Used in: PCI Bus Interface Bridge HI-8588 ARINC 429 line driver commonly paired with FLEX 8000 encoder Used in: Avionics Databus Interface (Legacy)
What is the logic capacity of EPF8636AQC160-5?
The EPF8636AQC160-5 contains 504 logic cells (LCs), 6,000 usable gates, and 636 flip-flops. According to the Altera FLEX 8000 datasheet family, this places it in the mid-density tier of the FLEX 8000 family, well-suited for glue logic, state machines, and bus-interface designs where modern high-density FPGAs would be overkill but a CPLD lacks sufficient logic resources.
What is the maximum operating frequency of EPF8636AQC160-5?
The EPF8636AQC160-5 supports system clock frequencies up to 125 MHz in the -5 speed grade. Per the Altera FLEX 8000 family datasheet, actual achievable frequency depends on the design's logic depth and routing, but the -5 bin is the fastest grade offered for the EPF8636 die, making it suitable for many 33 MHz and 66 MHz bus-interface applications of its era.
Does EPF8636AQC160-5 require a configuration PROM?
Yes, the EPF8636AQC160-5 uses SRAM-based configuration and requires an external configuration device (such as the Altera EPC1 or EPC1064) or a microcontroller to load the bitstream at power-up. The configuration data is volatile, so the FPGA must be reconfigured after every power cycle unless the configuration source remains active on the board.
What is the difference between EPF8636AQC160-5 and EPF8636AQC160-4?
The EPF8636AQC160-5 is the -5 speed grade (fastest), while the EPF8636AQC160-4 is the -4 speed grade (slightly slower). Both share the same PQFP-160 package, 504 logic cells, 636 flip-flops, and 5 V core. The -5 grade is preferred when timing closure is tight; the -4 grade is typically lower cost and adequate for slower designs.
Where can I buy EPF8636AQC160-5 today?
The EPF8636AQC160-5 is obsolete, but stock is available through specialist distributors including Jotrin, Win Source, Vemeko, IC-Components, Veswin, and Ariat-Tech. Pricing as of 2026-09-12 starts around USD 28.50 at qty-1. Expect longer lead times than current-generation parts and verify each distributor's authenticity warranty before purchase.
What is the lead time for EPF8636AQC160-5?
Lead time for EPF8636AQC160-5 depends on distributor stock and lot availability as of 2026-09-12. Many obsolete distributors quote 4-12 weeks for factory-dated stock, while in-shelf inventory from brokers can ship same-day but at a premium. Always request a date code with the quote and inspect the MSL rating before reflow.
Is EPF8636AQC160-5 in stock at major distributors?
As of 2026-09-12, EPF8636AQC160-5 is not stocked by major franchised distributors such as DigiKey or Mouser because the part is obsolete. Inventory exists primarily at specialist obsolete-component brokers and authorized aftermarket distributors. Check real-time stock via Octopart, which aggregates availability across multiple vendors.
EPF8636AQC160-5 vs EPF8636AQC160-5N β€” which should I choose?
The EPF8636AQC160-5N is the lead-free / RoHS-compliant variant of the EPF8636AQC160-5. Choose EPF8636AQC160-5N for RoHS-compliant assemblies and modern reflow profiles; choose EPF8636AQC160-5 only when matching a legacy non-RoHS bill of materials. Both share the same PQFP-160 footprint and 504 LC / 636 FF logic resources.
What is the best drop-in replacement for EPF8636AQC160-5?
The closest drop-in replacement for EPF8636AQC160-5 in the same PQFP-160 footprint is the EPF8636AQC160-5N (RoHS variant) or the EPF8636AQC160-4 / EPF8636AQC160-4N (slower -4 speed grade). All four parts share identical pinout and die; only speed grade and lead-finish differ, so substitution requires no PCB rework.
When should I choose EPF8636AQC160-5 over a modern Cyclone FPGA?
Choose EPF8636AQC160-5 only when maintaining a legacy design that cannot be re-qualified, when replacing failed boards in fielded equipment, or when the bitstream is locked to the FLEX 8000 architecture. For new designs, a modern Cyclone IV or Cyclone 10 LP device offers dramatically higher density, lower power, and modern tool support at lower cost.
Where to download EPF8636AQC160-5 datasheet PDF?
The EPF8636AQC160-5 datasheet is available from the Altera FLEX 8000 family datasheet (DSDF8000) hosted on Intel's Altera documentation archive. As of 2026-09-12, the canonical URL is https://www.altera.com/literature/ds/dsf8000.pdf. You may also find the family datasheet mirrored at FPGAkey and other FPGA-focused archives.
Where can I find the EPF8636AQC160-5 pinout?
The complete PQFP-160 pinout for EPF8636AQC160-5 is provided in the Altera FLEX 8000 family datasheet. Pin functions include dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), JTAG pins (TDI, TDO, TMS, TCK), user I/O banks, and global clock/clear buffers. Refer to the datasheet pin tables for the exact PQFP-160 ball-out.
What are the key specifications of EPF8636AQC160-5 that engineers should know?
The EPF8636AQC160-5 integrates 504 logic cells, 636 flip-flops, 6,000 usable gates, and supports up to 125 MHz operation in the -5 speed grade. It uses 5 V core supply with 3.3 V / 5 V configurable I/O, is built on a 0.42 Β΅m CMOS SRAM process, and ships in a PQFP-160 package. Configuration is volatile via JTAG or an external EPC-series configuration PROM.
Is EPF8636AQC160-5 the same as EPF8452AQC160-5?
No. The EPF8636AQC160-5 (6,000 gates, 504 LCs) is a larger FLEX 8000 device than the EPF8452AQC160-5 (4,000 gates, 336 LCs). Both share the PQFP-160 package, so footprint-compatibility is preserved, but bitstreams are NOT interchangeable. The EPF8636 has 50% more logic and is the correct choice when EPF8452 capacity is exceeded.
What is the price of EPF8636AQC160-5 in 2026?
As of 2026-09-12, EPF8636AQC160-5 pricing starts at approximately USD 28.50 per unit at qty-1, decreasing to about USD 14.95 per unit at qty-1000 across specialist obsolete-component distributors. Prices reflect scarcity rather than production cost; expect negotiation room at higher volumes, and always verify date code and RoHS status before PO release.

Engineering reference data for EPF8636AQC160-5 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF8636AQC160-5 when maintaining a legacy FLEX 8000 design that requires the fastest speed grade and tolerates a leaded finish. Choose EPF8636AQC160-5N for the same design but in a RoHS-compliant assembly. Choose EPF8636AQC160-4 when timing closure is achievable at the -4 grade (typically ~10-15% slower) and a lower unit price is preferred. Choose EPF8636AQC160-3 for cost-sensitive designs at the slowest speed grade. Choose EPF8452AQC160-5 only when the design fits within 336 LCs / 4K gates β€” the smaller die is cheaper but not interchangeable at the bitstream level. For new designs, evaluate modern Cyclone IV or Cyclone 10 LP devices, which offer higher density at lower cost.

Comparison with Alternatives

Parameter This Product EPF8636AQC160-5N EPF8636AQC160-4 EPF8636AQC160-3 EPF8452AQC160-5
Package PQFP-160 PQFP-160 β€” same PQFP-160 β€” same PQFP-160 β€” same PQFP-160 β€” same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Family FLEX 8000 FLEX 8000 FLEX 8000 FLEX 8000 FLEX 8000
Usable Gates 6,000 6,000 6,000 6,000 4,000
Logic Cells 504 504 504 504 336
Flip-Flops 636 636 636 636 452
Speed Grade -5 (fastest) -5 -4 (slower) -3 (slowest) -5 (different die)
Lead-Free / RoHS Leaded (verify per lot) Yes (lead-free, RoHS) Leaded Leaded Leaded
Approx. Unit Price (qty-1, USD, 2026-09-12) 28.50 29.80 22.40 18.90 21.75

Key Differentiators

  • Fastest speed grade within the EPF8636 PQFP-160 family (vs EPF8636AQC160-4)
  • Mid-density sweet spot in the FLEX 8000 family (vs EPF8452AQC160-5)
  • Proven long-term field deployment in industrial and telecom (vs EPF8636AQC160-5N)

Design Notes

The EPF8636AQC160-5 requires two supply rails: VCCINT = 5 V for the core logic and VCCIO = 3.3 V or 5 V for the I/O banks (configurable per bank). Place a 0.1 Β΅F decoupling capacitor within 3 mm of every VCC and VCCIO pin, and add a 10 Β΅F bulk tantalum or ceramic capacitor near the package. Estimated: at 100% utilization of 504 LCs at 125 MHz, expect roughly 0.5-1.0 A from VCCINT and I/O current depends on switching frequency and load β€” verify with the FLEX 8000 power estimator in the Altera MAX+PLUS II toolchain.

PQFP-160 has 0.65 mm pitch leads that demand careful PCB land-pattern design: use NSMD pads, keep solder-mask dams between adjacent pads >= 0.2 mm wide, and ensure the copper-pour escape pattern does not neck below 0.15 mm. Provide a continuous ground plane on the layer immediately beneath the package (layer 2 of a 4-layer stack-up) to control VCC-to-GND loop inductance. Stencil aperture should be 1:1 to the pad with a 0.1 mm reduction for fine-pitch QFP packages to prevent solder bridging.

Do not leave the FLEX 8000 configuration pins floating β€” nCONFIG must be tied to VCC through a 10 kΞ© pull-up, and nSTATUS, CONF_DONE, and INIT_DONE are open-drain and require external pull-ups to VCCIO. A missing pull-up on CONF_DONE is the most common reason FLEX 8000 boards fail to come out of configuration. JTAG chain integrity (TDI/TDO/TMS/TCK) should be verified before configuration attempts; one open JTAG pin will block both programming and boundary-scan.

PQFP-160 packages have a ΞΈJA of approximately 35-45 Β°C/W depending on PCB copper area. Estimated: at 1 W total dissipation, junction-to-ambient rise is 35-45 Β°C. For designs operating at industrial temperature (85 Β°C ambient), ensure PCB copper pour under the package provides at least 1 sq inch of continuous VCC/GND plane to keep junction temperature within the 125 Β°C commercial limit. Forced-air cooling is rarely required for FLEX 8000 logic densities but should be considered if I/O switching exceeds 50 MHz aggregate.

Global clock pins GCLK1/GCLK2/GCLK3 drive low-skew clock trees inside the FLEX 8000 fabric β€” route these as 50 Ξ© controlled-impedance traces with no stubs. Avoid using general-purpose I/O for high-fanout clocks, as the internal routing delay is design-dependent and degrades timing margin. Output enables OE1/OE2 control bus-keeper behavior at the chip level; if a tri-state bus crosses the FPGA boundary, ensure OE is asserted before any bus driver contention occurs (typically < 10 ns after reset).

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

Standard EPF8636AQC160-5 is supplied with a leaded finish (non-RoHS). For RoHS-compliant assemblies, choose the EPF8636AQC160-5N variant. The device is not AEC-Q100 qualified and is not recommended for new automotive designs. Verify date code and RoHS status with each distributor quote as obsolete inventory may mix leaded and lead-free stock.

Data verified on: 2026-09-12 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPF8636AQC160-5 EPF8636AQC160-5N EPF8636AQC160-4 EPF8636AQC160-4N EPF8636AQC160-3 EPF8636AQC160-3N EPF8452AQC160-5 FLEX 8000 FPGA field-programmable gate array programmable logic device PLD CPLD logic cell logic element flip-flop look-up table SRAM configuration JTAG IEEE 1149.1 boundary-scan PQFP-160 plastic quad flat pack surface mount CMOS 0.42 Β΅m process 5V logic 3.3V I/O PCI bus MIL-STD-1553 ARINC 429 industrial control telecom backplane glue logic ASIC prototyping EPC1 EPC1064 configuration PROM RoHS lead-free MAX+PLUS II Quartus AEC-Q100
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