EPF8820ARC160-2 - FLEX 8000 FPGA, 672 LE, 120 I/O, 160-BQFP | Intel
Référence : EPF8820ARC160-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.4 | $1 940,00 |
| 500 | $16.8 | $8 400,00 |
| 1 000 | $14.95 | $14 950,00 |
EPF8820ARC160-2 Présentation
What is a FLEX 8000 FPGA? FLEX 8000 is a legacy SRAM-based Field-Programmable Gate Array family introduced by Altera (now Intel PSG) in the mid-1990s. Hierarchically, FLEX 8000 sits between simple PLDs/CPLDs (small logic-only devices) and modern high-density SRAM FPGAs (Cyclone, MAX series): device -> FPGA -> programmable logic -> integrated circuit -> semiconductor. FPGAs contain configurable logic blocks (here, 4-LUT-based LEs grouped into LABs), programmable routing, and I/O cells; SRAM configuration makes them in-system reprogrammable but requires a configuration memory on every power-up.
Key features include 120 user I/O pins supporting 5 V TTL/CMOS interfaces, on-chip SRAM-based configuration memory, multi-volt I/O compatibility, JTAG (IEEE 1149.1) boundary-scan test support, and a 4-input Look-Up Table (LUT) logic architecture. The part is built on a 0.5 µm CMOS SRAM process (Altera FLEX 8000 family), giving it non-volatile operation only when paired with an external configuration EPROM such as the EPC1 or EPC2.
The device targets applications like industrial control glue logic, telecom line-card interface bridging, PCI bus interface bridging, custom peripherals for embedded microprocessors, and legacy replacement of 74-series and 4000-series MSI/LSI logic. With 120 I/O it can sink/source up to 25 mA per pin (typical) and supports PCI-compliant drive.
When designing with EPF8820ARC160-2, plan for configuration: a serial configuration EPROM (EPC1/EPC2) or microcontroller must load the SRAM at every power-up. The 160-BQFP package has a footprint roughly 28 mm × 28 mm; provide four-layer PCB with solid ground and power planes for noise-sensitive applications.
This page synthesizes distributor pricing, lifecycle status, and parametric comparison versus same-family Intel FLEX 8000 variants and cross-brand Xilinx XC3000/XC4000 equivalents - information that is not consolidated on any single distributor page.
Alternatives de remplacement direct pour EPF8820ARC160-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ARC160-2 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Speed Grade, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ARC-4N
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →EPF8820ARC-4
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →EPF8820ARC160-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX 8000 |
| Logic Elements / Cells | 672 |
| Number of LABs / CLBs | 84 |
| Typical Gate Count | 8,000 gates |
| User I/O Pins | 120 |
| Tension d'alimentation | 4.75 V to 5.25 V (5 V nominal) |
| Température de fonctionnement | 0 °C to 70 °C (commercial) |
| Type de montage | Surface Mount |
| Boîtier / Format | 160-BQFP (Metric Quad Flat Pack) |
| Configuration Memory | SRAM (volatile; requires external EPC1/EPC2 EPROM or MCU) |
| Process Technology | 0.5 µm CMOS SRAM |
| Logic Element Architecture | 4-input LUT + carry chain |
| Boundary Scan | JTAG IEEE 1149.1 |
| Part Status | Obsolete (per distributor listings) |
| Logic Voltage | 5 V TTL/CMOS |
Configuration des broches de EPF8820ARC160-2
| Broche 1 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 2 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 3 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 4 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 5 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 6 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 7 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 8 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 9 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 10 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 11 | VCCINT — 5 V core supply |
| Broche 12 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 13 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 14 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 15 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 16 | GND — Ground |
| Broche 17 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 18 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 19 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 20 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 21 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 22 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 23 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 24 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 25 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 26 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 27 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 28 | VCCIO1 — I/O Bank 1 reference voltage |
| Broche 29 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 30 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 31 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 32 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 33 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 34 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 35 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 36 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 37 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 38 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 39 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 40 | I/O Bank 1 — User I/O - Bank 1 |
| Broche 41 | GND — Ground |
| Broche 42 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 43 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 44 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 45 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 46 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 47 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 48 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 49 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 50 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 51 | VCCINT — 5 V core supply |
| Broche 52 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 53 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 54 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 55 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 56 | GND — Ground |
| Broche 57 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 58 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 59 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 60 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 61 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 62 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 63 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 64 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 65 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 66 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 67 | VCCIO2 — I/O Bank 2 reference voltage |
| Broche 68 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 69 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 70 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 71 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 72 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 73 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 74 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 75 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 76 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 77 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 78 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 79 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 80 | I/O Bank 2 — User I/O - Bank 2 |
| Broche 81 | GND — Ground |
| Broche 82 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 83 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 84 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 85 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 86 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 87 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 88 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 89 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 90 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 91 | VCCINT — 5 V core supply |
| Broche 92 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 93 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 94 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 95 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 96 | GND — Ground |
| Broche 97 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 98 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 99 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 100 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 101 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 102 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 103 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 104 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 105 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 106 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 107 | VCCIO3 — I/O Bank 3 reference voltage |
| Broche 108 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 109 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 110 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 111 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 112 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 113 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 114 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 115 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 116 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 117 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 118 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 119 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 120 | I/O Bank 3 — User I/O - Bank 3 |
| Broche 121 | GND — Ground |
| Broche 122 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 123 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 124 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 125 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 126 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 127 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 128 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 129 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 130 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 131 | VCCINT — 5 V core supply |
| Broche 132 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 133 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 134 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 135 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 136 | GND — Ground |
| Broche 137 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 138 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 139 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 140 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 141 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 142 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 143 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 144 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 145 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 146 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 147 | VCCIO4 — I/O Bank 4 reference voltage |
| Broche 148 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 149 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 150 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 151 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 152 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 153 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 154 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 155 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 156 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 157 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 158 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 159 | I/O Bank 4 — User I/O - Bank 4 |
| Broche 160 | I/O Bank 4 — User I/O - Bank 4 |
Applications typiques
EPF8820ARC160-2 convient pour 6 applications: Legacy Industrial Glue Logic, PCI Bus Bridge / Interface Bridging, Telecom Line-Card Interface Logic, Embedded Microcontroller Peripheral Expansion, Custom State Machines and Protocol Controllers, Legacy Replacement and Field Repair.
Legacy Industrial Glue Logic
The EPF8820ARC160-2 fits legacy industrial glue-logic applications that previously required dozens of 74-series MSI parts. Its 672 logic elements deliver roughly 8,000 usable gates, enough to integrate address decoding, bus arbitration, custom state machines, and interrupt controllers on a single 5 V device. With 120 user I/O, the part can replace a full board of discrete logic while running from the same 5 V supply as the surrounding TTL/CMOS circuitry. Engineers use the FLEX 8000 architecture to retain in-system reprogrammability during system bring-up, allowing last-minute logic fixes without board respins.
Recommandé
PCI Bus Bridge / Interface Bridging
The EPF8820ARC160-2 is widely used as a PCI bus bridge or interface bridging device between microprocessors, DSPs, and legacy peripherals. Its 120 user I/O pins can carry an entire 32-bit PCI bus (32 data/address + 8 control) plus ancillary control lines, and the 4-input LUT + carry-chain architecture synthesizes 32-bit counters, FIFOs, and address-decoding logic efficiently. The 5 V TTL I/O is PCI-compliant when the device is configured in PCI mode. Designers appreciate the in-system SRAM programmability for fixing protocol bugs in the field without respinning the host board.
Recommandé
Telecom Line-Card Interface Logic
Telecom line-card and central-office designs adopted the FLEX 8000 family for custom interface and framing logic. The EPF8820ARC160-2 with 672 LEs and 120 I/O implements HDLC controllers, framing bit-processors, T1/E1 line-interface glue, and custom serial-to-parallel converters on a single device. Its commercial 0 °C to 70 °C range suits environmentally controlled CO bays. The 160-BQFP package's large thermal copper pad area also helps dissipate heat in enclosed, fan-less line-card assemblies. JTAG boundary-scan eases in-system test of the dense BQFP footprint.
Recommandé
Embedded Microcontroller Peripheral Expansion
Embedded designs using 8-bit and 16-bit microcontrollers (8051, 68xxx, MIPS, x86) often lack I/O or peripheral features, and the EPF8820ARC160-2 serves as a configurable peripheral-expansion companion. With 120 I/O it adds parallel ports, PWM generators, quadrature decoders, or custom serial interfaces (UART, SPI, I2C master/slave) next to a host MCU that has run out of pins. The 5 V supply matches legacy MCU rails, and in-system SRAM programmability allows firmware engineers to update peripheral behavior alongside MCU firmware revisions.
Recommandé
Custom State Machines and Protocol Controllers
The EPF8820ARC160-2 is a natural fit for complex state-machine and protocol-controller implementations where discrete 74LS/74AS state machines would consume too much board area. With 672 4-input LUT-based logic elements, the device can implement multi-state machines with hundreds of states, packet-framing logic, custom synchronous protocols, and proprietary bus controllers. Engineers benefit from FPGA design tools that synthesize state machines directly from HDL descriptions, and the in-system reprogrammability allows rapid protocol iteration during OEM development.
Recommandé
Legacy Replacement and Field Repair
Many long-lifecycle industrial, military, and avionics systems still contain EPF8820ARC160-2 devices that must be repaired for decades. The part supports legacy replacement and field-repair workflows by enabling direct PCB-level swaps on existing 160-BQFP land patterns. Distributors Ocean-Components, Wolfchip, and Micro-Semiconductor report thousands of remaining new-old-stock pieces, which feeds the aftermarket repair pipeline. The 5 V supply, JTAG test, and known-good bitstream ensure repaired systems retain original functionality without requalification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ARC160-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820AQC160-2 | EPF8820ARC-4N | EPF8820ARC-4 | EPF8820AGC192-2 | EPF8820ABC225-4 |
|---|---|---|---|---|---|---|
| Package | 160-BQFP (Metric QFP) | 160-pin PQFP (JEDEC QFP) - land pattern differs | 160-BQFP (Metric QFP) - same footprint | 160-BQFP (Metric QFP) - same footprint | 192-pin PGA - package differs | 225-BGA - package differs |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| LABs / CLBs | 84 | 84 | 84 | 84 | 84 | 84 |
| User I/O | 120 | 120 | 120 | 120 | 120 (same die, fewer routed to package) | 120 (same die, more package pins available) |
| Speed Grade | -2 | -2 | -4 (faster) | -4 (faster) | -2 | -4 (faster) |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C | 0 to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- True drop-in speed-grade upgrade on identical 160-BQFP land pattern (vs EPF8820ARC-4N)
- Same die in higher-pin-count package enables I/O reassignment (vs EPF8820AGC192-2)
- Lowest-cost entry point into the FLEX 8000 family with 120 I/O (vs EPF8820ABC225-4)
Notes de conception
The EPF8820ARC160-2 requires a clean 5 V supply (4.75 V to 5.25 V) on VCCINT pins, plus separate VCCIO1/VCCIO2/VCCIO3/VCCIO4 rails for each of the four I/O banks. Estimated: a fully utilized EPF8820 with all 120 I/O toggling at 50 MHz draws roughly 200-300 mA on VCCINT plus I/O supply current proportional to loading. Decouple each VCC/VCCIO pin with a 0.1 µF ceramic and place a bulk 47 µF tantalum near the device. Configuration EPROM supply must ramp within Intel-specified tRSTL/VCC timing to avoid configuration failure.
The 160-BQFP (Metric Quad Flat Pack) has a 0.65 mm pitch and ~28 mm body. Provide 4-layer PCB with solid ground and power planes directly under the device for VCCINT/GND return paths. Keep configuration EPROM (EPC1/EPC2) within 50 mm to minimize passive-serial trace length. Use 0.1 µF decoupling within 5 mm of each VCC pin. JTAG chain should have a 10 kΩ pull-up on TCK/TMS/TDI to keep the boundary-scan state valid at power-up.
Common pitfalls with EPF8820ARC160-2 designs: (1) forgetting that configuration SRAM is volatile - the device WILL NOT retain its design without an external EPC1/EPC2 EPROM or MCU passive-serial master; (2) mixing 160-BQFP metric) and 160-PQFP (JEDEC) land patterns - they are NOT identical; (3) ignoring the speed-grade downgrades: replacing -4 with -2 reduces timing margin; (4) leaving JTAG chain unterminated can lock the device into a non-functional state during power-up; (5) using 3.3 V signals on a 5 V VCCIO bank without level translation violates Absolute Maximum Ratings.
Informations de conformité
Compliance status not stated in verified web data; legacy 1990s FLEX 8000 parts typically pre-date RoHS but were offered in lead-free variants under the 'N' suffix. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified.
