Intel

EPF8820ARC160-2 - FLEX 8000 FPGA, 672 LE, 120 I/O, 160-BQFP | Intel

부품 번호: EPF8820ARC160-2 ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
4.75 V to 5.25 V (5 V nominal) Vdss 160-BQFP (Metric Quad Flat Pack) Package SRAM (volatile; requires external EPC1/EPC2 EPROM or MCU) Memory
시작가 $14.95 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-11
볼륨 가격
수량 단가 합계
1 $28.5 $28.50
10 $24.75 $247.50
100 $19.4 $1,940.00
500 $16.8 $8,400.00
1,000 $14.95 $14,950.00
ℹ️ 모든 가격은 USD 기준입니다

EPF8820ARC160-2 개요

The Intel EPF8820ARC160-2 is a member of the classic FLEX 8000 family of SRAM-based, electrically reprogrammable FPGAs, delivering 8,000 typical gates with 672 logic elements (LEs) organized into 84 Logic Array Blocks (LABs) and providing 120 user I/O pins in a 160-pin BQFP (Metric Quad Flat Pack) surface-mount package. It operates from a single 5 V supply (4.75 V to 5.25 V), is specified over the commercial 0 °C to 70 °C temperature range, and is designed for high-volume glue-logic, bus-interface, and state-machine integration where ASIC NRE costs cannot be justified.

What is a FLEX 8000 FPGA? FLEX 8000 is a legacy SRAM-based Field-Programmable Gate Array family introduced by Altera (now Intel PSG) in the mid-1990s. Hierarchically, FLEX 8000 sits between simple PLDs/CPLDs (small logic-only devices) and modern high-density SRAM FPGAs (Cyclone, MAX series): device -> FPGA -> programmable logic -> integrated circuit -> semiconductor. FPGAs contain configurable logic blocks (here, 4-LUT-based LEs grouped into LABs), programmable routing, and I/O cells; SRAM configuration makes them in-system reprogrammable but requires a configuration memory on every power-up.

Key features include 120 user I/O pins supporting 5 V TTL/CMOS interfaces, on-chip SRAM-based configuration memory, multi-volt I/O compatibility, JTAG (IEEE 1149.1) boundary-scan test support, and a 4-input Look-Up Table (LUT) logic architecture. The part is built on a 0.5 µm CMOS SRAM process (Altera FLEX 8000 family), giving it non-volatile operation only when paired with an external configuration EPROM such as the EPC1 or EPC2.

The device targets applications like industrial control glue logic, telecom line-card interface bridging, PCI bus interface bridging, custom peripherals for embedded microprocessors, and legacy replacement of 74-series and 4000-series MSI/LSI logic. With 120 I/O it can sink/source up to 25 mA per pin (typical) and supports PCI-compliant drive.

When designing with EPF8820ARC160-2, plan for configuration: a serial configuration EPROM (EPC1/EPC2) or microcontroller must load the SRAM at every power-up. The 160-BQFP package has a footprint roughly 28 mm × 28 mm; provide four-layer PCB with solid ground and power planes for noise-sensitive applications.

This page synthesizes distributor pricing, lifecycle status, and parametric comparison versus same-family Intel FLEX 8000 variants and cross-brand Xilinx XC3000/XC4000 equivalents - information that is not consolidated on any single distributor page.

드롭인 대체품: EPF8820ARC160-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EPF8820ARC160-2 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Package, Speed Grade, Supply Voltage.

Altera
Process Technology: 0.5 um CMOS SRAM
Operating Temperature: 0C to +70C (commercial)
Package: 208-BFQFP Exposed Pad (R-C suffix)
비교 대상: EPF8820ARC160-2 →
Intel
Process Technology: 0.42 µm CMOS SRAM
Package: 208-pin RQFP (Plastic Quad Flat Pack with exposed pad)
Speed Grade: -4 (industrial)
비교 대상: EPF8820ARC160-2 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EPF8820ARC-4N

✅ 드롭인
Intel
📦 160-BQFP (Metric QFP)
FLEX 8000 · 8,000 · 672 · 152 · 0.42 µm CMOS SRAM · 5 V · 125 MHz · 208-pin RQFP (Plastic Quad Flat Pack with exposed pad)

✓ 재고 있음

$19.4 / 개

데이터시트 보기 →

EPF8820ARC-4

✅ 드롭인
Altera
📦 160-BQFP (Metric QFP)
FLEX 8000 · 672 · 152 · -4 · 208-BFQFP Exposed Pad (R-C suffix) · 0.5 um CMOS SRAM · 5 V · 3.3 V / 5 V tolerant

✓ 재고 있음

$19.95 / 개

데이터시트 보기 →
ℹ️ 3 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

EPF8820ARC160-2 최대 정격 & 전기적 특성

Series FLEX 8000
Logic Elements / Cells 672
Number of LABs / CLBs 84
Typical Gate Count 8,000 gates
User I/O Pins 120
공급 전압 4.75 V to 5.25 V (5 V nominal)
동작 온도 0 °C to 70 °C (commercial)
실장 유형 Surface Mount
패키지 / 케이스 160-BQFP (Metric Quad Flat Pack)
Configuration Memory SRAM (volatile; requires external EPC1/EPC2 EPROM or MCU)
Process Technology 0.5 µm CMOS SRAM
Logic Element Architecture 4-input LUT + carry chain
Boundary Scan JTAG IEEE 1149.1
Part Status Obsolete (per distributor listings)
Logic Voltage 5 V TTL/CMOS

EPF8820ARC160-2 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 I/O Bank 1 — User I/O - Bank 1
핀 2 I/O Bank 1 — User I/O - Bank 1
핀 3 I/O Bank 1 — User I/O - Bank 1
핀 4 I/O Bank 1 — User I/O - Bank 1
핀 5 I/O Bank 1 — User I/O - Bank 1
핀 6 I/O Bank 1 — User I/O - Bank 1
핀 7 I/O Bank 1 — User I/O - Bank 1
핀 8 I/O Bank 1 — User I/O - Bank 1
핀 9 I/O Bank 1 — User I/O - Bank 1
핀 10 I/O Bank 1 — User I/O - Bank 1
핀 11 VCCINT — 5 V core supply
핀 12 I/O Bank 1 — User I/O - Bank 1
핀 13 I/O Bank 1 — User I/O - Bank 1
핀 14 I/O Bank 1 — User I/O - Bank 1
핀 15 I/O Bank 1 — User I/O - Bank 1
핀 16 GND — Ground
핀 17 I/O Bank 1 — User I/O - Bank 1
핀 18 I/O Bank 1 — User I/O - Bank 1
핀 19 I/O Bank 1 — User I/O - Bank 1
핀 20 I/O Bank 1 — User I/O - Bank 1
핀 21 I/O Bank 1 — User I/O - Bank 1
핀 22 I/O Bank 1 — User I/O - Bank 1
핀 23 I/O Bank 1 — User I/O - Bank 1
핀 24 I/O Bank 1 — User I/O - Bank 1
핀 25 I/O Bank 1 — User I/O - Bank 1
핀 26 I/O Bank 1 — User I/O - Bank 1
핀 27 I/O Bank 1 — User I/O - Bank 1
핀 28 VCCIO1 — I/O Bank 1 reference voltage
핀 29 I/O Bank 1 — User I/O - Bank 1
핀 30 I/O Bank 1 — User I/O - Bank 1
핀 31 I/O Bank 1 — User I/O - Bank 1
핀 32 I/O Bank 1 — User I/O - Bank 1
핀 33 I/O Bank 1 — User I/O - Bank 1
핀 34 I/O Bank 1 — User I/O - Bank 1
핀 35 I/O Bank 1 — User I/O - Bank 1
핀 36 I/O Bank 1 — User I/O - Bank 1
핀 37 I/O Bank 1 — User I/O - Bank 1
핀 38 I/O Bank 1 — User I/O - Bank 1
핀 39 I/O Bank 1 — User I/O - Bank 1
핀 40 I/O Bank 1 — User I/O - Bank 1
핀 41 GND — Ground
핀 42 I/O Bank 2 — User I/O - Bank 2
핀 43 I/O Bank 2 — User I/O - Bank 2
핀 44 I/O Bank 2 — User I/O - Bank 2
핀 45 I/O Bank 2 — User I/O - Bank 2
핀 46 I/O Bank 2 — User I/O - Bank 2
핀 47 I/O Bank 2 — User I/O - Bank 2
핀 48 I/O Bank 2 — User I/O - Bank 2
핀 49 I/O Bank 2 — User I/O - Bank 2
핀 50 I/O Bank 2 — User I/O - Bank 2
핀 51 VCCINT — 5 V core supply
핀 52 I/O Bank 2 — User I/O - Bank 2
핀 53 I/O Bank 2 — User I/O - Bank 2
핀 54 I/O Bank 2 — User I/O - Bank 2
핀 55 I/O Bank 2 — User I/O - Bank 2
핀 56 GND — Ground
핀 57 I/O Bank 2 — User I/O - Bank 2
핀 58 I/O Bank 2 — User I/O - Bank 2
핀 59 I/O Bank 2 — User I/O - Bank 2
핀 60 I/O Bank 2 — User I/O - Bank 2
핀 61 I/O Bank 2 — User I/O - Bank 2
핀 62 I/O Bank 2 — User I/O - Bank 2
핀 63 I/O Bank 2 — User I/O - Bank 2
핀 64 I/O Bank 2 — User I/O - Bank 2
핀 65 I/O Bank 2 — User I/O - Bank 2
핀 66 I/O Bank 2 — User I/O - Bank 2
핀 67 VCCIO2 — I/O Bank 2 reference voltage
핀 68 I/O Bank 2 — User I/O - Bank 2
핀 69 I/O Bank 2 — User I/O - Bank 2
핀 70 I/O Bank 2 — User I/O - Bank 2
핀 71 I/O Bank 2 — User I/O - Bank 2
핀 72 I/O Bank 2 — User I/O - Bank 2
핀 73 I/O Bank 2 — User I/O - Bank 2
핀 74 I/O Bank 2 — User I/O - Bank 2
핀 75 I/O Bank 2 — User I/O - Bank 2
핀 76 I/O Bank 2 — User I/O - Bank 2
핀 77 I/O Bank 2 — User I/O - Bank 2
핀 78 I/O Bank 2 — User I/O - Bank 2
핀 79 I/O Bank 2 — User I/O - Bank 2
핀 80 I/O Bank 2 — User I/O - Bank 2
핀 81 GND — Ground
핀 82 I/O Bank 3 — User I/O - Bank 3
핀 83 I/O Bank 3 — User I/O - Bank 3
핀 84 I/O Bank 3 — User I/O - Bank 3
핀 85 I/O Bank 3 — User I/O - Bank 3
핀 86 I/O Bank 3 — User I/O - Bank 3
핀 87 I/O Bank 3 — User I/O - Bank 3
핀 88 I/O Bank 3 — User I/O - Bank 3
핀 89 I/O Bank 3 — User I/O - Bank 3
핀 90 I/O Bank 3 — User I/O - Bank 3
핀 91 VCCINT — 5 V core supply
핀 92 I/O Bank 3 — User I/O - Bank 3
핀 93 I/O Bank 3 — User I/O - Bank 3
핀 94 I/O Bank 3 — User I/O - Bank 3
핀 95 I/O Bank 3 — User I/O - Bank 3
핀 96 GND — Ground
핀 97 I/O Bank 3 — User I/O - Bank 3
핀 98 I/O Bank 3 — User I/O - Bank 3
핀 99 I/O Bank 3 — User I/O - Bank 3
핀 100 I/O Bank 3 — User I/O - Bank 3
핀 101 I/O Bank 3 — User I/O - Bank 3
핀 102 I/O Bank 3 — User I/O - Bank 3
핀 103 I/O Bank 3 — User I/O - Bank 3
핀 104 I/O Bank 3 — User I/O - Bank 3
핀 105 I/O Bank 3 — User I/O - Bank 3
핀 106 I/O Bank 3 — User I/O - Bank 3
핀 107 VCCIO3 — I/O Bank 3 reference voltage
핀 108 I/O Bank 3 — User I/O - Bank 3
핀 109 I/O Bank 3 — User I/O - Bank 3
핀 110 I/O Bank 3 — User I/O - Bank 3
핀 111 I/O Bank 3 — User I/O - Bank 3
핀 112 I/O Bank 3 — User I/O - Bank 3
핀 113 I/O Bank 3 — User I/O - Bank 3
핀 114 I/O Bank 3 — User I/O - Bank 3
핀 115 I/O Bank 3 — User I/O - Bank 3
핀 116 I/O Bank 3 — User I/O - Bank 3
핀 117 I/O Bank 3 — User I/O - Bank 3
핀 118 I/O Bank 3 — User I/O - Bank 3
핀 119 I/O Bank 3 — User I/O - Bank 3
핀 120 I/O Bank 3 — User I/O - Bank 3
핀 121 GND — Ground
핀 122 I/O Bank 4 — User I/O - Bank 4
핀 123 I/O Bank 4 — User I/O - Bank 4
핀 124 I/O Bank 4 — User I/O - Bank 4
핀 125 I/O Bank 4 — User I/O - Bank 4
핀 126 I/O Bank 4 — User I/O - Bank 4
핀 127 I/O Bank 4 — User I/O - Bank 4
핀 128 I/O Bank 4 — User I/O - Bank 4
핀 129 I/O Bank 4 — User I/O - Bank 4
핀 130 I/O Bank 4 — User I/O - Bank 4
핀 131 VCCINT — 5 V core supply
핀 132 I/O Bank 4 — User I/O - Bank 4
핀 133 I/O Bank 4 — User I/O - Bank 4
핀 134 I/O Bank 4 — User I/O - Bank 4
핀 135 I/O Bank 4 — User I/O - Bank 4
핀 136 GND — Ground
핀 137 I/O Bank 4 — User I/O - Bank 4
핀 138 I/O Bank 4 — User I/O - Bank 4
핀 139 I/O Bank 4 — User I/O - Bank 4
핀 140 I/O Bank 4 — User I/O - Bank 4
핀 141 I/O Bank 4 — User I/O - Bank 4
핀 142 I/O Bank 4 — User I/O - Bank 4
핀 143 I/O Bank 4 — User I/O - Bank 4
핀 144 I/O Bank 4 — User I/O - Bank 4
핀 145 I/O Bank 4 — User I/O - Bank 4
핀 146 I/O Bank 4 — User I/O - Bank 4
핀 147 VCCIO4 — I/O Bank 4 reference voltage
핀 148 I/O Bank 4 — User I/O - Bank 4
핀 149 I/O Bank 4 — User I/O - Bank 4
핀 150 I/O Bank 4 — User I/O - Bank 4
핀 151 I/O Bank 4 — User I/O - Bank 4
핀 152 I/O Bank 4 — User I/O - Bank 4
핀 153 I/O Bank 4 — User I/O - Bank 4
핀 154 I/O Bank 4 — User I/O - Bank 4
핀 155 I/O Bank 4 — User I/O - Bank 4
핀 156 I/O Bank 4 — User I/O - Bank 4
핀 157 I/O Bank 4 — User I/O - Bank 4
핀 158 I/O Bank 4 — User I/O - Bank 4
핀 159 I/O Bank 4 — User I/O - Bank 4
핀 160 I/O Bank 4 — User I/O - Bank 4

일반적인 애플리케이션

EPF8820ARC160-2 적합 용도: 6 애플리케이션s: Legacy Industrial Glue Logic, PCI Bus Bridge / Interface Bridging, Telecom Line-Card Interface Logic, Embedded Microcontroller Peripheral Expansion, Custom State Machines and Protocol Controllers, Legacy Replacement and Field Repair.

🏭

Legacy Industrial Glue Logic

The EPF8820ARC160-2 fits legacy industrial glue-logic applications that previously required dozens of 74-series MSI parts. Its 672 logic elements deliver roughly 8,000 usable gates, enough to integrate address decoding, bus arbitration, custom state machines, and interrupt controllers on a single 5 V device. With 120 user I/O, the part can replace a full board of discrete logic while running from the same 5 V supply as the surrounding TTL/CMOS circuitry. Engineers use the FLEX 8000 architecture to retain in-system reprogrammability during system bring-up, allowing last-minute logic fixes without board respins.

🌐

PCI Bus Bridge / Interface Bridging

The EPF8820ARC160-2 is widely used as a PCI bus bridge or interface bridging device between microprocessors, DSPs, and legacy peripherals. Its 120 user I/O pins can carry an entire 32-bit PCI bus (32 data/address + 8 control) plus ancillary control lines, and the 4-input LUT + carry-chain architecture synthesizes 32-bit counters, FIFOs, and address-decoding logic efficiently. The 5 V TTL I/O is PCI-compliant when the device is configured in PCI mode. Designers appreciate the in-system SRAM programmability for fixing protocol bugs in the field without respinning the host board.

🌐

Telecom Line-Card Interface Logic

Telecom line-card and central-office designs adopted the FLEX 8000 family for custom interface and framing logic. The EPF8820ARC160-2 with 672 LEs and 120 I/O implements HDLC controllers, framing bit-processors, T1/E1 line-interface glue, and custom serial-to-parallel converters on a single device. Its commercial 0 °C to 70 °C range suits environmentally controlled CO bays. The 160-BQFP package's large thermal copper pad area also helps dissipate heat in enclosed, fan-less line-card assemblies. JTAG boundary-scan eases in-system test of the dense BQFP footprint.

🖥️

Embedded Microcontroller Peripheral Expansion

Embedded designs using 8-bit and 16-bit microcontrollers (8051, 68xxx, MIPS, x86) often lack I/O or peripheral features, and the EPF8820ARC160-2 serves as a configurable peripheral-expansion companion. With 120 I/O it adds parallel ports, PWM generators, quadrature decoders, or custom serial interfaces (UART, SPI, I2C master/slave) next to a host MCU that has run out of pins. The 5 V supply matches legacy MCU rails, and in-system SRAM programmability allows firmware engineers to update peripheral behavior alongside MCU firmware revisions.

🔧

Custom State Machines and Protocol Controllers

The EPF8820ARC160-2 is a natural fit for complex state-machine and protocol-controller implementations where discrete 74LS/74AS state machines would consume too much board area. With 672 4-input LUT-based logic elements, the device can implement multi-state machines with hundreds of states, packet-framing logic, custom synchronous protocols, and proprietary bus controllers. Engineers benefit from FPGA design tools that synthesize state machines directly from HDL descriptions, and the in-system reprogrammability allows rapid protocol iteration during OEM development.

✈️

Legacy Replacement and Field Repair

Many long-lifecycle industrial, military, and avionics systems still contain EPF8820ARC160-2 devices that must be repaired for decades. The part supports legacy replacement and field-repair workflows by enabling direct PCB-level swaps on existing 160-BQFP land patterns. Distributors Ocean-Components, Wolfchip, and Micro-Semiconductor report thousands of remaining new-old-stock pieces, which feeds the aftermarket repair pipeline. The 5 V supply, JTAG test, and known-good bitstream ensure repaired systems retain original functionality without requalification.

What family does the EPF8820ARC160-2 belong to?
The EPF8820ARC160-2 belongs to the Intel (formerly Altera) FLEX 8000 family of SRAM-based FPGAs. According to the Intel FLEX 8000 datasheet, the family is built on a 0.5 µm CMOS process and provides 4-input LUT logic elements grouped into LABs. The 'EPF' prefix indicates an Enhanced Programmable Logic Device family, electrically erasable and in-system reconfigurable.
How many logic elements and I/O pins does the EPF8820ARC160-2 have?
The EPF8820ARC160-2 contains 672 logic elements organized into 84 LABs and provides 120 user I/O pins. According to the verified specifications, the typical gate count is 8,000 gates. This density places it as a mid-range member of the FLEX 8000 family, suitable for glue logic, bus bridging, and state-machine integration.
Is the EPF8820ARC160-2 still in production?
The EPF8820ARC160-2 is listed as Obsolete by Intel (formerly Altera). Verified distributor listings on DigiKey, Wolfchip, and Micro-Semiconductor report remaining stock ranging from a few hundred to several thousand pieces, but no new production wafers are being run. Long-term designs should plan a migration to a Cyclone or MAX family equivalent.
What configuration memory does the EPF8820ARC160-2 need?
The EPF8820ARC160-2 uses SRAM configuration memory, which is volatile. Every power-up requires an external configuration device - typically an EPC1, EPC2, or a microcontroller running passive-serial - to load the bitstream. According to the FLEX 8000 datasheet, configuration modes include Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, and JTAG.
What is the supply voltage and temperature range of the EPF8820ARC160-2?
The EPF8820ARC160-2 operates from a 4.75 V to 5.25 V single supply (5 V nominal) and is specified over the commercial 0 °C to 70 °C temperature range. This matches the legacy 5 V TTL/CMOS system voltages used in 1990s industrial and telecom designs. An industrial-grade variant with -40 °C to +85 °C support may also exist under a different speed/order code.
Where can I buy EPF8820ARC160-2 and what is the price?
As of 2026-09-12, EPF8820ARC160-2 is available from franchise distributor DigiKey (stock confirmation required at order entry) and from independent distributors including Ocean-Components (4,225 units), Wolfchip (7,770 units updated 2026-07-22), and Micro-Semiconductor (4,807 units). The unit price starts around $28.50 at qty 1 with volume pricing below $15 at 1,000 pieces. Lead time is typically same-day to 2 weeks for remaining distributor stock.
What is the lead time for EPF8820ARC160-2?
Lead time for EPF8820ARC160-2 is governed by remaining distributor and broker stock rather than factory production. As of 2026-09-12, independent distributors Ocean-Components (4,225 units), Wolfchip (7,770 units), and Micro-Semiconductor (4,807 units) report immediate shipment capability. No factory lead time is available because the part is Obsolete - large orders may require multi-vendor aggregation or franchised-broker sourcing.
EPF8820ARC160-2 vs EPF8820AQC160-2 - which should I choose?
Choose the EPF8820ARC160-2 (160-BQFP, Metric QFP) if your PCB was designed for the metric quad flat-pack footprint and you need the largest thermal copper pad area. Choose the EPF8820AQC160-2 (160-pin PQFP, standard JEDEC QFP) if your board uses the standard JEDEC PQFP land pattern with a smaller thermal pad. Both deliver 672 LEs and 120 I/O at the same speed grade -2, but the land pattern is not identical, so verify the PCB footprint before substituting.
When should I choose EPF8820ARC160-2 over EPF8636ARC208-4?
Choose EPF8820ARC160-2 when you need 672 LEs in a 160-BQFP package - sufficient for glue logic and modest bus-bridging, with the lowest cost in the FLEX 8000 family. Choose EPF8636ARC208-4 when you need higher logic density (greater LE count), a larger 208-pin package, and the speed-grade -4 (faster timing). The EPF8636 family targets designs that exceed the EPF8820's logic capacity while keeping the FLEX 8000 architecture and 5 V supply.
What is the best drop-in replacement for EPF8820ARC160-2?
The best drop-in replacement for EPF8820ARC160-2 is the EPF8820AQC160-2 from the same Intel FLEX 8000 family, which provides identical 672 LEs, 120 I/O, and speed grade -2 but in the 160-pin JEDEC PQFP package. If the exact 160-BQFP metric land pattern is mandatory, the EPF8820ARC160-3 or EPF8820ARC160-4 (faster speed grades) remain on the same BQFP footprint. No cross-brand drop-in exists in the same package and pinout.
Where can I download the EPF8820ARC160-2 datasheet PDF?
The official Intel FLEX 8000 family datasheet (which covers EPF8820ARC160-2) is hosted at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/ds/archives/flex8000.pdf. Distributor-hosted copies also appear on Hotenda, ABC-Semi, and FPGAkey. The datasheet contains pinout, timing, configuration modes, and DC/AC characteristics for every member of the EPF8xxx family including the EPF8820ARC160-2 variant.
Where can I find the EPF8820ARC160-2 pinout diagram?
The EPF8820ARC160-2 pinout for the 160-BQFP (Metric Quad Flat Pack) package is documented in the official Intel FLEX 8000 datasheet, in the section titled '160-Pin BQFP Package Pin-Outs' for the EPF8820 device. Each pin is assigned to one of four I/O banks (I/O Bank 1 through I/O Bank 4), with dedicated configuration, JTAG, power, and ground pins. Online distributors such as Veswin and FBGA Online also publish a pin-out summary, but the manufacturer datasheet is the authoritative source.
What is the difference between speed grades -2, -3, and -4 on the EPF8820ARC160 family?
Speed grades -2, -3, and -4 on the EPF8820ARC160 family indicate increasing internal performance, with -2 being the slowest and -4 the fastest (lower pin-to-pin and register-to-register delay). According to the FLEX 8000 datasheet, all three grades are pin-compatible in the 160-BQFP package, so the EPF8820ARC160-2 can be directly replaced by EPF8820ARC160-3 or EPF8820ARC160-4 on the same PCB if higher timing margin is needed, but not the reverse.
What are the key specifications of EPF8820ARC160-2 that engineers should know?
Key specifications of EPF8820ARC160-2: 672 logic elements, 84 LABs, 8,000 typical gates, 120 user I/O pins, 160-BQFP (Metric QFP) surface-mount package, 5 V supply (4.75 V to 5.25 V), commercial 0 °C to 70 °C range, SRAM configuration (volatile, requires external EPC1/EPC2 EPROM), JTAG IEEE 1149.1 boundary scan, and speed grade -2. The part is in Obsolete lifecycle status with remaining distributor stock - verify availability at order entry.

엔지니어링 참조 데이터: EPF8820ARC160-2 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EPF8820ARC160-2 when you need a 5 V legacy FPGA with 672 logic elements and 120 user I/O in a hand-solderable 160-BQFP (Metric QFP) package, especially for repair, legacy industrial glue-logic, or PCI bridge designs where the original PCB land pattern is fixed. If you need faster timing on the same PCB footprint, upgrade to EPF8820ARC-4 or EPF8820ARC-4N (same 160-BQFP, speed grade -4). If your board already uses the JEDEC 160-PQFP land pattern, choose EPF8820AQC160-2 (same die, different package). If you have PCB redesign freedom and want more I/O headroom, consider EPF8820AGC192-2 (192-pin PGA). For new designs, migrate to a modern Cyclone IV/V or MAX II/V family - the FLEX 8000 family is obsolete and lacks long-term supply guarantees.

대체품과의 비교

파라미터 이 제품 EPF8820AQC160-2 EPF8820ARC-4N EPF8820ARC-4 EPF8820AGC192-2 EPF8820ABC225-4
Package 160-BQFP (Metric QFP) 160-pin PQFP (JEDEC QFP) - land pattern differs 160-BQFP (Metric QFP) - same footprint 160-BQFP (Metric QFP) - same footprint 192-pin PGA - package differs 225-BGA - package differs
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Elements 672 672 672 672 672 672
LABs / CLBs 84 84 84 84 84 84
User I/O 120 120 120 120 120 (same die, fewer routed to package) 120 (same die, more package pins available)
Speed Grade -2 -2 -4 (faster) -4 (faster) -2 -4 (faster)
Supply Voltage 5 V (4.75-5.25 V) 5 V (4.75-5.25 V) 5 V (4.75-5.25 V) 5 V (4.75-5.25 V) 5 V (4.75-5.25 V) 5 V (4.75-5.25 V)
Operating Temperature 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C 0 to 70 °C
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

주요 차별점

  • True drop-in speed-grade upgrade on identical 160-BQFP land pattern (vs EPF8820ARC-4N)
  • Same die in higher-pin-count package enables I/O reassignment (vs EPF8820AGC192-2)
  • Lowest-cost entry point into the FLEX 8000 family with 120 I/O (vs EPF8820ABC225-4)

설계 노트

The EPF8820ARC160-2 requires a clean 5 V supply (4.75 V to 5.25 V) on VCCINT pins, plus separate VCCIO1/VCCIO2/VCCIO3/VCCIO4 rails for each of the four I/O banks. Estimated: a fully utilized EPF8820 with all 120 I/O toggling at 50 MHz draws roughly 200-300 mA on VCCINT plus I/O supply current proportional to loading. Decouple each VCC/VCCIO pin with a 0.1 µF ceramic and place a bulk 47 µF tantalum near the device. Configuration EPROM supply must ramp within Intel-specified tRSTL/VCC timing to avoid configuration failure.

The 160-BQFP (Metric Quad Flat Pack) has a 0.65 mm pitch and ~28 mm body. Provide 4-layer PCB with solid ground and power planes directly under the device for VCCINT/GND return paths. Keep configuration EPROM (EPC1/EPC2) within 50 mm to minimize passive-serial trace length. Use 0.1 µF decoupling within 5 mm of each VCC pin. JTAG chain should have a 10 kΩ pull-up on TCK/TMS/TDI to keep the boundary-scan state valid at power-up.

Common pitfalls with EPF8820ARC160-2 designs: (1) forgetting that configuration SRAM is volatile - the device WILL NOT retain its design without an external EPC1/EPC2 EPROM or MCU passive-serial master; (2) mixing 160-BQFP metric) and 160-PQFP (JEDEC) land patterns - they are NOT identical; (3) ignoring the speed-grade downgrades: replacing -4 with -2 reduces timing margin; (4) leaving JTAG chain unterminated can lock the device into a non-functional state during power-up; (5) using 3.3 V signals on a 5 V VCCIO bank without level translation violates Absolute Maximum Ratings.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Compliance status not stated in verified web data; legacy 1990s FLEX 8000 parts typically pre-date RoHS but were offered in lead-free variants under the 'N' suffix. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified.

데이터 검증일: 2026-09-12 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EPF8820ARC160-2 EPF8820ARC160-2 datasheet Intel EPF8820ARC160-2 FLEX 8000 FPGA 672 logic elements 160-BQFP FPGA 5V EPF8820ARC160-2 PCI bridge EPF8820ARC160-2 vs EPF8820AQC160-2 EPF8820ARC160-2 drop-in replacement EPF8820ARC160-2 buy price obsolete how to configure FLEX 8000 FPGA EPF8820ARC160-2 pinout 160-BQFP legacy 5V FPGA glue logic EPF8820ARC160-2 EPC1 configuration obsolete FLEX 8000 FPGA alternative FLEX 8000 speed grade -2 vs -4

관련 부품 & 용어

Intel Altera Intel Programmable Solutions Group EPF8820ARC160-2 EPF8820AQC160-2 EPF8820ARC-4 EPF8820ARC-4N EPF8820AGC192-2 EPF8820ABC225-4 FLEX 8000 FPGA Field-Programmable Gate Array Logic Array Block LAB logic element LE Look-Up Table LUT BQFP Quad Flat Pack PQFP JEDEC surface mount SMD JTAG IEEE 1149.1 boundary scan SRAM EPC1 EPC2 configuration EPROM PCI bus 5V supply TTL CMOS glue logic industrial control telecom line card embedded microcontroller peripheral legacy replacement state machine protocol controller RoHS AEC-Q100
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