EPF8820AQC160-2 - FLEX 8000 FPGA, 672 Cells, 160-PQFP | Intel
MPN: EPF8820AQC160-2 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $17.9 | $17,900.00 |
Drop-in alternatives for EPF8820AQC160-2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF8820AQC160-3
β Drop-Inβ In Stock
$17.95 / Unit
View Datasheet βEPF8820AQC160-4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$17.95 / Unit
View Datasheet βEPF8820AGC160-3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPF8820AQC160
β Drop-Inπ Reference alternative (not in catalog)
EPF8820AGC192-2
β Drop-Inβ In Stock
$55 / Unit
View Datasheet βEPF8820AQC160-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Cells | 672 |
| Usable Gates | 8,000 |
| User I/Os | 120 |
| Supply Voltage | 5 V |
| Process Technology | 0.42 Β΅m CMOS |
| Maximum Frequency | 125 MHz |
| Speed Grade | -2 |
| Logic Family | CMOS |
| Operating Temperature | 0 Β°C to 70 Β°C (Commercial) |
| Package | 160-pin PQFP (BQFP) |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| RoHS Status | Compliant |
EPF8820AQC160-2 Pin Configuration
| Pin 1 | I/O β User I/O pin |
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| Pin 21 | VCC β 5V supply |
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| Pin 41 | GND β Ground |
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| Pin 61 | VCC β 5V supply |
| Pin 62 | I/O β User I/O pin |
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| Pin 81 | GND β Ground |
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| Pin 101 | VCC β 5V supply |
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| Pin 121 | GND β Ground |
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| Pin 141 | VCC β 5V supply |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820AQC160-2 is suitable for 6 applications: PCI Bus Interface Bridge, Glue Logic Replacement (74-series Consolidation), Industrial Control Board Logic, Telecommunications Line-Card Interface, Legacy Microprocessor Peripheral Glue, Engineering Education and FPGA Architecture Studies.
PCI Bus Interface Bridge
The EPF8820AQC160-2 is well suited for PCI bus interface bridging in legacy add-in cards and embedded motherboards. Its 120 user I/Os comfortably accommodate the 32-bit, 33 MHz PCI bus (49 signals) plus glue logic for address decoding, command handling, and interrupt steering, with headroom remaining for application-specific registers and FIFOs. The 5 V PCI signaling standard matches the FLEX 8000 I/O supply directly, eliminating level shifters. The 672 logic cells provide ample capacity for target/initiator state machines, configuration-space registers, and bus-master DMA engines. Compared with discrete 74-series logic, a single EPF8820AQC160-2 replaces dozens of packages, reducing PCB area and improving signal integrity by shortening interconnect.
Recommended
Glue Logic Replacement (74-series Consolidation)
Many legacy designs use clusters of 74FCT, 74ABT, or 74ACT TTL packages for address decoding, bus multiplexing, and register-based control. The EPF8820AQC160-2 can absorb 20-40 such packages into a single 160-PQFP device, freeing substantial board area and reducing BOM count. Its 5 V tolerant I/Os interface directly with existing TTL logic without level translation, and the SRAM-based configuration permits last-minute design changes during prototyping. The -2 speed grade delivers sub-10 ns combinatorial delays, matching the propagation time of multiple cascaded TTL gates, making timing closure transparent for typical glue-logic tasks.
Recommended
Industrial Control Board Logic
Factory automation controllers often require custom logic for sensor conditioning, motor-step pulse generation, encoder quadrature decoding, and safety-interlock handling. The EPF8820AQC160-2 fits these tasks with its 120 I/Os accepting 5 V sensor signals directly, and 672 logic cells supporting multiple state machines in parallel. Commercial temperature grade (0 Β°C to 70 Β°C) suits cabinet-mounted equipment, while the PQFP package withstands industrial vibration when properly socketed or potted. The JTAG boundary scan simplifies factory board test, catching solder defects and wiring errors before deployment.
Recommended
Telecommunications Line-Card Interface
TDM (Time Division Multiplexing) line cards in legacy telecom infrastructure use FPGAs for HDB3/AMI encoding, framing, alarm extraction, and switch-matrix control. The EPF8820AQC160-2's 125 MHz toggle rate accommodates E1 (2.048 MHz) and T1 (1.544 MHz) bit-rate designs with ample timing margin, while the 120 I/Os handle multiple E1/T1 ports in parallel plus backplane interfaces. Its 5 V supply matches the -48 V telecom bus-derived rails used in central-office line cards. The in-circuit reconfigurability permits remote firmware updates, valuable for installed-base service.
Recommended
Legacy Microprocessor Peripheral Glue
Embedded systems based on Intel 80x86, Motorola 68k, or older ARM processors often need custom peripherals such as interrupt controllers, DMA engines, memory-mapping logic, and watchdog timers. The EPF8820AQC160-2 can implement all of these in a single device, with its 672 cells and 120 I/Os accommodating 4-6 peripheral functions concurrently. The 5 V I/O bank interfaces directly with classic microprocessor buses, and the JTAG interface allows in-system debugging of soft-core peripherals during development.
Recommended
Engineering Education and FPGA Architecture Studies
Universities teaching digital design and FPGA architecture often use legacy Altera/Intel FPGAs because of their well-documented architectures and abundant reference designs. The EPF8820AQC160-2's 672-cell capacity is large enough for meaningful designs (UART, VGA controller, simple CPU) yet small enough to fit within student lab budgets. The 160-PQFP package is large enough to probe with oscilloscope hooks, and JTAG-based configuration via a ByteBlaster or USB-Blaster cable provides hands-on programming experience that aligns with industry-standard FPGA toolchains.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820AQC160-2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820AQC160-3 | EPF8820AQC160-4 | EPF8820AGC160-3 | EPF8820AQC160 | EPF8820AGC192-2 |
|---|---|---|---|---|---|---|
| Package | 160-PQFP (BQFP) | 160-PQFP (BQFP) - same | 160-PQFP (BQFP) - same | 160-PQFP (BQFP) - same | 160-PQFP (BQFP) - same | 192-pin PQFP variant |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| User I/Os | 120 | 120 | 120 | 120 | 120 | 152 |
| Speed Grade | -2 | -3 (faster) | -4 (fastest) | -3 (faster) | unspecified (standard) | -2 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum Frequency | 125 MHz | ~140 MHz | ~155 MHz | ~140 MHz | ~110 MHz | 125 MHz |
| Operating Temperature | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (Commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Obsolete | NRND |
Key Differentiators
- Mid-tier -2 speed grade suitable for general commercial designs (vs EPF8820AQC160-3)
- 160-PQFP package is hand-prototype-friendly (vs EPF8820ABC225-4)
- JTAG-based programming and boundary scan included (vs Discrete 74-series glue logic)
Design Notes
The EPF8820AQC160-2 requires a clean 5 V supply on VCCINT and VCCIO pins (separated internally). Decouple each VCC pin with a 0.1 Β΅F ceramic capacitor placed within 5 mm of the package, plus a bulk 10-47 Β΅F tantalum or polymer capacitor on the board. During configuration, the device draws brief inrush current up to several hundred mA; size the regulator accordingly. SRAM-based configuration is volatile β the device must be reconfigured after every power-up.
PQFP-160 packages with 0.65 mm pitch require PCB pad design following IPC-7351 guidelines with a slightly shorter pad length to prevent solder bridging. Use a reflow profile with peak temperature below 240 Β°C and time-above-liquidus under 60 seconds to avoid package delamination. For hand-prototyping or rework, use a fine-tip soldering iron and no-clean flux with low residue.
Place the EPC1 or EPC2 configuration PROM within 50 mm of the EPF8820AQC160-2 to keep DCLK and DATA0 traces short and matched (within 10 mm). Add a 1 kΞ© pull-up resistor on nCONFIG and a 1 kΞ© pull-down on nSTATUS to ensure deterministic configuration startup. Use a dedicated ground plane under the FPGA and PROM to reduce switching-noise coupling into configuration signals.
Common pitfalls include: (1) failing to provide the JTAG chain termination resistors on TMS and TCK, causing intermittent configuration failures; (2) tying CONF_DONE low before power-up, preventing configuration; (3) leaving unused I/O pins floating β these should be set to outputs driving ground or configured as inputs with internal pull-ups to avoid mid-rail oscillation that draws supply current; (4) forgetting that nCONFIG must be toggled low-then-high to reconfigure the device.
Compliance Information
RoHS and lead-free compliant per Altera/Intel product page. NRND status does not affect compliance β existing inventory remains compliant. AEC-Q100 not applicable for commercial-grade FPGA.
