EPM240M100C5N - MAX II CPLD 192MC 80 I/O | Intel
Référence : EPM240M100C5N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.45 | $74,50 |
| 100 | $6.3 | $630,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.25 | $4 250,00 |
EPM240M100C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLD (Programmable Logic Device) macrocells on a single chip with a central interconnect matrix. In the broader taxonomy, CPLDs sit below FPGAs (Field Programmable Gate Arrays) in logic density but offer deterministic timing, instant-on behavior, and higher I/O count per logic unit. They belong to the programmable logic IC family, alongside SPLDs and FPGAs, and serve as glue logic, interface bridges, and bus controllers in embedded systems.
Key features include 240 logic elements, 4.7 ns tPD (propagation delay), 8 Kbits of user Flash memory, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) for bridging between logic domains. The 0.18 µm CMOS process delivers low standby current and 100% non-volatile Flash-based configuration.
Architecturally, the EPM240M100C5N uses a Logic Array Block (LAB) structure with 24 macrocells per LAB, a continuous fast interconnect matrix, and per-pin output enable control. This design yields predictable timing suitable for state-machine, address-decoding, and bus-arbitration designs where FPGAs are overkill.
Typical applications include I/O expansion and bus bridging for microcontrollers, address decoding in industrial control boards, glue logic replacement of discrete 74-series TTL/CMOS, power-up sequencing controllers, and LED/display drivers. Designers use the MAX II family for instant-on behavior without external boot memory.
Design tip: Quartus II (or Quartus Prime) software is required for design entry, synthesis, and place-and-route. Plan I/O bank voltage assignments early because mixing 1.5 V, 1.8 V, 2.5 V, and 3.3 V on different banks requires careful JTAG chain planning.
This page synthesizes distributor pricing, drop-in alternatives from the MAX II family, and practical Quartus toolchain guidance not always found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM240M100C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240M100C5N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Configuration Memory, Operating Temperature, Programming Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240M100C4N
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →EPM240ZM100C6N
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPM240ZM68C7N
✅ Remplacement direct✓ En stock
$4.2 / unité
Voir la fiche technique →EPM240T100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.65 / unité
Voir la fiche technique →EPM240GM100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.75 / unité
Voir la fiche technique →EPM240F100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.2 / unité
Voir la fiche technique →EPM240M100C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements | 240 |
| Macrocells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 4.7 ns |
| User Flash Memory | 8 Kbits |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Température de fonctionnement | -40 C to +125 C |
| Boîtier | 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch |
| Type de montage | Surface Mount |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | On-chip Flash (non-volatile) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Statut RoHS | Compliant (lead-free) |
| Logic Family | CMOS |
Configuration des broches de EPM240M100C5N
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche A3 | I/O — User I/O pin (bank 1) |
| Broche A4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A5 | I/O — User I/O pin (bank 1) |
| Broche A6 | I/O — User I/O pin (bank 1) |
| Broche A7 | I/O — User I/O pin (bank 1) |
| Broche A8 | I/O — User I/O pin (bank 1) |
| Broche A9 | GND — Ground |
| Broche A10 | I/O — User I/O pin (bank 2) |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | I/O — User I/O pin (bank 1) |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — User I/O pin (bank 1) |
| Broche B5 | I/O — User I/O pin (bank 1) |
| Broche B6 | VCCIO1 — I/O bank 1 supply voltage |
| Broche B7 | I/O — User I/O pin (bank 1) |
| Broche B8 | I/O — User I/O pin (bank 1) |
| Broche B9 | I/O — User I/O pin (bank 2) |
| Broche B10 | I/O — User I/O pin (bank 2) |
| Broche C1 | I/O — User I/O pin (bank 1) |
| Broche C2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche C3 | I/O — User I/O pin (bank 1) |
| Broche C4 | I/O — User I/O pin (bank 1) |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O pin (bank 1) |
| Broche C7 | I/O — User I/O pin (bank 1) |
| Broche C8 | GND — Ground |
| Broche C9 | I/O — User I/O pin (bank 2) |
| Broche C10 | I/O — User I/O pin (bank 2) |
| Broche D1 | GND — Ground |
| Broche D2 | I/O — User I/O pin (bank 1) |
| Broche D3 | I/O — User I/O pin (bank 1) |
| Broche D4 | I/O — User I/O pin (bank 1) |
| Broche D5 | I/O — User I/O pin (bank 1) |
| Broche D6 | I/O — User I/O pin (bank 1) |
| Broche D7 | I/O — User I/O pin (bank 1) |
| Broche D8 | I/O — User I/O pin (bank 1) |
| Broche D9 | I/O — User I/O pin (bank 2) |
| Broche D10 | VCCIO2 — I/O bank 2 supply voltage |
| Broche E1 | I/O — User I/O pin (bank 1) |
| Broche E2 | I/O — User I/O pin (bank 1) |
| Broche E3 | I/O — User I/O pin (bank 1) |
| Broche E4 | VCCINT — Core supply voltage (1.8 V) |
| Broche E5 | I/O — User I/O pin (bank 1) |
| Broche E6 | I/O — User I/O pin (bank 1) |
| Broche E7 | VCCINT — Core supply voltage (1.8 V) |
| Broche E8 | I/O — User I/O pin (bank 2) |
| Broche E9 | I/O — User I/O pin (bank 2) |
| Broche E10 | I/O — User I/O pin (bank 2) |
| Broche F1 | I/O — User I/O pin (bank 1) |
| Broche F2 | GND — Ground |
| Broche F3 | I/O — User I/O pin (bank 1) |
| Broche F4 | I/O — User I/O pin (bank 1) |
| Broche F5 | TCK — JTAG clock input |
| Broche F6 | TDO — JTAG data out |
| Broche F7 | I/O — User I/O pin (bank 2) |
| Broche F8 | I/O — User I/O pin (bank 2) |
| Broche F9 | GND — Ground |
| Broche F10 | I/O — User I/O pin (bank 2) |
| Broche G1 | I/O — User I/O pin (bank 1) |
| Broche G2 | I/O — User I/O pin (bank 1) |
| Broche G3 | I/O — User I/O pin (bank 1) |
| Broche G4 | TMS — JTAG mode select |
| Broche G5 | TDI — JTAG data in |
| Broche G6 | I/O — User I/O pin (bank 2) |
| Broche G7 | I/O — User I/O pin (bank 2) |
| Broche G8 | I/O — User I/O pin (bank 2) |
| Broche G9 | I/O — User I/O pin (bank 2) |
| Broche G10 | I/O — User I/O pin (bank 2) |
| Broche H1 | I/O — User I/O pin (bank 1) |
| Broche H2 | I/O — User I/O pin (bank 1) |
| Broche H3 | I/O — User I/O pin (bank 1) |
| Broche H4 | nCONFIG — Configuration control (active-low) |
| Broche H5 | nCE — Chip enable (active-low) |
| Broche H6 | I/O — User I/O pin (bank 2) |
| Broche H7 | I/O — User I/O pin (bank 2) |
| Broche H8 | I/O — User I/O pin (bank 2) |
| Broche H9 | I/O — User I/O pin (bank 2) |
| Broche H10 | I/O — User I/O pin (bank 2) |
| Broche J1 | I/O — User I/O pin (bank 1) |
| Broche J2 | GND — Ground |
| Broche J3 | I/O — User I/O pin (bank 1) |
| Broche J4 | I/O — User I/O pin (bank 1) |
| Broche J5 | I/O — User I/O pin (bank 1) |
| Broche J6 | I/O — User I/O pin (bank 2) |
| Broche J7 | I/O — User I/O pin (bank 2) |
| Broche J8 | VCCIO2 — I/O bank 2 supply voltage |
| Broche J9 | GND — Ground |
| Broche J10 | I/O — User I/O pin (bank 2) |
| Broche K1 | I/O — User I/O pin (bank 1) |
| Broche K2 | I/O — User I/O pin (bank 1) |
| Broche K3 | I/O — User I/O pin (bank 1) |
| Broche K4 | I/O — User I/O pin (bank 1) |
| Broche K5 | GND — Ground |
| Broche K6 | I/O — User I/O pin (bank 2) |
| Broche K7 | I/O — User I/O pin (bank 2) |
| Broche K8 | I/O — User I/O pin (bank 2) |
| Broche K9 | I/O — User I/O pin (bank 2) |
| Broche K10 | I/O — User I/O pin (bank 2) |
| Broche L1 | VCCIO1 — I/O bank 1 supply voltage |
| Broche L2 | I/O — User I/O pin (bank 1) |
| Broche L3 | I/O — User I/O pin (bank 1) |
| Broche L4 | GND — Ground |
| Broche L5 | I/O — User I/O pin (bank 1) |
| Broche L6 | I/O — User I/O pin (bank 2) |
| Broche L7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche L8 | I/O — User I/O pin (bank 2) |
| Broche L9 | I/O — User I/O pin (bank 2) |
| Broche L10 | I/O — User I/O pin (bank 2) |
| Broche M1 | I/O — User I/O pin (bank 1) |
| Broche M2 | I/O — User I/O pin (bank 1) |
| Broche M3 | I/O — User I/O pin (bank 1) |
| Broche M4 | I/O — User I/O pin (bank 1) |
| Broche M5 | I/O — User I/O pin (bank 1) |
| Broche M6 | I/O — User I/O pin (bank 2) |
| Broche M7 | I/O — User I/O pin (bank 2) |
| Broche M8 | I/O — User I/O pin (bank 2) |
| Broche M9 | GND — Ground |
| Broche M10 | I/O — User I/O pin (bank 2) |
| Broche N1 | I/O — User I/O pin (bank 1) |
| Broche N2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche N3 | I/O — User I/O pin (bank 1) |
| Broche N4 | I/O — User I/O pin (bank 1) |
| Broche N5 | GND — Ground |
| Broche N6 | I/O — User I/O pin (bank 2) |
| Broche N7 | I/O — User I/O pin (bank 2) |
| Broche N8 | I/O — User I/O pin (bank 2) |
| Broche N9 | I/O — User I/O pin (bank 2) |
| Broche N10 | I/O — User I/O pin (bank 2) |
| Broche P1 | I/O — User I/O pin (bank 1) |
| Broche P2 | I/O — User I/O pin (bank 1) |
| Broche P3 | I/O — User I/O pin (bank 1) |
| Broche P4 | I/O — User I/O pin (bank 1) |
| Broche P5 | I/O — User I/O pin (bank 1) |
| Broche P6 | I/O — User I/O pin (bank 2) |
| Broche P7 | I/O — User I/O pin (bank 2) |
| Broche P8 | I/O — User I/O pin (bank 2) |
| Broche P9 | I/O — User I/O pin (bank 2) |
| Broche P10 | I/O — User I/O pin (bank 2) |
Applications typiques
EPM240M100C5N convient pour 7 applications: Microcontroller I/O Expansion and Bus Bridging, Industrial Address Decoding and Memory Interfacing, Power-Up Sequencing and Reset Distribution, Glue Logic Replacement for 74-Series TTL/CMOS, LED Display Drivers and Panel Controllers, Communication Interface Bridging (UART/SPI/I2C Glue Logic), Embedded State Machine and Custom Peripherals.
Microcontroller I/O Expansion and Bus Bridging
The EPM240M100C5N fits microcontroller I/O expansion because its 80 user I/Os and 4.7 ns tPD let it translate between 3.3 V MCU buses and 1.8 V/2.5 V peripheral logic with deterministic timing. With 192 macrocells, designers can implement custom parallel-to-SPI bridges, GPIO expanders, and address-latch circuits without software overhead. Multi-voltage I/O support (1.5/1.8/2.5/3.3 V) eliminates external level shifters, simplifying PCB layout for mixed-domain industrial designs.
Recommandé
Industrial Address Decoding and Memory Interfacing
The EPM240M100C5N suits address-decoding applications because its 4.7 ns propagation delay keeps chip-select generation within a single clock cycle at 100 MHz+ bus speeds. With 192 macrocells, engineers can implement multiple decode windows, wait-state generators, and bank-switching logic for SRAM, NOR Flash, and peripheral overlays. Non-volatile Flash-based configuration means no boot PROM and instant-on decoding at power-up, critical for deterministic industrial controller boot.
Recommandé
Power-Up Sequencing and Reset Distribution
The EPM240M100C5N works well for multi-rail power sequencing because its instant-on Flash configuration executes logic at the first clock edge without external boot memory. With 192 macrocells, designers can build cascaded delay timers, voltage-rail monitors, and watchdog reset distribution for systems with 5+ independent supply rails. The 1.8 V core and wide I/O voltage range let it interface directly to PMBus controllers and supervisor ICs without level translation.
Recommandé
Glue Logic Replacement for 74-Series TTL/CMOS
The EPM240M100C5N replaces dozens of discrete 74LS, 74HC, and 74AHC glue-logic ICs because 192 macrocells can implement many standard functions in a single 6 x 6 mm package. With 4.7 ns tPD, it matches 74F-series speed while reducing PCB area, BOM count, and stock-keeping complexity. Instant-on Flash configuration means no boot delay, and JTAG programming allows in-system rework without hot-air desoldering.
Recommandé
LED Display Drivers and Panel Controllers
The EPM240M100C5N drives multiplexed LED panels and small TFT displays because its 80 user I/Os provide enough channels for 8:1 to 16:1 multiplexed row/column scanning without external drivers. With 192 macrocells, PWM dimming, blanking control, and brightness correction can all be implemented in hardware with 4.7 ns response, eliminating software jitter. Multi-voltage I/O lets it drive both 3.3 V logic-level LED drivers and 5 V common-anode displays directly.
Recommandé
Communication Interface Bridging (UART/SPI/I2C Glue Logic)
The EPM240M100C5N bridges incompatible communication interfaces because its 192 macrocells can host custom UART-to-SPI, SPI-to-I2C, and parallel-to-LVDS converters with deterministic timing. With 4.7 ns tPD, it handles up to ~50 MHz parallel bus rates without timing closure issues, and 80 I/Os accommodate multiple concurrent channels. Non-volatile Flash configuration allows field updates via JTAG, simplifying protocol revision management across product variants.
Recommandé
Embedded State Machine and Custom Peripherals
The EPM240M100C5N implements complex Mealy/Moore state machines and custom peripherals offloading MCU resources because its deterministic 4.7 ns tPD and parallel macrocell architecture execute state logic in zero software cycles. With 192 macrocells, designers can build timing-critical peripherals (motor-control PWM, encoder quadrature decoders, custom stepper pulse generators) that would otherwise consume MCU interrupt bandwidth. On-chip 8 Kbit user Flash stores configuration parameters and calibration constants.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240M100C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240M100C4N | EPM240ZM100C6N | EPM240ZM68C7N | EPM240T100C5N | EPM240GM100C5N | EPM240F100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-ball MBGA (6 x 6 mm) | 100-ball MBGA (6 x 6 mm) - same | 100-ball MBGA (6 x 6 mm) - same | 68-ball MBGA - different | 100-pin TQFP - different | 100-ball MBGA (6 x 6 mm) - same | 100-pin FBGA - same ball count, finer pitch |
| Brand | Intel | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Speed Grade (tPD) | 4.7 ns (-5) | <4 ns (-4, +20% speed) | ~6 ns (-6, -20% speed) | ~7 ns (-7, -30% speed) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) |
| User I/Os | 80 | 80 | 80 | ~52 (reduced for 68-ball package) | 80 | 80 | 80 |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 C to +125 C (industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Configuration Memory | On-chip Flash (non-volatile) | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Unit Price (qty 1, USD) | 8.20 | ~9.50 | ~7.80 | ~6.50 | ~8.50 | ~8.20 | ~8.60 |
Principaux différenciateurs
- Highest speed-grade variant in 100-ball MBGA package (vs EPM240ZM100C6N)
- Largest I/O count in MAX II family at 80 user I/Os (vs EPM240ZM68C7N)
- Direct Quartus II/Prime tool support with mature IP library (vs EPM240T100C5N)
Notes de conception
The 100-ball MBGA package uses 0.5 mm ball pitch on a 6 x 6 mm substrate. Per IPC-7351 and Intel MAX II design guidelines, use 0.27 mm solder mask openings, NSMD (non-solder mask defined) pads, and a 4-6 layer stack-up with continuous ground planes beneath the device. Via-in-pad is NOT recommended; use dog-bone fan-out to inner layers. Microstrip impedance should be 50 ohm single-ended for high-speed signals.
The EPM240M100C5N requires a clean 1.8 V core supply (VCCINT) decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each VCCINT pin. Each I/O bank has its own VCCIO supply (VCCIO1, VCCIO2, etc.) which can be set independently to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Decouple each VCCIO with 0.1 uF plus 4.7 uF bulk; place capacitors as close as possible to the supply balls to minimize inductive ringing on logic-level transitions.
Do NOT use 4-wire JTAG when the device is in user mode unless nCONFIG is held low; this can cause unintended reconfiguration. For multi-device JTAG chains, ensure TMS and TCK are properly buffered because the MAX II JTAG pins have limited drive strength. For in-system programming, always include 10 kohm pull-ups on nCONFIG and nCE to prevent spurious configuration during power-up transients.
The 100-ball MBGA package has lead inductance of approximately 0.5 nH per ball, which combined with package capacitance (~1.5 pF) creates resonances in the 800 MHz to 1.5 GHz range. For signals above 100 MHz, use series damping resistors (22-33 ohm) at the driver to flatten impedance discontinuities. Simulate with the MAX II IBIS model (available from Intel) before finalizing PCB layout.
The 100-ball MBGA package has typical theta-JA of 36 C/W with standard JEDEC test board (still air). Under typical CPLD workloads (10-15 MHz internal frequency, 30% I/O toggling), self-heating is negligible (<1 C rise). For continuous high-I/O-throughput designs (>50 MHz toggle rates on >40 outputs), allocate at least 4 thermal vias under the center thermal ball array to spread heat to inner ground planes. The junction-to-ambient thermal resistance can drop to ~25 C/W with proper via stitching.
Informations de conformité
RoHS compliant per Altera (now Intel) product page and DigiKey listing. Lead-free MBGA package. Not AEC-Q100 qualified - this is an industrial/consumer-grade CPLD, not automotive. Halogen-free status not explicitly stated in available data.
