EPM240M100C5N - MAX II CPLD 192MC 80 I/O | Intel
MPN: EPM240M100C5N ⚠ רכישה אחרונהEPM240M100C5N סקירה
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLD (Programmable Logic Device) macrocells on a single chip with a central interconnect matrix. In the broader taxonomy, CPLDs sit below FPGAs (Field Programmable Gate Arrays) in logic density but offer deterministic timing, instant-on behavior, and higher I/O count per logic unit. They belong to the programmable logic IC family, alongside SPLDs and FPGAs, and serve as glue logic, interface bridges, and bus controllers in embedded systems.
Key features include 240 logic elements, 4.7 ns tPD (propagation delay), 8 Kbits of user Flash memory, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) for bridging between logic domains. The 0.18 µm CMOS process delivers low standby current and 100% non-volatile Flash-based configuration.
Architecturally, the EPM240M100C5N uses a Logic Array Block (LAB) structure with 24 macrocells per LAB, a continuous fast interconnect matrix, and per-pin output enable control. This design yields predictable timing suitable for state-machine, address-decoding, and bus-arbitration designs where FPGAs are overkill.
Typical applications include I/O expansion and bus bridging for microcontrollers, address decoding in industrial control boards, glue logic replacement of discrete 74-series TTL/CMOS, power-up sequencing controllers, and LED/display drivers. Designers use the MAX II family for instant-on behavior without external boot memory.
Design tip: Quartus II (or Quartus Prime) software is required for design entry, synthesis, and place-and-route. Plan I/O bank voltage assignments early because mixing 1.5 V, 1.8 V, 2.5 V, and 3.3 V on different banks requires careful JTAG chain planning.
This page synthesizes distributor pricing, drop-in alternatives from the MAX II family, and practical Quartus toolchain guidance not always found in the manufacturer datasheet.
חלופות תחליף ישיר עבור EPM240M100C5N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPM240M100C5N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Process Technology, Configuration Memory, Operating Temperature, Programming Interface.
EPM240M100C4N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240ZM100C6N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240ZM68C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240T100C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240GM100C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240F100C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM240M100C5N דירוגים מרביים ומאפיינים חשמליים
| Family | MAX II |
| Logic Elements | 240 |
| Macrocells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 4.7 ns |
| User Flash Memory | 8 Kbits |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| טמפרטורת פעולה | -40 C to +125 C |
| מארז | 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch |
| סוג הרכבה | Surface Mount |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | On-chip Flash (non-volatile) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| סטטוס RoHS | Compliant (lead-free) |
| Logic Family | CMOS |
תצורת פינים של EPM240M100C5N
| פין A1 | I/O — User I/O pin (bank 1) |
| פין A2 | I/O — User I/O pin (bank 1) |
| פין A3 | I/O — User I/O pin (bank 1) |
| פין A4 | VCCIO1 — I/O bank 1 supply voltage |
| פין A5 | I/O — User I/O pin (bank 1) |
| פין A6 | I/O — User I/O pin (bank 1) |
| פין A7 | I/O — User I/O pin (bank 1) |
| פין A8 | I/O — User I/O pin (bank 1) |
| פין A9 | GND — Ground |
| פין A10 | I/O — User I/O pin (bank 2) |
| פין B1 | I/O — User I/O pin (bank 1) |
| פין B2 | I/O — User I/O pin (bank 1) |
| פין B3 | GND — Ground |
| פין B4 | I/O — User I/O pin (bank 1) |
| פין B5 | I/O — User I/O pin (bank 1) |
| פין B6 | VCCIO1 — I/O bank 1 supply voltage |
| פין B7 | I/O — User I/O pin (bank 1) |
| פין B8 | I/O — User I/O pin (bank 1) |
| פין B9 | I/O — User I/O pin (bank 2) |
| פין B10 | I/O — User I/O pin (bank 2) |
| פין C1 | I/O — User I/O pin (bank 1) |
| פין C2 | VCCIO1 — I/O bank 1 supply voltage |
| פין C3 | I/O — User I/O pin (bank 1) |
| פין C4 | I/O — User I/O pin (bank 1) |
| פין C5 | GND — Ground |
| פין C6 | I/O — User I/O pin (bank 1) |
| פין C7 | I/O — User I/O pin (bank 1) |
| פין C8 | GND — Ground |
| פין C9 | I/O — User I/O pin (bank 2) |
| פין C10 | I/O — User I/O pin (bank 2) |
| פין D1 | GND — Ground |
| פין D2 | I/O — User I/O pin (bank 1) |
| פין D3 | I/O — User I/O pin (bank 1) |
| פין D4 | I/O — User I/O pin (bank 1) |
| פין D5 | I/O — User I/O pin (bank 1) |
| פין D6 | I/O — User I/O pin (bank 1) |
| פין D7 | I/O — User I/O pin (bank 1) |
| פין D8 | I/O — User I/O pin (bank 1) |
| פין D9 | I/O — User I/O pin (bank 2) |
| פין D10 | VCCIO2 — I/O bank 2 supply voltage |
| פין E1 | I/O — User I/O pin (bank 1) |
| פין E2 | I/O — User I/O pin (bank 1) |
| פין E3 | I/O — User I/O pin (bank 1) |
| פין E4 | VCCINT — Core supply voltage (1.8 V) |
| פין E5 | I/O — User I/O pin (bank 1) |
| פין E6 | I/O — User I/O pin (bank 1) |
| פין E7 | VCCINT — Core supply voltage (1.8 V) |
| פין E8 | I/O — User I/O pin (bank 2) |
| פין E9 | I/O — User I/O pin (bank 2) |
| פין E10 | I/O — User I/O pin (bank 2) |
| פין F1 | I/O — User I/O pin (bank 1) |
| פין F2 | GND — Ground |
| פין F3 | I/O — User I/O pin (bank 1) |
| פין F4 | I/O — User I/O pin (bank 1) |
| פין F5 | TCK — JTAG clock input |
| פין F6 | TDO — JTAG data out |
| פין F7 | I/O — User I/O pin (bank 2) |
| פין F8 | I/O — User I/O pin (bank 2) |
| פין F9 | GND — Ground |
| פין F10 | I/O — User I/O pin (bank 2) |
| פין G1 | I/O — User I/O pin (bank 1) |
| פין G2 | I/O — User I/O pin (bank 1) |
| פין G3 | I/O — User I/O pin (bank 1) |
| פין G4 | TMS — JTAG mode select |
| פין G5 | TDI — JTAG data in |
| פין G6 | I/O — User I/O pin (bank 2) |
| פין G7 | I/O — User I/O pin (bank 2) |
| פין G8 | I/O — User I/O pin (bank 2) |
| פין G9 | I/O — User I/O pin (bank 2) |
| פין G10 | I/O — User I/O pin (bank 2) |
| פין H1 | I/O — User I/O pin (bank 1) |
| פין H2 | I/O — User I/O pin (bank 1) |
| פין H3 | I/O — User I/O pin (bank 1) |
| פין H4 | nCONFIG — Configuration control (active-low) |
| פין H5 | nCE — Chip enable (active-low) |
| פין H6 | I/O — User I/O pin (bank 2) |
| פין H7 | I/O — User I/O pin (bank 2) |
| פין H8 | I/O — User I/O pin (bank 2) |
| פין H9 | I/O — User I/O pin (bank 2) |
| פין H10 | I/O — User I/O pin (bank 2) |
| פין J1 | I/O — User I/O pin (bank 1) |
| פין J2 | GND — Ground |
| פין J3 | I/O — User I/O pin (bank 1) |
| פין J4 | I/O — User I/O pin (bank 1) |
| פין J5 | I/O — User I/O pin (bank 1) |
| פין J6 | I/O — User I/O pin (bank 2) |
| פין J7 | I/O — User I/O pin (bank 2) |
| פין J8 | VCCIO2 — I/O bank 2 supply voltage |
| פין J9 | GND — Ground |
| פין J10 | I/O — User I/O pin (bank 2) |
| פין K1 | I/O — User I/O pin (bank 1) |
| פין K2 | I/O — User I/O pin (bank 1) |
| פין K3 | I/O — User I/O pin (bank 1) |
| פין K4 | I/O — User I/O pin (bank 1) |
| פין K5 | GND — Ground |
| פין K6 | I/O — User I/O pin (bank 2) |
| פין K7 | I/O — User I/O pin (bank 2) |
| פין K8 | I/O — User I/O pin (bank 2) |
| פין K9 | I/O — User I/O pin (bank 2) |
| פין K10 | I/O — User I/O pin (bank 2) |
| פין L1 | VCCIO1 — I/O bank 1 supply voltage |
| פין L2 | I/O — User I/O pin (bank 1) |
| פין L3 | I/O — User I/O pin (bank 1) |
| פין L4 | GND — Ground |
| פין L5 | I/O — User I/O pin (bank 1) |
| פין L6 | I/O — User I/O pin (bank 2) |
| פין L7 | VCCIO2 — I/O bank 2 supply voltage |
| פין L8 | I/O — User I/O pin (bank 2) |
| פין L9 | I/O — User I/O pin (bank 2) |
| פין L10 | I/O — User I/O pin (bank 2) |
| פין M1 | I/O — User I/O pin (bank 1) |
| פין M2 | I/O — User I/O pin (bank 1) |
| פין M3 | I/O — User I/O pin (bank 1) |
| פין M4 | I/O — User I/O pin (bank 1) |
| פין M5 | I/O — User I/O pin (bank 1) |
| פין M6 | I/O — User I/O pin (bank 2) |
| פין M7 | I/O — User I/O pin (bank 2) |
| פין M8 | I/O — User I/O pin (bank 2) |
| פין M9 | GND — Ground |
| פין M10 | I/O — User I/O pin (bank 2) |
| פין N1 | I/O — User I/O pin (bank 1) |
| פין N2 | VCCIO1 — I/O bank 1 supply voltage |
| פין N3 | I/O — User I/O pin (bank 1) |
| פין N4 | I/O — User I/O pin (bank 1) |
| פין N5 | GND — Ground |
| פין N6 | I/O — User I/O pin (bank 2) |
| פין N7 | I/O — User I/O pin (bank 2) |
| פין N8 | I/O — User I/O pin (bank 2) |
| פין N9 | I/O — User I/O pin (bank 2) |
| פין N10 | I/O — User I/O pin (bank 2) |
| פין P1 | I/O — User I/O pin (bank 1) |
| פין P2 | I/O — User I/O pin (bank 1) |
| פין P3 | I/O — User I/O pin (bank 1) |
| פין P4 | I/O — User I/O pin (bank 1) |
| פין P5 | I/O — User I/O pin (bank 1) |
| פין P6 | I/O — User I/O pin (bank 2) |
| פין P7 | I/O — User I/O pin (bank 2) |
| פין P8 | I/O — User I/O pin (bank 2) |
| פין P9 | I/O — User I/O pin (bank 2) |
| פין P10 | I/O — User I/O pin (bank 2) |
יישומים טיפוסיים
EPM240M100C5N מתאים עבור 7 יישוםs: Microcontroller I/O Expansion and Bus Bridging, Industrial Address Decoding and Memory Interfacing, Power-Up Sequencing and Reset Distribution, Glue Logic Replacement for 74-Series TTL/CMOS, LED Display Drivers and Panel Controllers, Communication Interface Bridging (UART/SPI/I2C Glue Logic), Embedded State Machine and Custom Peripherals.
Microcontroller I/O Expansion and Bus Bridging
The EPM240M100C5N fits microcontroller I/O expansion because its 80 user I/Os and 4.7 ns tPD let it translate between 3.3 V MCU buses and 1.8 V/2.5 V peripheral logic with deterministic timing. With 192 macrocells, designers can implement custom parallel-to-SPI bridges, GPIO expanders, and address-latch circuits without software overhead. Multi-voltage I/O support (1.5/1.8/2.5/3.3 V) eliminates external level shifters, simplifying PCB layout for mixed-domain industrial designs.
מומלץ
Industrial Address Decoding and Memory Interfacing
The EPM240M100C5N suits address-decoding applications because its 4.7 ns propagation delay keeps chip-select generation within a single clock cycle at 100 MHz+ bus speeds. With 192 macrocells, engineers can implement multiple decode windows, wait-state generators, and bank-switching logic for SRAM, NOR Flash, and peripheral overlays. Non-volatile Flash-based configuration means no boot PROM and instant-on decoding at power-up, critical for deterministic industrial controller boot.
מומלץ
Power-Up Sequencing and Reset Distribution
The EPM240M100C5N works well for multi-rail power sequencing because its instant-on Flash configuration executes logic at the first clock edge without external boot memory. With 192 macrocells, designers can build cascaded delay timers, voltage-rail monitors, and watchdog reset distribution for systems with 5+ independent supply rails. The 1.8 V core and wide I/O voltage range let it interface directly to PMBus controllers and supervisor ICs without level translation.
מומלץ
Glue Logic Replacement for 74-Series TTL/CMOS
The EPM240M100C5N replaces dozens of discrete 74LS, 74HC, and 74AHC glue-logic ICs because 192 macrocells can implement many standard functions in a single 6 x 6 mm package. With 4.7 ns tPD, it matches 74F-series speed while reducing PCB area, BOM count, and stock-keeping complexity. Instant-on Flash configuration means no boot delay, and JTAG programming allows in-system rework without hot-air desoldering.
מומלץ
LED Display Drivers and Panel Controllers
The EPM240M100C5N drives multiplexed LED panels and small TFT displays because its 80 user I/Os provide enough channels for 8:1 to 16:1 multiplexed row/column scanning without external drivers. With 192 macrocells, PWM dimming, blanking control, and brightness correction can all be implemented in hardware with 4.7 ns response, eliminating software jitter. Multi-voltage I/O lets it drive both 3.3 V logic-level LED drivers and 5 V common-anode displays directly.
מומלץ
Communication Interface Bridging (UART/SPI/I2C Glue Logic)
The EPM240M100C5N bridges incompatible communication interfaces because its 192 macrocells can host custom UART-to-SPI, SPI-to-I2C, and parallel-to-LVDS converters with deterministic timing. With 4.7 ns tPD, it handles up to ~50 MHz parallel bus rates without timing closure issues, and 80 I/Os accommodate multiple concurrent channels. Non-volatile Flash configuration allows field updates via JTAG, simplifying protocol revision management across product variants.
מומלץ
Embedded State Machine and Custom Peripherals
The EPM240M100C5N implements complex Mealy/Moore state machines and custom peripherals offloading MCU resources because its deterministic 4.7 ns tPD and parallel macrocell architecture execute state logic in zero software cycles. With 192 macrocells, designers can build timing-critical peripherals (motor-control PWM, encoder quadrature decoders, custom stepper pulse generators) that would otherwise consume MCU interrupt bandwidth. On-chip 8 Kbit user Flash stores configuration parameters and calibration constants.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPM240M100C5N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPM240M100C4N | EPM240ZM100C6N | EPM240ZM68C7N | EPM240T100C5N | EPM240GM100C5N | EPM240F100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-ball MBGA (6 x 6 mm) | 100-ball MBGA (6 x 6 mm) - same | 100-ball MBGA (6 x 6 mm) - same | 68-ball MBGA - different | 100-pin TQFP - different | 100-ball MBGA (6 x 6 mm) - same | 100-pin FBGA - same ball count, finer pitch |
| Brand | Intel | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Speed Grade (tPD) | 4.7 ns (-5) | <4 ns (-4, +20% speed) | ~6 ns (-6, -20% speed) | ~7 ns (-7, -30% speed) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) |
| User I/Os | 80 | 80 | 80 | ~52 (reduced for 68-ball package) | 80 | 80 | 80 |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 C to +125 C (industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Configuration Memory | On-chip Flash (non-volatile) | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Unit Price (qty 1, USD) | 8.20 | ~9.50 | ~7.80 | ~6.50 | ~8.50 | ~8.20 | ~8.60 |
מבדילים עיקריים
- Highest speed-grade variant in 100-ball MBGA package (לעומתEPM240ZM100C6N)
- Largest I/O count in MAX II family at 80 user I/Os (לעומתEPM240ZM68C7N)
- Direct Quartus II/Prime tool support with mature IP library (לעומתEPM240T100C5N)
הערות תכנון
The 100-ball MBGA package uses 0.5 mm ball pitch on a 6 x 6 mm substrate. Per IPC-7351 and Intel MAX II design guidelines, use 0.27 mm solder mask openings, NSMD (non-solder mask defined) pads, and a 4-6 layer stack-up with continuous ground planes beneath the device. Via-in-pad is NOT recommended; use dog-bone fan-out to inner layers. Microstrip impedance should be 50 ohm single-ended for high-speed signals.
The EPM240M100C5N requires a clean 1.8 V core supply (VCCINT) decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each VCCINT pin. Each I/O bank has its own VCCIO supply (VCCIO1, VCCIO2, etc.) which can be set independently to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Decouple each VCCIO with 0.1 uF plus 4.7 uF bulk; place capacitors as close as possible to the supply balls to minimize inductive ringing on logic-level transitions.
Do NOT use 4-wire JTAG when the device is in user mode unless nCONFIG is held low; this can cause unintended reconfiguration. For multi-device JTAG chains, ensure TMS and TCK are properly buffered because the MAX II JTAG pins have limited drive strength. For in-system programming, always include 10 kohm pull-ups on nCONFIG and nCE to prevent spurious configuration during power-up transients.
The 100-ball MBGA package has lead inductance of approximately 0.5 nH per ball, which combined with package capacitance (~1.5 pF) creates resonances in the 800 MHz to 1.5 GHz range. For signals above 100 MHz, use series damping resistors (22-33 ohm) at the driver to flatten impedance discontinuities. Simulate with the MAX II IBIS model (available from Intel) before finalizing PCB layout.
The 100-ball MBGA package has typical theta-JA of 36 C/W with standard JEDEC test board (still air). Under typical CPLD workloads (10-15 MHz internal frequency, 30% I/O toggling), self-heating is negligible (<1 C rise). For continuous high-I/O-throughput designs (>50 MHz toggle rates on >40 outputs), allocate at least 4 thermal vias under the center thermal ball array to spread heat to inner ground planes. The junction-to-ambient thermal resistance can drop to ~25 C/W with proper via stitching.
מידע על תאימות
RoHS compliant per Altera (now Intel) product page and DigiKey listing. Lead-free MBGA package. Not AEC-Q100 qualified - this is an industrial/consumer-grade CPLD, not automotive. Halogen-free status not explicitly stated in available data.
