MPX2010DP vs MPXC2012DT1 तुलना
विस्तृत दोनों ओर की तुलना MPX2010DP द्वारा NXP Semiconductors और MPXC2012DT1 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | MPX2010DP | MPXC2012DT1 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Pressure Sensors | Pressure Sensors |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| सेंसर प्रकार | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | — |
| आउटपुट प्रकार | Analog voltage, Wheatstone bridge (mV level) | Wheatstone Bridge (analog mV) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| सप्लाई वोल्टेज | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | [DATA_NEEDED: linearity %FS] |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| ऑपरेटिंग तापमान | -40 °C to +125 °C | [DATA_NEEDED: operating temperature range] |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| RoHS स्थिति | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Pressure Type | — | Differential |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Full-Scale Output | — | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Excitation Voltage | — | 10 V DC typical |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| Port Style | — | Side port, single barbed inlet |
| पैकेज / केस | — | 4-SSIP Module (chip-pak, no gel) |
| Termination Style | — | Through-hole PCB (vertical mount) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| माउंटिंग प्रकार | — | Through-hole, vertical |
| MSL स्तर | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |