MPX2010DP vs MPXC2012DT1 Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPX2010DP tarafından NXP Semiconductors ve MPXC2012DT1 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPX2010DP MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP ✓ Aktif

Özellik Karşılaştırması

Parametre MPX2010DP MPXC2012DT1
Marka NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Yaşam Döngüsü Durumu Aktif NRND
Duyarlılık Türü Differential Pressure Sensor —
Pressure Range 0 to 10 kPa (0 to 1.45 PSI) —
Technology Piezoresistive (silicon strain gauge bridge) —
Çıkış Türü Analog voltage, Wheatstone bridge (mV level) Wheatstone Bridge (analog mV)
Typical Full-Scale Span 25 mV at 10 V excitation —
Zero Pressure Offset 0 mV nominally (±1.0 mV max) —
Besleme Gerilimi 10 V DC typical (max 16 V) —
Linearity ±0.05% (typ) [DATA_NEEDED: linearity %FS]
Temperature Compensation 0 °C to +85 °C (on-chip) —
İşletim Sıcaklığı -40 °C to +125 °C [DATA_NEEDED: operating temperature range]
Response Time 1.0 ms (typical) —
Maximum Overpressure 75 kPa —
Burst Pressure 200 kPa —
Port Configuration Dual ports (differential), 0.19 inch / 4.93 mm tubes —
Package / Mounting 4-SIP Module (through-hole with axial tubes) —
Media Compatibility Dry air or non-corrosive gas —
RoHS Durumu Compliant [DATA_NEEDED: RoHS compliance status]
Pressure Type — Differential
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Full-Scale Output — 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Offset (Null) — 0 mV nominal at 10 V excitation
Excitation Voltage — 10 V DC typical
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
Port Style — Side port, single barbed inlet
Paket / Kas — 4-SSIP Module (chip-pak, no gel)
Termination Style — Through-hole PCB (vertical mount)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
Montaj Türü — Through-hole, vertical
MSL Seviyesi — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

Dökümanlar & Kaynaklar

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