MPX2010DP vs MPXC2012DT1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2010DP disebabkan oleh NXP Semiconductors dan MPXC2012DT1 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPX2010DP | MPXC2012DT1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | NRND |
| Jenis Sensus | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | — |
| Jenis Output | Analog voltage, Wheatstone bridge (mV level) | Wheatstone Bridge (analog mV) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Tegangan Pemberi Arus | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | [DATA_NEEDED: linearity %FS] |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| Suhu Operasi | -40 °C to +125 °C | [DATA_NEEDED: operating temperature range] |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Pressure Type | — | Differential |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Full-Scale Output | — | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Excitation Voltage | — | 10 V DC typical |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| Port Style | — | Side port, single barbed inlet |
| Kemasan / Case | — | 4-SSIP Module (chip-pak, no gel) |
| Termination Style | — | Through-hole PCB (vertical mount) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Jenis Pemasangan | — | Through-hole, vertical |
| Aras MSL | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |