MPX2010DP vs MPXC2012DT1 Perbandingan
Perbandingan bersamaan detil MPX2010DP dari NXP Semiconductors dan MPXC2012DT1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPX2010DP | MPXC2012DT1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | NRND |
| Tipe Pengukur | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | — |
| Tipe Output | Analog voltage, Wheatstone bridge (mV level) | Wheatstone Bridge (analog mV) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Tegangan Pemuat | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | [DATA_NEEDED: linearity %FS] |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| Suhu Kerja | -40 °C to +125 °C | [DATA_NEEDED: operating temperature range] |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Pressure Type | — | Differential |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Full-Scale Output | — | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Excitation Voltage | — | 10 V DC typical |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| Port Style | — | Side port, single barbed inlet |
| Paket / Case | — | 4-SSIP Module (chip-pak, no gel) |
| Termination Style | — | Through-hole PCB (vertical mount) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Tipe Mounting | — | Through-hole, vertical |
| Level MSL | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |