MRF5S19060NBR1 vs MRF5S19060MBR1 तुलना
विस्तृत दोनों ओर की तुलना MRF5S19060NBR1 द्वारा NXP Semiconductors और MRF5S19060MBR1 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MRF5S19060MBR1 - 12W RF Power LDMOS 1990MHz | NXP/Freescale
MRF5S19060MBR1 Obsoleteविशेषता तुलना
| पैरामीटर | MRF5S19060NBR1 | MRF5S19060MBR1 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | MOSFETs | RF Amplifiers |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| ट्रांज़िस्टर प्रकार | N-Channel Enhancement-Mode Lateral MOSFET (LDMOS RF Power) | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET |
| Configuration | Dual Die (2 x N), Common Source | — |
| Frequency Band | 1930 MHz to 1990 MHz | 1.93 GHz to 1.99 GHz |
| Output Power (P1dB) | 60 W (CW/peak) | — |
| Output Power (Average) | 12 W avg. | 12 W |
| Drain Supply Voltage | 28 V (typical) | — |
| Drain-Source Voltage (Vdss) | 65 V (max) | — |
| Power Gain | 14 dB at 1.99 GHz | 14 dB |
| Drain Current | 750 mA (typical operating DC) | — |
| पैकेज | TO-272 WB-4 (overmolded plastic) | TO-270 WB-4 (overmolded plastic, also listed as TO-272 WB-4) |
| माउंटिंग प्रकार | Surface Mount (SMD) | — |
| पिन काउंट | 5 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Power Dissipation (Absolute) | 218.8 W | — |
| Technology | Silicon LDMOS | RF Power Field Effect Transistor |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | — |
| MSL स्तर | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Typical Operating Frequency | — | 1990 MHz |
| Drain-Source Voltage (Rated) | — | 65 V |
| Nominal Drain Operating Voltage | — | 28 V |
| Test Current (Drain) | — | 750 mA |
| Drain Current Rating (Leakage Spec) | — | 10 uA |
| VSWR Tolerance | — | 5:1 @ 28 Vdc, 1990 MHz, 12 W avg |
| Input Matching | — | Internally matched |
| ESD Protection | — | Integrated |
| Package Outline | — | Case 1486-03, Style 1 |
| माउंटिंग स्टाइल | — | Flange / surface mount with thermal pad |
| Maximum Junction Temperature | — | 200 degree C |
| Packaging | — | Tape and Reel, 500 units per 44 mm 13-inch reel (R1 suffix) |
| Target Application | — | PCN/PCS 1900 MHz, 2 x N-CDMA base station PA final/driver stage |