MSC8156ESVT1000B vs MSC8156HAG1000B तुलना
विस्तृत दोनों ओर की तुलना MSC8156ESVT1000B द्वारा NXP Semiconductors और MSC8156HAG1000B द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B ObsoleteNXP Semiconductors
MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP
MSC8156HAG1000B ✓ सक्रियविशेषता तुलना
| पैरामीटर | MSC8156ESVT1000B | MSC8156HAG1000B |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | DSP | DSP |
| लाइफसाइकिल स्थिति | Obsolete | सक्रिय |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore | — |
| Type | SC3850 Six Core DSP | — |
| Number of Cores | 6 | — |
| Core Architecture | StarCore SC3850 | — |
| Clock Rate | 1 GHz | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory | ROM 96 KB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB | — |
| Voltage - I/O | 2.50 V | — |
| Voltage - Core | 1.00 V | — |
| इंटरफ़ेस | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| पैकेज | 783-BBGA, FCBGA | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Packaging | Tray | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | Compliant (per distributor datasheet listing) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |