MSC8156ESVT1000B vs MSC8156HAG1000B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MSC8156ESVT1000B sa pamamagitan ng NXP Semiconductors at MSC8156HAG1000B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B ObsoleteNXP Semiconductors
MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP
MSC8156HAG1000B ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MSC8156ESVT1000B | MSC8156HAG1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore | — |
| Type | SC3850 Six Core DSP | — |
| Number of Cores | 6 | — |
| Core Architecture | StarCore SC3850 | — |
| Clock Rate | 1 GHz | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory | ROM 96 KB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB | — |
| Voltage - I/O | 2.50 V | — |
| Voltage - Core | 1.00 V | — |
| Interface | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Packhaging | 783-BBGA, FCBGA | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Packaging | Tray | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor datasheet listing) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |