MSC8156ESVT1000B vs MSC8156HAG1000B Karşılaştırma
Ayrıntılı yan yana karşılaştırma MSC8156ESVT1000B tarafından NXP Semiconductors ve MSC8156HAG1000B tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B ObsoleteÖzellik Karşılaştırması
| Parametre | MSC8156ESVT1000B | MSC8156HAG1000B |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Yaşam Döngüsü Durumu | Obsolete | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore | — |
| Type | SC3850 Six Core DSP | — |
| Number of Cores | 6 | — |
| Core Architecture | StarCore SC3850 | — |
| Clock Rate | 1 GHz | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory | ROM 96 KB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB | — |
| Voltage - I/O | 2.50 V | — |
| Voltage - Core | 1.00 V | — |
| Arayüz | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Paket | 783-BBGA, FCBGA | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Packaging | Tray | — |
| Montaj Türü | Surface Mount | Surface Mount |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | Compliant (per distributor datasheet listing) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| MSL Seviyesi | — | [DATA_NEEDED: MSL rating] |