MSC8156ESVT1000B vs MSC8156HAG1000B مقایسه
مقایسه دقیق کنار به کنار MSC8156ESVT1000B توسط NXP Semiconductors و MSC8156HAG1000B توسط NXP Semiconductors. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
NXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B Obsoleteمقایسه مشخصات
| پارامتر | MSC8156ESVT1000B | MSC8156HAG1000B |
|---|---|---|
| برند | NXP Semiconductors | NXP Semiconductors |
| دسته‌بندی | DSP | DSP |
| وضعیت چرخه عمر | Obsolete | فعال |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore | — |
| Type | SC3850 Six Core DSP | — |
| Number of Cores | 6 | — |
| Core Architecture | StarCore SC3850 | — |
| Clock Rate | 1 GHz | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory | ROM 96 KB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB | — |
| Voltage - I/O | 2.50 V | — |
| Voltage - Core | 1.00 V | — |
| رابط | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| بسته‌بندی | 783-BBGA, FCBGA | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Packaging | Tray | — |
| نوع نصب | Surface Mount | Surface Mount |
| دمای کاری | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| وضعیت RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor datasheet listing) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| سطح MSL | — | [DATA_NEEDED: MSL rating] |