10M08DAF484I7P vs 10M08DAF484C8G Perbandingan
Perbandingan bersamaan detil 10M08DAF484I7P dari Intel dan 10M08DAF484C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M08DAF484I7P | 10M08DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | 387,072 bits (378 Kbits) |
| User I/O Count | 250 | — |
| Paket | 484-ball FBGA (F484) | 484-ball FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | 1.2 V |
| Speed Grade | -7 | -C8 |
| Suhu Kerja | -40 C to +100 C (Industrial) | — |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | Yes |
| PLLs | 4 | 2 |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | 1,540 Kbits |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Maximum User I/O | — | 250 |
| ADC | — | 8-channel, 12-bit |
| Process Technology | — | 55 nm |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| Suhu Hubung Kerja | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |