10M08DAF484I7P vs 10M08DAF484C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DAF484I7P disebabkan oleh Intel dan 10M08DAF484C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DAF484I7P | 10M08DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | 387,072 bits (378 Kbits) |
| User I/O Count | 250 | — |
| Kemasan | 484-ball FBGA (F484) | 484-ball FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | 1.2 V |
| Speed Grade | -7 | -C8 |
| Suhu Operasi | -40 C to +100 C (Industrial) | — |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | Yes |
| PLLs | 4 | 2 |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | 1,540 Kbits |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Maximum User I/O | — | 250 |
| ADC | — | 8-channel, 12-bit |
| Process Technology | — | 55 nm |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| Suhu Hubungan Operasi | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |