EP2AGX260FF35C6 vs EP2AGX260FF35C5N Perbandingan

Perbandingan bersamaan detil EP2AGX260FF35C6 dari Intel dan EP2AGX260FF35C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2AGX260FF35C6 EP2AGX260FF35C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Arria II GX Arria II GX
Series Arria II GX —
Logic Elements 244,188 244,188
Logic Array Blocks (LABs) 10,260 10,260
Embedded Memory Bits 12,038,144 —
User I/O Pins 612 —
Number of Pins / Balls 1152 balls —
Package Type 1152-BBGA, FCBGA (Flip-Chip FBGA) —
Package Code BGA1152, 34x34, 40 —
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade C6 C5
Transceivers Up to multi-gigabit transceivers supporting PCIe Gen2, Serial RapidIO, Gbps Ethernet —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: 18x18 multiplier count] —
Rentang Suhu Kerja Commercial (0C to 85C) —
Tipe Mounting Surface mount (BGA, reflow) Surface Mount
Status RoHS Compliant Lead Free (Compliant per data sheet)
Status Lingkungan Hidup Not Recommended for New Designs (NRND) - legacy Intel FPGA family —
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory (bits) — 12,038,144
18x18 Hardware Multipliers — 736
User I/O Count — 612
Transceiver Channels — 48
Maximum Transceiver Data Rate — 3.75 Gbps
PLLs — 8 (4 fractional, 4 general-purpose)
Process Node — 40 nm
Suhu Kerja — -40C to +85C (Industrial)
Paket — 1152-FBGA (Flip-Chip BGA), 35x35 mm
Tegangan Pemuat — 0.9 V core (typical)

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