EP2AGX260FF35C6 vs EP2AGX260FF35C5N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260FF35C6 sa pamamagitan ng Intel at EP2AGX260FF35C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGX260FF35C6 EP2AGX260FF35C5N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Arria II GX Arria II GX
Series Arria II GX —
Logic Elements 244,188 244,188
Logic Array Blocks (LABs) 10,260 10,260
Embedded Memory Bits 12,038,144 —
User I/O Pins 612 —
Number of Pins / Balls 1152 balls —
Package Type 1152-BBGA, FCBGA (Flip-Chip FBGA) —
Package Code BGA1152, 34x34, 40 —
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade C6 C5
Transceivers Up to multi-gigabit transceivers supporting PCIe Gen2, Serial RapidIO, Gbps Ethernet —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: 18x18 multiplier count] —
Hanay ng Temperature na Operasyon Commercial (0C to 85C) —
Uri ng Pagpapasok Surface mount (BGA, reflow) Surface Mount
Tindminan RoHS Compliant Lead Free (Compliant per data sheet)
Katayuan ng Lifecycle Not Recommended for New Designs (NRND) - legacy Intel FPGA family —
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory (bits) — 12,038,144
18x18 Hardware Multipliers — 736
User I/O Count — 612
Transceiver Channels — 48
Maximum Transceiver Data Rate — 3.75 Gbps
PLLs — 8 (4 fractional, 4 general-purpose)
Process Node — 40 nm
Temperature na Operasyon — -40C to +85C (Industrial)
Packhaging — 1152-FBGA (Flip-Chip BGA), 35x35 mm
Volte ng Pagbibigay — 0.9 V core (typical)

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