EP2AGX260FF35C6 vs EP2AGX260FF35C5N 比較

詳細並排比較 EP2AGX260FF35C6 由 Intel 與 EP2AGX260FF35C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGX260FF35C6 EP2AGX260FF35C5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Arria II GX Arria II GX
Series Arria II GX —
Logic Elements 244,188 244,188
Logic Array Blocks (LABs) 10,260 10,260
Embedded Memory Bits 12,038,144 —
User I/O Pins 612 —
Number of Pins / Balls 1152 balls —
Package Type 1152-BBGA, FCBGA (Flip-Chip FBGA) —
Package Code BGA1152, 34x34, 40 —
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade C6 C5
Transceivers Up to multi-gigabit transceivers supporting PCIe Gen2, Serial RapidIO, Gbps Ethernet —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: 18x18 multiplier count] —
工作溫度範圍 Commercial (0C to 85C) —
安裝類型 Surface mount (BGA, reflow) Surface Mount
RoHS 狀態 Compliant Lead Free (Compliant per data sheet)
生命週期狀態 Not Recommended for New Designs (NRND) - legacy Intel FPGA family —
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory (bits) — 12,038,144
18x18 Hardware Multipliers — 736
User I/O Count — 612
Transceiver Channels — 48
Maximum Transceiver Data Rate — 3.75 Gbps
PLLs — 8 (4 fractional, 4 general-purpose)
Process Node — 40 nm
工作溫度 — -40C to +85C (Industrial)
封裝 — 1152-FBGA (Flip-Chip BGA), 35x35 mm
供應電壓 — 0.9 V core (typical)

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