EP2AGX45DF25I3G vs EP2AGX125DF25I3G Perbandingan
Perbandingan bersamaan detil EP2AGX45DF25I3G dari Intel dan EP2AGX125DF25I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2AGX45DF25I3G | EP2AGX125DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Family | Arria II GX | — |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Paket | 572-ball FCBGA (HBGA) | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Package Dimensions | 25 mm x 25 mm | — |
| Rentang Suhu Kerja | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | 3 | [DATA_NEEDED: MSL Level] |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Tegangan Pemuat | — | 0.9 V core |
| DSP Blocks | — | 18x18 multipliers |