EP2AGX45DF25I3G vs EP2AGX125DF25I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45DF25I3G disebabkan oleh Intel dan EP2AGX125DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2AGX125DF25I3G EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2AGX45DF25I3G EP2AGX125DF25I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Family Arria II GX —
Logic Elements (LE) 42,959 —
Adaptive Logic Modules (ALM) 17,715 —
Embedded Memory Bits 3,517,440 bits —
Embedded Memory M9K Blocks [DATA_NEEDED: M9K block count] —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Maximum User I/O Pins 252 —
Transceiver Channels [DATA_NEEDED: MGT channel count] —
Maximum Transceiver Data Rate 6.375 Gbps —
Kemasan 572-ball FCBGA (HBGA) 572-BGA, FCBGA (Flip-Chip FineLine BGA)
Package Dimensions 25 mm x 25 mm —
Gambaran Suhu Operasi -40C to +100C (Industrial) —
Speed Grade I3 —
Process Node 40 nm —
Supply Voltage (Core) [DATA_NEEDED: VCCINT] —
Hard IP for PCIe PCIe Gen1/Gen2 endpoints and root ports —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL 3 [DATA_NEEDED: MSL Level]
Status RoHS Compliant Compliant
Lead-Free Yes —
Series — Arria II GX
Logic Elements — 118,143
Embedded Memory — 8,315,904 bits
Number of I/O — 260
Core Voltage — 0.9 V
Process Technology — 40 nm
Maximum Operating Frequency — 500 MHz
Transceivers — Up to 12 (3.75 Gbps per channel)
Suhu Operasi — -40C to +100C (Industrial)
Tegangan Pemberi Arus — 0.9 V core
DSP Blocks — 18x18 multipliers

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