EP2AGX45DF25I3G vs EP2AGX125DF25I3G 比較

詳細並排比較 EP2AGX45DF25I3G 由 Intel 與 EP2AGX125DF25I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2AGX125DF25I3G EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G ⚠ 最後購買機會

規格比較

參數 EP2AGX45DF25I3G EP2AGX125DF25I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 最後購買
Family Arria II GX —
Logic Elements (LE) 42,959 —
Adaptive Logic Modules (ALM) 17,715 —
Embedded Memory Bits 3,517,440 bits —
Embedded Memory M9K Blocks [DATA_NEEDED: M9K block count] —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Maximum User I/O Pins 252 —
Transceiver Channels [DATA_NEEDED: MGT channel count] —
Maximum Transceiver Data Rate 6.375 Gbps —
封裝 572-ball FCBGA (HBGA) 572-BGA, FCBGA (Flip-Chip FineLine BGA)
Package Dimensions 25 mm x 25 mm —
工作溫度範圍 -40C to +100C (Industrial) —
Speed Grade I3 —
Process Node 40 nm —
Supply Voltage (Core) [DATA_NEEDED: VCCINT] —
Hard IP for PCIe PCIe Gen1/Gen2 endpoints and root ports —
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 3 [DATA_NEEDED: MSL Level]
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
Series — Arria II GX
Logic Elements — 118,143
Embedded Memory — 8,315,904 bits
Number of I/O — 260
Core Voltage — 0.9 V
Process Technology — 40 nm
Maximum Operating Frequency — 500 MHz
Transceivers — Up to 12 (3.75 Gbps per channel)
工作溫度 — -40C to +100C (Industrial)
供應電壓 — 0.9 V core
DSP Blocks — 18x18 multipliers

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