EP2SGX60EF1152C3 vs EP2SGX60EF1152I3N Perbandingan
Perbandingan bersamaan detil EP2SGX60EF1152C3 dari Intel dan EP2SGX60EF1152I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX60EF1152C3 | EP2SGX60EF1152I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Multipliers (18x18) | 252 | — |
| Paket | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0C to +85C (Commercial, C3 suffix) | — |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Level MSL | — | [DATA_NEEDED: MSL level] |