EP3SE260F1152C4N vs EP3SE260F1152C2G Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152C2G dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C4N EP3SE260F1152C2G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Series Stratix III E EP3SE260
Family Stratix III (Enhanced) Stratix III E
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS —
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
Paket 1152-ball FC-FBGA (flip-chip) 1152-BBGA, FCBGA (FineLine BGA)
Speed Grade -4 (commercial temperature) C2 (commercial)
Suhu Kerja 0C to +85C (commercial, 'C' suffix) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Tipe Memori SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Code — BGA (Ball Grid Array)
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray
Status RoHS — Compliant (G suffix)

Spek dan Sumber

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