EP3SE260F1152C4N vs EP3SE260F1152C2G 比較
詳細並排比較 EP3SE260F1152C4N 由 Intel 與 EP3SE260F1152C2G 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Altera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G Obsolete規格比較
| 參數 | EP3SE260F1152C4N | EP3SE260F1152C2G |
|---|---|---|
| 品牌 | Intel | Altera |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III (Enhanced) | Stratix III E |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| 封裝 | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | -4 (commercial temperature) | C2 (commercial) |
| 工作溫度 | 0C to +85C (commercial, 'C' suffix) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| 記憶體類型 | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Operating Temperature Grade | — | Commercial (C) |
| Supply Packaging | — | Tray |
| RoHS 狀態 | — | Compliant (G suffix) |