EP3SE260F1517C4LN vs EP3SE260F1517C3 Perbandingan

Perbandingan bersamaan detil EP3SE260F1517C4LN dari Intel dan EP3SE260F1517C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1517C4LN EP3SE260F1517C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Aktif
Series Stratix III E Stratix III E
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
Paket / Case 1517-BBGA, FCBGA (FC-FBGA) —
Tipe Mounting Surface Mount (flip-chip) Surface Mount (BGA)
Suhu Kerja 0C to +85C (commercial grade per 'C' suffix) —
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 3
Lead-Free / Halogen-Free Yes (LN suffix) —
Status RoHS Compliant Compliant
Manufacturer — Intel (formerly Altera)
Logic Array Blocks (LABs) — 10,200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
User I/Os — 976
DSP Blocks (18x18 multipliers) — 768
PLLs — 12
Core Voltage — 0.9 V
Process Node — 65 nm (TSMC)
Paket — 1517-BBGA, FCBGA (FineLine BGA)
Package Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C suffix)
Configuration — SRAM-based, requires external configuration device

Spek dan Sumber

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