EP3SE260F1517C4LN vs EP3SE260F1517C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4LN sa pamamagitan ng Intel at EP3SE260F1517C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1517C4LN EP3SE260F1517C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Series Stratix III E Stratix III E
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
Packhaging / Kaso 1517-BBGA, FCBGA (FC-FBGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount (BGA)
Temperature na Operasyon 0C to +85C (commercial grade per 'C' suffix) —
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 3
Lead-Free / Halogen-Free Yes (LN suffix) —
Tindminan RoHS Compliant Compliant
Manufacturer — Intel (formerly Altera)
Logic Array Blocks (LABs) — 10,200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
User I/Os — 976
DSP Blocks (18x18 multipliers) — 768
PLLs — 12
Core Voltage — 0.9 V
Process Node — 65 nm (TSMC)
Packhaging — 1517-BBGA, FCBGA (FineLine BGA)
Package Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C suffix)
Configuration — SRAM-based, requires external configuration device

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita