EP3SE260F1517C4LN vs EP3SE260F1517C3 比較

詳細並排比較 EP3SE260F1517C4LN 由 Intel 與 EP3SE260F1517C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C4LN EP3SE260F1517C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Series Stratix III E Stratix III E
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
封裝 / 外殼 1517-BBGA, FCBGA (FC-FBGA) —
安裝類型 Surface Mount (flip-chip) Surface Mount (BGA)
工作溫度 0C to +85C (commercial grade per 'C' suffix) —
濕度敏感等級 (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 3
Lead-Free / Halogen-Free Yes (LN suffix) —
RoHS 狀態 Compliant Compliant
Manufacturer — Intel (formerly Altera)
Logic Array Blocks (LABs) — 10,200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
User I/Os — 976
DSP Blocks (18x18 multipliers) — 768
PLLs — 12
Core Voltage — 0.9 V
Process Node — 65 nm (TSMC)
封裝 — 1517-BBGA, FCBGA (FineLine BGA)
Package Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C suffix)
Configuration — SRAM-based, requires external configuration device

資料表與資源

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