EP3SE260H780C3 vs EP3SE260H780I4N Perbandingan
Perbandingan bersamaan detil EP3SE260H780C3 dari Intel dan EP3SE260H780I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C3 | EP3SE260H780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Speed Grade | C3 | — |
| Suhu Kerja | Commercial, 0C to +85C | -40C to +100C (Industrial) |
| Maximum Core Frequency | 500 MHz | — |
| Paket | 780-ball FCBGA (HBGA), flip-chip | 780-pin FC-HFBGA (FCBGA) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Status RoHS | Compliant (per product listings) | Compliant |
| Family | — | Stratix III Enhanced (Stratix III E) |
| Embedded Memory Bits | — | 16,672,768 bits |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |