EP3SE260H780C3 vs EP3SE260H780I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3 sa pamamagitan ng Intel at EP3SE260H780I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3 EP3SE260H780I4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10200 10,200
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 488 488
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Speed Grade C3 —
Temperature na Operasyon Commercial, 0C to +85C -40C to +100C (Industrial)
Maximum Core Frequency 500 MHz —
Packhaging 780-ball FCBGA (HBGA), flip-chip 780-pin FC-HFBGA (FCBGA)
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
Tindminan RoHS Compliant (per product listings) Compliant
Family — Stratix III Enhanced (Stratix III E)
Embedded Memory Bits — 16,672,768 bits
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

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