EP3SE260H780C3 vs EP3SE260H780I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C3 disebabkan oleh Intel dan EP3SE260H780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C3 | EP3SE260H780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Speed Grade | C3 | — |
| Suhu Operasi | Commercial, 0C to +85C | -40C to +100C (Industrial) |
| Maximum Core Frequency | 500 MHz | — |
| Kemasan | 780-ball FCBGA (HBGA), flip-chip | 780-pin FC-HFBGA (FCBGA) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Status RoHS | Compliant (per product listings) | Compliant |
| Family | — | Stratix III Enhanced (Stratix III E) |
| Embedded Memory Bits | — | 16,672,768 bits |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |