EP3SE260H780C3N vs EP3SE260H780C4N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C3N dari Intel dan EP3SE260H780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C3N EP3SE260H780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
Paket 780-BBGA, FCBGA (H780) 780-ball FCBGA (Flip Chip BGA)
Tipe Mounting Surface Mount Surface Mount
Suhu Kerja 0 °C to +85 °C (C grade, commercial) 0C to +85C (commercial)
Process Technology 40 nm CMOS —
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
Status RoHS Compliant (lead-free 'N' suffix) —
Tingkat Sensitivitas Kekeringan (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] 3 (168 hours)
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel Serial/Parallel via Quartus II
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Family — Stratix III E (Enhanced)
Logic Elements — 255,000
Logic Array Blocks (LABs) — 10,200
Total RAM Bits — 16,672,768
Embedded Memory — M9K and M144K blocks
User I/O Pins — 488
DSP Blocks (18x18 Multipliers) — 768
PLLs — 12
Process Node — 65 nm CMOS
Core Voltage — 0.86 V to 1.15 V
Maximum Core Clock Frequency — 450 MHz

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