EP3SE260H780C3N vs EP3SE260H780C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3N sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3N EP3SE260H780C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
Packhaging 780-BBGA, FCBGA (H780) 780-ball FCBGA (Flip Chip BGA)
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon 0 °C to +85 °C (C grade, commercial) 0C to +85C (commercial)
Process Technology 40 nm CMOS —
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
Tindminan RoHS Compliant (lead-free 'N' suffix) —
Level ng Sensitivity sa Asid ng Moisture (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] 3 (168 hours)
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel Serial/Parallel via Quartus II
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Family — Stratix III E (Enhanced)
Logic Elements — 255,000
Logic Array Blocks (LABs) — 10,200
Total RAM Bits — 16,672,768
Embedded Memory — M9K and M144K blocks
User I/O Pins — 488
DSP Blocks (18x18 Multipliers) — 768
PLLs — 12
Process Node — 65 nm CMOS
Core Voltage — 0.86 V to 1.15 V
Maximum Core Clock Frequency — 450 MHz

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